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STPS1645D

STMicroelectronics

STPS1645D by STMicroelectronics

STPS1645D by STMicroelectronics is a Schottky rectifier diode ideal for power applications. It features a max output current of 16 A, a forward voltage drop of 0.57 V, and operates up to 175 °C. Its flange mount design ensures reliable performance in various circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,696 parts In-Stock

1+ parts

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7,696

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Lakeland Logistics Inc

USA . 2,000 parts In-Stock

1+ parts

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2,000

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Bristol Electronics

USA . 2,000 parts In-Stock

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2,000

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Digiode

USA . 1,686 parts In-Stock

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1,686

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Anansix

USA . 897 parts In-Stock

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897

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,084 parts In-Stock

1+ parts

$0.110

100+ parts

-

1k+ parts

$0.099

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1,084

$0.110

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$0.099

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MKK Technologies

India . 1,168 parts In-Stock

1+ parts

$0.208

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1,168

$0.208

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DigiPath Technology Company

USA . 1,168 parts In-Stock

1+ parts

$0.208

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1,168

$0.208

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AZTECH Wire

Italy . 698 parts In-Stock

1+ parts

$16.930

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698

$16.930

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Parana Technologies

USA . 1,459 parts In-Stock

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$0.132

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1,459

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$0.132

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Corphita

USA . 739 parts In-Stock

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739

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Overview

Unlock superior performance with the STPS1645D Schottky rectifier diode from STMicroelectronics. Renowned for their quality and innovation, STMicroelectronics delivers this robust component designed for power applications, ensuring efficiency and reliability in demanding environments. With a high temperature tolerance and impressive current capabilities, the STPS1645D enhances system longevity while minimizing energy loss—ideal for modern electronics. Trust in STMicroelectronics to power your next project with unmatched value and performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body provides durability and resistance to environmental factors, making the diode reliable for long-term applications.

Config: SINGLE

A single configuration simplifies circuit design and integration, allowing for easier assembly and maintenance.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on PCBs, making it suitable for compact electronic systems.

No. of Terminals: 2

Having two terminals makes the diode straightforward to interface with circuits, facilitating easy connectivity.

Package Style (Meter): FLANGE MOUNT

Flange mount style ensures secure and stable mounting on boards or heatsinks, reducing the risk of mechanical failure.

Application: POWER

Designed specifically for power applications, this diode can handle significant loads, making it ideal for high-performance power management.

Maximum Operating Temperature: 175 °C

A high operating temperature ensures reliability in harsh environments, allowing the diode to perform well in challenging conditions.

Terminal Finish: MATTE TIN

Matte tin terminal finish offers excellent solderability and corrosion resistance, enhancing the overall longevity of the component.

Terminal Position: SINGLE

Having a single terminal position simplifies circuit integration and reduces potential errors during the assembly.

Diode Type: RECTIFIER DIODE

As a rectifier diode, this component is optimized for converting AC to DC, essential for many power supply applications.

Maximum Forward Voltage (VF): 0.57 V

A low forward voltage drop increases efficiency, especially in power applications, minimizing energy loss during operation.

Maximum Output Current: 16 A

With a maximum output current of 16 A, this diode can support high-load conditions, making it suitable for a variety of power applications.

Technology: SCHOTTKY

Schottky technology provides fast switching speeds and low forward voltage, improving overall circuit efficiency and performance.

Terminal Form: THROUGH-HOLE

Through-hole terminal form ensures robust mechanical stability and ease of installation in PCB designs.

Maximum Repetitive Peak Reverse Voltage: 45 V

A high peak reverse voltage rating enables the diode to handle varying input conditions without failure, ensuring reliability in applications.

Maximum Non Repetitive Peak Forward Current: 220 A

The ability to withstand high non-repetitive peak currents enhances the diode's capability in surge conditions, providing protection and stability.

Diode Element Material: SILICON

Silicon as the diode element material offers excellent electrical properties and is widely used, ensuring compatibility with existing technologies.

Technical Specifications

Diodes & Rectifiers STPS1645D attributes and parameters. Explore more Diodes & Rectifiers devices from STMicroelectronics

Specs

Additional Features:

FREE-WHEELING DIODE

Application:

POWER

Config:

SINGLE

Diode Element Material:

SILICON

Diode Type:

Maximum Forward Voltage (VF):

.57 V

JEDEC-95 Code:

TO-220AC

JESD-30 Code:

R-PSFM-T2

JESD-609 Code:

e3

Maximum Non Repetitive Peak Forward Current:

220 A

No. of Elements:

1

No. of Phases:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Maximum Output Current:

16 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Qualification:

Not Qualified

Maximum Repetitive Peak Reverse Voltage:

45 V

Sub-Category:

Rectifier Diodes

Surface Mount:

NO

Technology:

SCHOTTKY

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

Trade Compliance

STPS1645D Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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