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STTH3002G

STMicroelectronics

STTH3002G by STMicroelectronics

STTH3002G by STMicroelectronics is an ultra-fast recovery rectifier diode with a max reverse recovery time of 0.05 µs and supports up to 30 A output current. It features a compact surface mount design in a rectangular package. Ideal for high-efficiency applications, it operates at temperatures up to 175 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,239 parts In-Stock

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8,239

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Digiode

USA . 4,676 parts In-Stock

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4,676

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Anansix

USA . 2,735 parts In-Stock

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2,735

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Microfarads

USA . 6 parts In-Stock

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6

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Bristol Electronics

USA . 6 parts In-Stock

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6

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,620 parts In-Stock

1+ parts

$0.142

100+ parts

-

1k+ parts

$0.128

10k+ parts

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1,620

$0.142

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$0.128

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MKK Technologies

India . 261 parts In-Stock

1+ parts

$0.266

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261

$0.266

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DigiPath Technology Company

USA . 261 parts In-Stock

1+ parts

$0.266

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261

$0.266

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AZTECH Wire

Italy . 1,023 parts In-Stock

1+ parts

$13.180

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1,023

$13.180

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Corphita

USA . 2,362 parts In-Stock

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2,362

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Parana Technologies

USA . 1,159 parts In-Stock

1+ parts

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$0.169

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1,159

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$0.169

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Overview

Unlock exceptional performance with the STTH3002G from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for ultra-fast recovery applications, this surface-mount rectifier diode ensures reliable operation under demanding conditions, boasting a maximum operating temperature of 175 °C. Its compact design and robust construction make it ideal for various electronic applications, offering customers unmatched efficiency and longevity. Experience the quality you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy as the package body material ensures reliability and protection against environmental factors.

Config: SINGLE

A single configuration simplifies design and integration into various electronic circuits.

Surface Mount: YES

Surface mount capability allows for compact designs and improves the ease of assembly in automated manufacturing.

Maximum Reverse Recovery Time: 0.05 µs

Ultra-fast recovery time minimizes switching losses, making this diode ideal for high-frequency applications.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space utilization on circuit boards.

No. of Terminals: 2

Having two terminals simplifies circuit design and reduces potential points of failure.

Package Style (Meter): SMALL OUTLINE

The small outline package style enables space-saving solutions in compact electronic devices.

Application: ULTRA FAST RECOVERY

Designed for ultra-fast recovery applications, this diode is suitable for power conversion and switching applications.

Maximum Operating Temperature: 175 °C

A high maximum operating temperature allows the diode to be used in demanding environments without performance degradation.

Terminal Finish: MATTE TIN

The matte tin finish provides good solderability and enhances the longevity of the diode.

Terminal Position: SINGLE

Single terminal position simplifies integration into PCB layouts, enhancing design flexibility.

Case Connection: CATHODE

Direct cathode connection design helps streamline circuit configurations and improves thermal management.

Diode Type: RECTIFIER DIODE

As a rectifier diode, it efficiently converts AC to DC, which is essential in power supply applications.

Maximum Forward Voltage (VF): 0.88 V

A low forward voltage drop ensures high efficiency and reduced heat generation during operation.

Maximum Output Current: 30 A

With a maximum output current of 30 A, this diode is suitable for high-load applications, ensuring performance and reliability.

Terminal Form: GULL WING

Gull wing terminal form enhances mechanical stability and improves solder joint strength.

Maximum Repetitive Peak Reverse Voltage: 200 V

A high repetitive peak reverse voltage rating enables use in various voltage applications without risk of breakdown.

Maximum Non-Repetitive Peak Forward Current: 300 A

The ability to handle non-repetitive peak forward current of 300 A makes this diode robust in pulse applications.

Diode Element Material: SILICON

Silicon as the diode element material ensures good conductivity and thermal stability under operational conditions.

Technical Specifications

Diodes & Rectifiers STTH3002G attributes and parameters. Explore more Diodes & Rectifiers devices from STMicroelectronics

Specs

Additional Features:

FREE WHEELING DIODE

Application:

ULTRA FAST RECOVERY

Case Connection:

CATHODE

Config:

SINGLE

Diode Element Material:

SILICON

Diode Type:

Maximum Forward Voltage (VF):

.88 V

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Forward Current:

300 A

No. of Elements:

1

No. of Phases:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Maximum Output Current:

30 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Repetitive Peak Reverse Voltage:

200 V

Maximum Reverse Recovery Time:

.05 us

Sub-Category:

Rectifier Diodes

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

Trade Compliance

STTH3002G Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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