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STOD2540PUR

STMicroelectronics

STOD2540PUR by STMicroelectronics

STOD2540PUR by STMicroelectronics is a compact switching regulator with a 3.3/5V power supply, supporting up to 1.2A output current. It operates in extreme temps from -40 °C to 85 °C and features a very thin profile for space-constrained applications. Ideal for industrial use, it employs pulse frequency modulation for efficient performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 12,970 parts In-Stock

1+ parts

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12,970

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Digiode

USA . 3,825 parts In-Stock

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3,825

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Anansix

USA . 1,635 parts In-Stock

1+ parts

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1,635

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 312 parts In-Stock

1+ parts

$8.319

100+ parts

-

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312

$8.319

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IDEA Electronic Components Group

UK . 1,623 parts In-Stock

1+ parts

$14.956

100+ parts

-

1k+ parts

$13.460

10k+ parts

-

1,623

$14.956

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$13.460

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AZTECH Wire

Italy . 972 parts In-Stock

1+ parts

$21.420

100+ parts

-

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972

$21.420

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MKK Technologies

India . 1,646 parts In-Stock

1+ parts

$28.123

100+ parts

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1,646

$28.123

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DigiPath Technology Company

USA . 1,646 parts In-Stock

1+ parts

$28.123

100+ parts

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1,646

$28.123

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QUARKTWIN TECHNOLOGY LTD

USA . 22,605 parts In-Stock

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22,605

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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10,000

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RC Electronics

USA . 3,390 parts In-Stock

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3,390

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Parana Technologies

USA . 1,644 parts In-Stock

1+ parts

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100+ parts

$17.882

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1,644

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$17.882

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Perfect Parts

USA . 1,408 parts In-Stock

1+ parts

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1,408

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Corphita

USA . 824 parts In-Stock

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824

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Overview

Unlock unparalleled efficiency with the STOD2540PUR from STMicroelectronics! This state-of-the-art switching regulator promises exceptional performance across a wide range of applications, from industrial automation to consumer electronics. Designed for durability and reliability in extreme conditions, it ensures your projects maintain optimal power supply with minimal energy loss. Experience quality you can trust from a leader in innovation, enhancing your designs with both value and peace of mind.

Feature Benefit Bullets

Surface Mount: YES

This surface mount design simplifies PCB assembly and saves space, making it ideal for compact applications.

Package Shape: SQUARE

The square package shape optimizes space utilization on the PCB, allowing for efficient layout in dense designs.

Power Supplies (V): 3.3/5

Supports versatile applications by accommodating standard power supply voltages, enhancing compatibility.

No. of Terminals: 8

With 8 terminals, this device provides sufficient connectivity for various configuration options and features.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile and heat sink/slug design ensure optimal thermal management and reliability in compact spaces.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows the regulator to perform reliably in demanding environments.

Minimum Operating Temperature: -40 °C

This wide temperature range makes the product suitable for industrial and automotive applications in harsh conditions.

Terminal Position: QUAD

The quad terminal position facilitates easier routing on PCBs, improving design flexibility.

Maximum Seated Height: 1 mm

A low seated height enhances application effectiveness in tight spaces while maintaining performance.

Width (mm): 3 mm

A compact width of 3 mm enables integration into space-constrained designs without compromising functionality.

Other IC type: SWITCHING REGULATOR

Switching regulator technology provides higher efficiency and lower heat generation, improving overall system performance.

Nominal Input Voltage: 3.6 V

The nominal input voltage allows for efficient operation with commonly used supply voltages in various applications.

Length: 3 mm

Compact length ensures minimal interference with other components and simpler design layout.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, ensuring reliability and durability in challenging environments.

Maximum Supply Current (Isup): 1.2 mA

Low supply current helps to extend battery life in portable applications, making it energy-efficient.

Maximum Output Current: 1.2 A

Offers a significant output current capability, suitable for powering a range of devices and applications.

Terminal Form: NO LEAD

No lead design minimizes environmental impact and maximizes compatibility with modern PCB manufacturing techniques.

Control Technique: PULSE FREQUENCY MODULATION

This advanced control technique enhances efficiency and response time in power regulation.

Switcher Config: BOOST

The boost configuration enables stepping up voltage to required levels, broadening application scenarios.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for denser layouts, maximizing PCB real estate usage.

Minimum Input Voltage: 3 V

The low minimum input voltage enhances design flexibility for a wider range of battery and power supply options.

Nominal Output Voltage: 25 V

Delivers a nominal output voltage of 25 V, suitable for powering higher voltage loads efficiently.

Maximum Input Voltage: 5.5 V

The high maximum input voltage provides flexibility in power supply choices, supporting various applications.

Technical Specifications

Switching Regulators & Controllers STOD2540PUR attributes and parameters. Explore more Switching Regulators & Controllers devices from STMicroelectronics

Specs

Other IC type:

Control Technique:

PULSE FREQUENCY MODULATION

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

3 V

Nominal Input Voltage:

3.6 V

JESD-30 Code:

S-XQCC-N8

Length:

3 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

1.2 A

Nominal Output Voltage:

25 V

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC8,.12,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

1.2 mA

Surface Mount:

YES

Switcher Config:

BOOST

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3 mm

Trade Compliance

STOD2540PUR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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