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STTH5R06G-TR

STMicroelectronics

STTH5R06G-TR by STMicroelectronics

STTH5R06G-TR by STMicroelectronics is a high-voltage ultra-fast recovery rectifier diode with a max reverse recovery time of 0.04 µs and can handle up to 600 V. It features a compact surface mount design, ideal for space-constrained applications. Operating at up to 175 °C, it ensures reliability in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,646 parts In-Stock

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4,646

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ComSIT Distribution GmbH

Germany . 4,000 parts In-Stock

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4,000

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ComSIT USA

USA . 4,000 parts In-Stock

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4,000

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Anansix

USA . 1,921 parts In-Stock

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1,921

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Digiode

USA . 1,921 parts In-Stock

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1,921

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 294 parts In-Stock

1+ parts

$0.120

100+ parts

-

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$0.108

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294

$0.120

-

$0.108

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MKK Technologies

India . 1,980 parts In-Stock

1+ parts

$0.225

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1,980

$0.225

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DigiPath Technology Company

USA . 1,980 parts In-Stock

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$0.225

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1,980

$0.225

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AZTECH Wire

Italy . 1,107 parts In-Stock

1+ parts

$10.240

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1,107

$10.240

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Kepictronics

USA . 4,513 parts In-Stock

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4,513

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Corphita

USA . 4,093 parts In-Stock

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4,093

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A-Z Elektronik GmbH

Germany . 1,953 parts In-Stock

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1,953

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Parana Technologies

USA . 55 parts In-Stock

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$0.143

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55

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$0.143

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Perfect Parts

USA . 22 parts In-Stock

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Overview

Unlock superior performance with the STTH5R06G-TR from STMicroelectronics, a leader in semiconductor innovation. Designed for high-voltage applications, this ultra-fast recovery rectifier diode ensures reliability and efficiency, enhancing your electronic designs. With its compact surface-mount package and exceptional thermal stability up to 175 °C, it provides unmatched durability. Elevate your projects with the quality and expertise that only STMicroelectronics can deliver, ensuring you stay ahead in today’s competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and protection from environmental factors, making it suitable for various applications.

Config: SINGLE

The single configuration simplifies circuit design and integration into electronic systems.

Surface Mount: YES

Surface mount technology allows for compact design and efficient PCB space utilization, which is essential in modern electronic devices.

Maximum Reverse Recovery Time: 0.04 µs

A low reverse recovery time contributes to faster switching speeds, enhancing the performance of high-frequency applications.

Package Shape: RECTANGULAR

The rectangular shape is optimized for space efficiency and better thermal management in circuit layouts.

Number of Terminals: 2

The two-terminal design facilitates easy connections, reducing complexity in circuit design.

Package Style (Meter): SMALL OUTLINE

A small outline package allows for more compact PCB designs and is ideal for space-constrained applications.

Application: HIGH VOLTAGE ULTRA FAST RECOVERY

Designed for high voltage applications, this product is an excellent choice for demanding electrical environments.

Maximum Operating Temperature: 175 °C

A high operating temperature rating ensures reliability in extreme conditions, making it suitable for automotive and industrial applications.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides good solderability and enhances the longevity of connections, promoting reliability.

Terminal Position: SINGLE

The single terminal position allows for easy alignment and connection during assembly.

Case Connection: CATHODE

The cathode connection simplifies design for the rectification process in various electronic circuits.

Maximum Time At Peak Reflow Temperature: 30 s

A maximum duration of 30 seconds at peak reflow temperature ensures compatibility with standard soldering processes, promoting ease of manufacturing.

Peak Reflow Temperature: 245 °C

The capability to withstand high reflow temperatures makes this product versatile for different soldering methods.

Diode Type: RECTIFIER DIODE

As a rectifier diode, it is optimized for converting AC to DC, making it essential for power supply applications.

Maximum Forward Voltage (VF): 1.8 V

The low forward voltage drop maximizes efficiency and minimizes heat generation, which is crucial for power-sensitive applications.

Maximum Output Current: 5 A

Supports a robust output current of 5 A, making it suitable for medium-power applications without overheating.

Terminal Form: GULL WING

The gull wing terminal form provides excellent mechanical strength and solderability, ensuring reliable connections.

Maximum Repetitive Peak Reverse Voltage: 600 V

The high reverse voltage rating allows for use in high-power applications, enhancing flexibility in design.

Maximum Non Repetitive Peak Forward Current: 50 A

The capability to handle high non-repetitive peak current makes this diode suitable for various surge protection applications.

Diode Element Material: SILICON

Silicon is a widely used semiconductor material that provides good conductivity and thermal stability, contributing to the overall performance of the diode.

Technical Specifications

Diodes & Rectifiers STTH5R06G-TR attributes and parameters. Explore more Diodes & Rectifiers devices from STMicroelectronics

Specs

Additional Features:

FREE WHEELING DIODE

Application:

HIGH VOLTAGE ULTRA FAST RECOVERY

Case Connection:

CATHODE

Config:

SINGLE

Diode Element Material:

SILICON

Diode Type:

Maximum Forward Voltage (VF):

1.8 V

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Forward Current:

50 A

No. of Elements:

1

No. of Phases:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Maximum Output Current:

5 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Qualification:

Not Qualified

Maximum Repetitive Peak Reverse Voltage:

600 V

Maximum Reverse Recovery Time:

.04 us

Sub-Category:

Rectifier Diodes

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

STTH5R06G-TR Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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