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STMEC001QTR

STMicroelectronics

STMEC001QTR by STMicroelectronics

STMEC001QTR by STMicroelectronics is a compact power management IC designed for efficient voltage regulation. It operates at a nominal voltage of 3.3V, supports up to 3 channels, and features a very thin profile with no lead terminals. Ideal for space-constrained applications in electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,754 parts In-Stock

1+ parts

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4,754

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Vyrian

USA . 4,483 parts In-Stock

1+ parts

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4,483

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Anansix

USA . 812 parts In-Stock

1+ parts

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812

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,628 parts In-Stock

1+ parts

$10.919

100+ parts

-

1k+ parts

$9.827

10k+ parts

-

1,628

$10.919

-

$9.827

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MKK Technologies

India . 1,327 parts In-Stock

1+ parts

$20.532

100+ parts

-

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1,327

$20.532

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DigiPath Technology Company

USA . 1,327 parts In-Stock

1+ parts

$20.532

100+ parts

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10k+ parts

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1,327

$20.532

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Corphita

USA . 2,226 parts In-Stock

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2,226

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Parana Technologies

USA . 563 parts In-Stock

1+ parts

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100+ parts

$13.055

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563

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$13.055

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Overview

Unlock the potential of your designs with the STMEC001QTR from STMicroelectronics, a leader in innovative power management solutions. This compact and efficient IC delivers seamless power supply support while ensuring superior reliability across a range of applications, from consumer electronics to industrial systems. With its sleek design and exceptional performance, the STMEC001QTR empowers you to create smarter, more energy-efficient products that stand out in the market.

Feature Benefit Bullets

Surface Mount: YES

The surface mount design enables efficient space utilization on PCBs, making the product suitable for compact applications.

Package Shape: SQUARE

The square package shape allows for symmetrical layout and optimal thermal performance, beneficial for power management applications.

Nominal Supply Voltage (Vsup): 3.3 V

With a nominal supply voltage of 3.3 V, this product is ideal for modern digital circuits, ensuring compatibility and reliability.

Power Supplies (V): 1.5/3.3

Supports multiple power supply voltages, providing flexibility for various applications and enhancing design options.

No. of Terminals: 16

The 16 terminals offer multiple connection points for diverse functionality while keeping the design compact.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile design allows for efficient thermal management and suitable integration into space-constrained designs.

Terminal Position: QUAD

Quad terminal positioning enables efficient routing of signals on the PCB, improving signal integrity and reducing layout complexity.

Maximum Seated Height: 1 mm

The low seated height fits well in ultra-thin devices, making it a perfect choice for portable and sleek electronics.

Width: 3 mm

At 3 mm width, this component can easily fit into tight spaces while providing excellent electrical performance.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit, it effectively manages and regulates power, enhancing system reliability.

Minimum Supply Voltage (Vsup): 3 V

A minimum supply voltage of 3 V broadens compatibility with various power sources, ensuring versatility in application.

Length: 3 mm

With a compact length of 3 mm, it fits seamlessly into space-constrained designs, maintaining performance without bulk.

No. of Channels: 3

Having 3 channels allows for the management of multiple power outputs, streamlining the design process in multi-channel applications.

Terminal Form: NO LEAD

The no lead design minimizes parasitic inductance and capacitance, enhancing performance in high-frequency applications.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch enables denser packing on PCBs, essential for modern, miniaturized electronic devices.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6 V allows for versatility in power supply architecture, catering to varied application needs.

Technical Specifications

Power Management ICs STMEC001QTR attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-XQCC-N16

Length:

3 mm

No. of Channels:

3

No. of Functions:

1

No. of Terminals:

16

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3 mm

Trade Compliance

STMEC001QTR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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