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STPS20SM100SR

STMicroelectronics

STPS20SM100SR by STMicroelectronics

STPS20SM100SR by STMicroelectronics is a Schottky rectifier diode designed for high efficiency applications. It features a max output current of 20 A, a forward voltage drop of just 0.62 V, and operates up to 150 °C. Ideal for power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,419 parts In-Stock

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R&J Components

USA . 2,000 parts In-Stock

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2,000

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Anansix

USA . 1,730 parts In-Stock

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1,730

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Digiode

USA . 458 parts In-Stock

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PC Components Company LLC

USA . 27 parts In-Stock

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Bristol Electronics

USA . 27 parts In-Stock

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IDEA Electronic Components Group

UK . 1,557 parts In-Stock

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$0.110

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$0.099

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1,557

$0.110

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$0.099

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MKK Technologies

India . 665 parts In-Stock

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$0.208

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665

$0.208

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DigiPath Technology Company

USA . 665 parts In-Stock

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$0.208

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665

$0.208

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AZTECH Wire

Italy . 806 parts In-Stock

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$12.340

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806

$12.340

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Perfect Parts

USA . 8,401 parts In-Stock

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Corphita

USA . 3,266 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,025 parts In-Stock

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Parana Technologies

USA . 2,200 parts In-Stock

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$0.132

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2,200

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$0.132

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Overview

Elevate your designs with the STPS20SM100SR from STMicroelectronics, a cutting-edge Schottky rectifier diode that promises exceptional efficiency and outstanding performance. Renowned for its steadfast quality, STMicroelectronics ensures reliable solutions that empower applications ranging from power management to renewable energy systems. With a sleek in-line package and superior thermal handling, this diode maximizes functionality while minimizing losses—offering you unmatched value and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material ensures durability and resistance to environmental factors, making the diode reliable for various applications.

Config: SINGLE

A single configuration simplifies integration into circuits, suitable for applications that require minimal space without compromising performance.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient packaging and space optimization on circuit boards.

No. of Terminals: 3

With three terminals, the design offers versatile connectivity options, enhancing compatibility with different circuit designs.

Package Style (Meter): IN-LINE

The in-line package style aids in straightforward assembly and positioning in circuit layouts.

Application: EFFICIENCY

Designed for efficiency, this diode minimizes power loss, making it ideal for energy-sensitive applications.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature rating allows the diode to perform reliably in demanding environments.

Terminal Position: SINGLE

Having a single terminal position facilitates easy mounting and reduces potential assembly errors.

Case Connection: CATHODE

The cathode connection is straightforward for installation, ensuring proper functioning in rectification processes.

Diode Type: RECTIFIER DIODE

Being a rectifier diode makes it excellent for converting AC to DC, which is essential in many electronic circuits.

Maximum Forward Voltage (VF): 0.62 V

The low forward voltage drop minimizes energy loss and improves overall circuit efficiency.

Maximum Output Current: 20 A

A high output current capacity of 20 A supports demanding applications and ensures robust performance.

Technology: SCHOTTKY

Schottky technology allows for faster switching and lower voltage drop, making it ideal for high-frequency applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical stability and make soldering easier compared to other forms.

Maximum Repetitive Peak Reverse Voltage: 100 V

A peak reverse voltage of 100 V ensures reliability under high voltage conditions, providing safety margins in critical applications.

Maximum Non Repetitive Peak Forward Current: 350 A

The ability to handle high non-repetitive forward currents allows the diode to withstand inrush currents without damage.

Diode Element Material: SILICON

Silicon as a diode element ensures stability, reliability, and effectiveness in various operating conditions.

Technical Specifications

Diodes & Rectifiers STPS20SM100SR attributes and parameters. Explore more Diodes & Rectifiers devices from STMicroelectronics

Specs

Application:

EFFICIENCY

Case Connection:

CATHODE

Config:

SINGLE

Diode Element Material:

SILICON

Diode Type:

Maximum Forward Voltage (VF):

.62 V

JESD-30 Code:

R-PSIP-T3

Maximum Non Repetitive Peak Forward Current:

350 A

No. of Elements:

1

No. of Phases:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Maximum Output Current:

20 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Repetitive Peak Reverse Voltage:

100 V

Sub-Category:

Rectifier Diodes

Surface Mount:

NO

Technology:

SCHOTTKY

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

STPS20SM100SR Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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