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STPM13ATR

STMicroelectronics

STPM13ATR by STMicroelectronics

STPM13ATR by STMicroelectronics is a versatile analog circuit IC designed for industrial applications. It operates at a nominal voltage of 5V, with a max temp of 85 °C and features a compact 20-terminal gull-wing package. Ideal for surface mount technology, it ensures reliable performance in various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,368 parts In-Stock

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8,368

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Digiode

USA . 3,205 parts In-Stock

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3,205

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Anansix

USA . 245 parts In-Stock

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245

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Distributors (Availability)

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Microchip USA

USA . 139 parts In-Stock

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$9.634

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139

$9.634

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IDEA Electronic Components Group

UK . 1,630 parts In-Stock

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$15.555

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-

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$14.000

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1,630

$15.555

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$14.000

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AZTECH Wire

Italy . 980 parts In-Stock

1+ parts

$17.330

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980

$17.330

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MKK Technologies

India . 444 parts In-Stock

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$29.251

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444

$29.251

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DigiPath Technology Company

USA . 444 parts In-Stock

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$29.251

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444

$29.251

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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15,000

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Kepictronics

USA . 9,990 parts In-Stock

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9,990

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Perfect Parts

USA . 5,600 parts In-Stock

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5,600

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Parana Technologies

USA . 1,997 parts In-Stock

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$18.599

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1,997

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$18.599

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Corphita

USA . 675 parts In-Stock

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675

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Overview

Elevate your designs with the STPM13ATR from STMicroelectronics, a leading name in semiconductor innovation. This compact and robust analog circuit delivers exceptional performance across diverse applications, ensuring reliability in industrial environments. With its advanced materials and superior thermal stability, it empowers engineers to create efficient, high-quality products that stand the test of time. Trust in STMicroelectronics for unparalleled quality and value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making this semiconductor suitable for a variety of applications.

Surface Mount: YES

Being surface mount technology (SMT) saves board space and allows for automated assembly, enhancing manufacturing efficiency.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on PCB layouts and improves thermal performance.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage is standard for many applications, providing compatibility and ease of integration.

Power Supplies: 5

This semiconductor requires a straightforward 5V power supply, facilitating simple circuit design.

No. of Terminals: 20

With 20 terminals, this product offers ample connectivity options for complex circuit designs.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile and small outline make it ideal for compact devices, saving valuable space in portable applications.

Maximum Operating Temperature: 85 °C

The ability to operate at temperatures up to 85 °C enhances reliability in industrial environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product ensures functionality in extreme weather conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish offers excellent corrosion resistance and enhanced electrical performance.

Terminal Position: DUAL

Dual terminal positions facilitate better routing on PCBs, improving design flexibility.

Maximum Seated Height: 1.2 mm

A maximum seated height of 1.2 mm supports low-profile designs, making it ideal for modern electronics.

Width: 4.4 mm

The compact width is beneficial for space-constrained applications, providing more design options.

Other IC type: ANALOG CIRCUIT

As an analog circuit IC, it is suitable for applications requiring precise signal processing, adding versatility to designs.

Minimum Supply Voltage: 3 V

The lower minimum supply voltage of 3V expands its usability in low-power applications.

Maximum Time At Peak Reflow Temperature: 40 s

A maximum reflow time of 40 seconds indicates good thermal resistance during soldering processes.

Peak Reflow Temperature: 260 °C

The high peak reflow temperature ensures compatibility with advanced soldering techniques.

Length: 6.5 mm

With a compact length of 6.5 mm, this product fits well in space-limited environments.

Temperature Grade: INDUSTRIAL

Designed for industrial use, this semiconductor is built to withstand harsh operating conditions.

Maximum Supply Current: 6 mA

The low maximum supply current of 6 mA contributes to the energy efficiency of the device.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and enhance mechanical stability on PCBs.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch allows for higher density layouts while maintaining manufacturability.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates a moderate moisture sensitivity, requiring proper handling to ensure reliability.

Maximum Supply Voltage: 5.5 V

Supporting a maximum supply voltage of 5.5V makes it versatile and adaptable for various voltage applications.

Technical Specifications

Other Function Semiconductors STPM13ATR attributes and parameters. Explore more Other Function Semiconductors devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Analog ICs

Maximum Supply Current (Isup):

6 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

4.4 mm

Trade Compliance

STPM13ATR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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