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STMPE812BJR

STMicroelectronics

STMPE812BJR by STMicroelectronics

STMPE812BJR by STMicroelectronics is a consumer IC designed for industrial applications, operating b/w -40 °C and 85 °C. It features a compact 12-terminal grid array with a very thin profile and supports power supplies of 1.8V to 3.3V. Ideal for space-constrained designs, it ensures reliable performance in various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,291 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,291

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-

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Digiode

USA . 3,431 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,431

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Anansix

USA . 1,317 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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1,317

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,196 parts In-Stock

1+ parts

$2.752

100+ parts

-

1k+ parts

$2.477

10k+ parts

-

2,196

$2.752

-

$2.477

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MKK Technologies

India . 1,456 parts In-Stock

1+ parts

$5.174

100+ parts

-

1k+ parts

-

10k+ parts

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1,456

$5.174

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DigiPath Technology Company

USA . 1,456 parts In-Stock

1+ parts

$5.174

100+ parts

-

1k+ parts

-

10k+ parts

-

1,456

$5.174

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-

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Corphita

USA . 3,297 parts In-Stock

1+ parts

-

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3,297

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Parana Technologies

USA . 316 parts In-Stock

1+ parts

-

100+ parts

$3.290

1k+ parts

-

10k+ parts

-

316

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$3.290

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Overview

Unlock the potential of your designs with the STMPE812BJR from STMicroelectronics, a leader in innovative semiconductor solutions. This high-quality consumer IC delivers exceptional performance and reliability across a variety of applications, from smart home devices to industrial controls. Its compact, low-profile design ensures seamless integration, while robust temperature ratings promise longevity in demanding environments. Elevate your project with this versatile chip, crafted for excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making the IC suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of circuit board space, ideal for modern electronics.

Package Shape: RECTANGULAR

The rectangular package shape optimizes PCB layout and simplifies integration into existing designs.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, ensuring reliability and performance in everyday devices.

Power Supplies (V): 1.8/3.3

Dual voltage supply options provide flexibility in design and compatibility with various systems.

No. of Terminals: 12

Having 12 terminals allows for greater connectivity options, enabling complex functionalities within a small package.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The very thin profile and fine pitch design are key for modern space-constrained applications, making it easy to achieve high-density layouts.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC is suitable for a wide range of environments, enhancing its usability.

Minimum Operating Temperature: -40 °C

Operating correctly at a minimum of -40 °C makes this IC ideal for use in extreme conditions, ensuring reliable performance.

Terminal Position: BOTTOM

Bottom terminal positioning enhances thermal management and simplifies the mounting process on PCBs.

Maximum Seated Height: 0.715 mm

A low maximum seated height facilitates integration into compact designs without compromising on performance.

Width: 1.67 mm

Compact width helps save valuable board space, making the product suitable for space-sensitive applications.

Minimum Supply Voltage (Vsup): 1.65 V

Low minimum supply voltage makes this IC energy-efficient and ideal for battery-powered devices.

Length: 2.17 mm

The compact length supports high-density configurations, allowing for more features in a limited space.

Temperature Grade: INDUSTRIAL

Industrial-grade components are designed for reliability and longevity in demanding applications, ensuring durability over time.

Terminal Form: BALL

Ball terminal form enhances electrical reliability and pads for better soldering during the assembly process.

Terminal Pitch: 0.5 mm

A fine terminal pitch allows for increased connectivity in smaller spaces, catering to advanced circuit designs.

Maximum Supply Voltage (Vsup): 3.6 V

The ability to handle a maximum supply voltage of 3.6V provides versatility across a range of electronic devices.

Technical Specifications

Other Function Consumer ICs STMPE812BJR attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PBGA-B12

Length:

2.17 mm

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA12,3X4,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

.715 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.67 mm

Trade Compliance

STMPE812BJR General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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