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STP110N55F6

STMicroelectronics

STP110N55F6 by STMicroelectronics

STMicroelectronics' STP110N55F6 is a single N-channel Power FET with 110A max drain current and 150W power dissipation. Utilizes metal-oxide semiconductor tech, operates up to 175 °C. Ideal for high-power applications requiring efficient switching capabilities.

Median Price

$1.400

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 413 parts In-Stock

1+ parts

$2.980

100+ parts

$1.357

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-

10k+ parts

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413

$2.980

$1.357

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Chip1Stop

Japan . 50 parts In-Stock

1+ parts

-

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$1.120

1k+ parts

$1.120

10k+ parts

$1.120

50

-

$1.120

$1.120

$1.120

Verical

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$1.400

1k+ parts

$1.400

10k+ parts

$1.400

50

-

$1.400

$1.400

$1.400

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,565 parts In-Stock

1+ parts

$3.334

100+ parts

-

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2,565

$3.334

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Vyrian

USA . 8,486 parts In-Stock

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8,486

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Anansix

USA . 1,886 parts In-Stock

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1,886

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,867 parts In-Stock

1+ parts

$1.703

100+ parts

-

1k+ parts

$1.533

10k+ parts

-

1,867

$1.703

-

$1.533

-

Corphita

USA . 4,311 parts In-Stock

1+ parts

$3.159

100+ parts

-

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4,311

$3.159

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MKK Technologies

India . 1,158 parts In-Stock

1+ parts

$3.202

100+ parts

-

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1,158

$3.202

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DigiPath Technology Company

USA . 1,158 parts In-Stock

1+ parts

$3.202

100+ parts

-

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1,158

$3.202

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Andel Nordic

Denmark . 3,760 parts In-Stock

1+ parts

$7.799

100+ parts

-

1k+ parts

$7.487

10k+ parts

$7.487

3,760

$7.799

-

$7.487

$7.487

Microchip USA

USA . 114 parts In-Stock

1+ parts

$17.355

100+ parts

-

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114

$17.355

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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RC Electronics

USA . 7,830 parts In-Stock

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7,830

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Alle Elektronik GmbH

Germany . 3,487 parts In-Stock

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3,487

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Parana Technologies

USA . 1,721 parts In-Stock

1+ parts

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100+ parts

$2.036

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1,721

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$2.036

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Perfect Parts

USA . 1,660 parts In-Stock

1+ parts

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1,660

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Kepictronics

USA . 100 parts In-Stock

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100

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Component Stockers USA

USA . 40 parts In-Stock

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40

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Overview

Elevate your power management with the STP110N55F6 by STMicroelectronics. Crafted with precision and expertise, this N-CHANNEL Power Field Effect Transistor offers unparalleled performance and reliability. Ideal for a variety of applications, this single configuration transistor boasts a maximum drain current of 110A and a power dissipation of 150W. Trust in the advanced technology of METAL-OXIDE SEMICONDUCTOR to deliver efficient power control even in high-temperature environments up to 175 °C. Experience the value and benefits of STMicroelectronics' innovation with the STP110N55F6 - where quality meets excellence.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are known for their efficiency and low RDS(on) values, making them ideal for high-performance applications.

Configuration: SINGLE

Single configuration allows for simple circuit design and easy integration into existing systems.

Maximum Drain Current (Abs): 110 A

High maximum drain current rating ensures the FET can handle heavy loads without overheating or failing.

Maximum Power Dissipation (Abs): 150 W

With a high power dissipation rating, this FET can handle high power levels while maintaining stability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-Oxide Semiconductor technology offers high efficiency and fast switching speeds, making this FET suitable for a wide range of applications.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature allows this FET to operate reliably in demanding environments without thermal issues.

Terminal Finish: Matte Tin (Sn)

Matte Tin terminal finish provides good solderability and ensures a reliable electrical connection, increasing the durability of the FET.

Maximum Drain Current (ID): 110 A

High maximum drain current rating ensures the FET can handle heavy loads without overheating or failing.

Technical Specifications

Power Field Effect Transistors (FET) STP110N55F6 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

110 A

Maximum Drain Current (ID):

110 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

No. of Elements:

1

Maximum Operating Temperature:

175 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Trade Compliance

STP110N55F6 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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