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STPS30M60CG-TR

STMicroelectronics

STPS30M60CG-TR by STMicroelectronics

STMicroelectronics' STPS30M60CG-TR is a Schottky rectifier diode with 60V peak reverse voltage, 15A output current, and 0.59V forward voltage. Common cathode configuration with 2 elements in small outline package makes it ideal for efficiency applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 11,571 parts In-Stock

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Digiode

USA . 4,126 parts In-Stock

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Anansix

USA . 2,709 parts In-Stock

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IDEA Electronic Components Group

UK . 418 parts In-Stock

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$0.096

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-

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$0.086

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418

$0.096

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$0.086

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MKK Technologies

India . 293 parts In-Stock

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$0.180

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293

$0.180

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DigiPath Technology Company

USA . 293 parts In-Stock

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$0.180

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293

$0.180

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AZTECH Wire

Italy . 966 parts In-Stock

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$19.250

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Component Stockers USA

USA . 550 parts In-Stock

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$99.990

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550

$99.990

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Parana Technologies

USA . 923 parts In-Stock

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$0.114

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Corphita

USA . 501 parts In-Stock

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Perfect Parts

USA . 423 parts In-Stock

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Overview

Enhance your efficiency with the STPS30M60CG-TR by STMicroelectronics. As a leading manufacturer in diodes & rectifiers, STMicroelectronics delivers top-quality products that guarantee peak performance. This common cathode, 2-element diode offers a maximum output current of 15A and a maximum repetitive peak reverse voltage of 60V, making it ideal for a variety of applications. With a matte tin terminal finish and gull wing terminal form, this Schottky technology diode provides reliable and consistent results. Trust STMicroelectronics to deliver value and reliability in every product, ensuring you get the best in performance and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the diodes, making them suitable for a variety of applications.

Config: COMMON CATHODE, 2 ELEMENTS

Common cathode configuration allows for easy circuit design and integration, while having 2 elements increases efficiency.

Surface Mount: YES

Surface mounting makes installation easier and saves space on the PCB, ideal for compact electronic devices.

Maximum Reverse Current: 80 uA

Low reverse current ensures minimal power loss and high efficiency in the circuit.

Package Shape: RECTANGULAR

Rectangular shape allows for easy placement and organization of multiple diodes on the PCB.

No. of Terminals: 2

Having only 2 terminals simplifies the connection process and reduces the chances of installation errors.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and is suitable for compact electronic designs.

Application: EFFICIENCY

Designed for efficiency, making them ideal for applications where power consumption is a critical factor.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and ensures reliable electrical connections.

Terminal Position: SINGLE

Single terminal position simplifies the installation process and reduces the risk of wiring mistakes.

Case Connection: CATHODE

Cathode case connection provides a common reference point for the diodes in the circuit, simplifying circuit design.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand high reflow temperatures for up to 30 seconds, ensuring reliable performance during soldering.

Peak Reflow Temperature °C: 245

High peak reflow temperature tolerance ensures the diodes can withstand the soldering process without damage.

Diode Type: RECTIFIER DIODE

Rectifier diodes are designed for converting AC to DC, making them suitable for a wide range of power supply applications.

Maximum Forward Voltage (VF): 0.59 V

Low forward voltage drop minimizes power loss and improves overall efficiency of the circuit.

Maximum Output Current: 15 A

High output current rating allows the diodes to handle large amounts of current without overheating or failing.

Technology: SCHOTTKY

Schottky diodes have lower forward voltage drop and faster switching speeds compared to conventional diodes, improving circuit efficiency.

Terminal Form: GULL WING

Gull wing terminal form is ideal for surface mounting, providing secure connections and easy soldering.

No. of Elements: 2

Having 2 elements increases efficiency and allows for more complex circuit configurations.

Maximum Repetitive Peak Reverse Voltage: 60 V

High reverse voltage rating ensures the diodes can handle voltage spikes and surges without damage.

Maximum Non Repetitive Peak Forward Current: 400 A

High peak forward current rating allows the diodes to handle brief surges of current without failing.

Diode Element Material: SILICON

Silicon material provides reliable performance and durability for the diodes, ensuring long-term stability.

Technical Specifications

Diodes & Rectifiers STPS30M60CG-TR attributes and parameters. Explore more Diodes & Rectifiers devices from STMicroelectronics

Specs

Application:

EFFICIENCY

Case Connection:

CATHODE

Config:

COMMON CATHODE, 2 ELEMENTS

Diode Element Material:

SILICON

Diode Type:

Maximum Forward Voltage (VF):

.59 V

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Forward Current:

400 A

No. of Elements:

2

No. of Phases:

1

No. of Terminals:

2

Maximum Output Current:

15 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Maximum Repetitive Peak Reverse Voltage:

60 V

Maximum Reverse Current:

80 uA

Sub-Category:

Rectifier Diodes

Surface Mount:

YES

Technology:

SCHOTTKY

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

STPS30M60CG-TR Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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