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STMUX3040QTTR

STMicroelectronics

STMUX3040QTTR by STMicroelectronics

STMUX3040QTTR by STMicroelectronics is an 8-function multiplexer with a nominal voltage of 1.8V and operates in extreme temperatures from -40 °C to 85°C. It features a max on-state resistance of just 8Ω, ensuring efficient signal switching. Ideal for industrial applications, it comes in a compact chip carrier package with no lead terminals.

Median Price

$1.733

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,408 parts In-Stock

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4,408

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Lakeland Logistics Inc

USA . 2,500 parts In-Stock

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2,500

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Bristol Electronics

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

$1.733

1k+ parts

$1.522

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-

2,500

-

$1.733

$1.522

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Digiode

USA . 2,263 parts In-Stock

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2,263

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Anansix

USA . 1,794 parts In-Stock

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1,794

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Distributors (Availability)

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Microchip USA

USA . 456 parts In-Stock

1+ parts

$7.653

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456

$7.653

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IDEA Electronic Components Group

UK . 633 parts In-Stock

1+ parts

$9.712

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-

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$8.740

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633

$9.712

-

$8.740

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AZTECH Wire

Italy . 851 parts In-Stock

1+ parts

$11.730

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851

$11.730

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MKK Technologies

India . 1,094 parts In-Stock

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$18.262

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1,094

$18.262

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DigiPath Technology Company

USA . 1,094 parts In-Stock

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$18.262

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1,094

$18.262

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A-Z Elektronik GmbH

Germany . 6,945 parts In-Stock

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6,945

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Corphita

USA . 2,974 parts In-Stock

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2,974

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Parana Technologies

USA . 2,366 parts In-Stock

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$11.612

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2,366

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$11.612

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Kepictronics

USA . 1,598 parts In-Stock

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1,598

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Overview

Unlock unparalleled performance with the STMUX3040QTTR from STMicroelectronics! This advanced multiplexer delivers exceptional quality and reliability, perfect for industrial applications. With its robust design, it operates seamlessly across a wide temperature range, ensuring durability in demanding environments. Trust STMicroelectronics' legacy of innovation to enhance your projects, providing you with efficiency and precision that translates into real-world success.

Feature Benefit Bullets

Surface Mount: YES

Being a surface mount device allows for easier integration into compact circuit designs, saving space on PCBs.

No. of Functions: 8

With 8 functions, this multiplexer offers high versatility, enabling various signal routing options in a single package.

Package Shape: RECTANGULAR

The rectangular package shape can provide better layout flexibility on the board while optimizing space utilization.

Nominal Supply Voltage (Vsup): 1.8 V

A low nominal supply voltage of 1.8 V is ideal for power-sensitive applications, helping to minimize energy consumption.

Power Supplies (V): 1.8

Supports standard 1.8 V power supply, making it compatible with low-voltage digital circuits.

No. of Terminals: 42

With 42 terminals, this device offers comprehensive connectivity options for complex circuit designs.

Package Style (Meter): CHIP CARRIER

The chip carrier style provides efficient thermal and electrical performance, beneficial for high-density applications.

Maximum Operating Temperature: 85 °C

Rated for a maximum operating temperature of 85 °C, ensuring reliable performance in many industrial environments.

Minimum Operating Temperature: -40 °C

Operating down to -40 °C expands its usability in extreme conditions, suitable for diverse applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish enhances solderability and offers better corrosion resistance for improved durability.

Terminal Position: QUAD

Quad terminal positioning allows for efficient layout and routing, accommodating various PCB designs.

Output (V): SEPARATE OUTPUT

Separate output design enables independent signal paths, reducing crosstalk and improving overall performance.

Other IC type: SPDT

As a Single Pole Double Throw (SPDT) switch, it provides a simple method for routing signals between two circuits.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum 30 seconds at peak reflow temperature ensures compatibility with modern assembly processes without damaging the device.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260 °C guarantees resilience during soldering while ensuring effective bonding.

Maximum On-state Resistance (Ron): 8 ohm

An on-state resistance of 8 ohms reduces power loss in signal paths, enhancing efficiency in signal transmission.

Temperature Grade: INDUSTRIAL

Designed with industrial temperature grade specifications, this multiplexer is suited for demanding applications requiring reliability.

Terminal Form: NO LEAD

No Lead design contributes to a compact footprint and allows for advanced packaging technologies that aid in thermal performance.

Terminal Pitch: 0.5 mm

A fine terminal pitch of 0.5 mm is ideal for high-density applications where space is at a premium.

Switching (V): BREAK-BEFORE-MAKE

The break-before-make switching characteristic minimizes signal interference during transitions, improving reliability.

Technical Specifications

Multiplexers & Switches STMUX3040QTTR attributes and parameters. Explore more Multiplexers & Switches devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-XQCC-N42

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Functions:

8

No. of Terminals:

42

Maximum On-state Resistance (Ron):

8 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC42,.14X.35,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8

Qualification:

Not Qualified

Sub-Category:

Multiplexer or Switches

Nominal Supply Voltage (Vsup):

1.8 V

Surface Mount:

YES

Switching (V):

BREAK-BEFORE-MAKE

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

STMUX3040QTTR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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