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STPS40L45CG

STMicroelectronics

STPS40L45CG by STMicroelectronics

STPS40L45CG by STMicroelectronics is a Schottky rectifier diode ideal for power applications. It features a max forward voltage of 0.49 V, supports up to 20 A output current, and has a peak reverse voltage of 45 V. Its compact design ensures efficient surface mounting.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,121 parts In-Stock

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5,121

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Chip Stock

USA . 5,050 parts In-Stock

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5,050

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Digiode

USA . 3,816 parts In-Stock

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3,816

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Anansix

USA . 2,870 parts In-Stock

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2,870

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ComSIT Distribution GmbH

Germany . 200 parts In-Stock

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200

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ComSIT USA

USA . 200 parts In-Stock

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200

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Goldney Electronics S.L.

Spain . 24 parts In-Stock

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24

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 306 parts In-Stock

1+ parts

$0.076

100+ parts

-

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$0.069

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306

$0.076

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$0.069

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MKK Technologies

India . 625 parts In-Stock

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$0.144

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625

$0.144

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DigiPath Technology Company

USA . 625 parts In-Stock

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$0.144

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625

$0.144

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Andel Nordic

Denmark . 4,407 parts In-Stock

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$4.193

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$4.025

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$4.025

4,407

$4.193

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$4.025

$4.025

AZTECH Wire

Italy . 777 parts In-Stock

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$11.040

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777

$11.040

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Component Stockers USA

USA . 213 parts In-Stock

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$99.990

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213

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Parana Technologies

USA . 1,515 parts In-Stock

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$0.091

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Perfect Parts

USA . 1,361 parts In-Stock

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Corphita

USA . 1,206 parts In-Stock

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Kepictronics

USA . 1,000 parts In-Stock

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1,000

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RC Electronics

USA . 415 parts In-Stock

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415

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iodParts Technologies Inc.

India . 200 parts In-Stock

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200

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GreenTree Electronics

Israel . 50 parts In-Stock

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Overview

Unlock the power of efficiency with the STPS40L45CG from STMicroelectronics—a trusted leader in semiconductor innovation. This Schottky rectifier diode delivers exceptional performance for your power applications, ensuring minimal energy loss and enhanced reliability. Its compact design allows for easy integration into various systems, making it ideal for everything from consumer electronics to industrial automation. Choose STMicroelectronics for quality you can count on!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection against environmental factors, making it suitable for a variety of applications.

Config: COMMON CATHODE, 2 ELEMENTS

This configuration type allows for simplified integration in circuits, providing convenience in different electronic designs.

Surface Mount: YES

Surface mount capability enables easier assembly and integration into compact circuit designs, enhancing the product's versatility.

Package Shape: RECTANGULAR

The rectangular package shape is designed for efficient space utilization on PCBs, making it easier to incorporate into various layouts.

No. of Terminals: 2

Having two terminals allows for straightforward connections in applications, promoting ease of installation and maintenance.

Package Style (Meter): SMALL OUTLINE

The small outline package style optimizes space on PCBs, which is essential for compact electronic devices.

Application: POWER

Designed for power applications, this diode handles high currents efficiently, providing reliability in demanding environments.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability and corrosion resistance, ensuring stable electrical connections over time.

Terminal Position: SINGLE

A single terminal position simplifies PCB layout, making it easier for designers to place and route components effectively.

Case Connection: CATHODE

The cathode connection type supports common circuit configurations, facilitating seamless integration into existing designs.

Diode Type: RECTIFIER DIODE

As a rectifier diode, this product efficiently converts AC to DC, making it ideal for power supply circuits.

Maximum Forward Voltage (VF): 0.49 V

A low forward voltage of 0.49 V ensures minimal power loss during operation, improving overall energy efficiency.

Maximum Output Current: 20 A

Supporting a maximum output current of 20 A, this diode is suitable for high-power applications, ensuring reliable performance.

Technology: SCHOTTKY

Schottky technology allows for fast switching speeds and reduced voltage drop, leading to efficient operation in high-frequency applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and improve the mechanical strength of connections, enhancing reliability.

No. of Elements: 2

With two elements, this diode can effectively handle higher currents and voltage, providing robust performance in various circuits.

Maximum Repetitive Peak Reverse Voltage: 45 V

A peak reverse voltage rating of 45 V ensures that the diode can withstand significant reverse stress, enhancing its durability.

Maximum Non Repetitive Peak Forward Current: 230 A

This high peak forward current rating of 230 A indicates the diode's ability to handle sudden surges, protecting your circuits.

Diode Element Material: SILICON

Silicon as the diode element material provides excellent electrical properties and robustness, ensuring long-term reliability in various applications.

Technical Specifications

Diodes & Rectifiers STPS40L45CG attributes and parameters. Explore more Diodes & Rectifiers devices from STMicroelectronics

Specs

Additional Features:

FREE WHEELING DIODE

Application:

POWER

Case Connection:

CATHODE

Config:

COMMON CATHODE, 2 ELEMENTS

Diode Element Material:

SILICON

Diode Type:

Maximum Forward Voltage (VF):

.49 V

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Forward Current:

230 A

No. of Elements:

2

No. of Phases:

1

No. of Terminals:

2

Maximum Output Current:

20 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Repetitive Peak Reverse Voltage:

45 V

Sub-Category:

Rectifier Diodes

Surface Mount:

YES

Technology:

SCHOTTKY

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

Trade Compliance

STPS40L45CG Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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