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STM8TL53C4U6

STMicroelectronics

STM8TL53C4U6 by STMicroelectronics

STM8TL53C4U6 by STMicroelectronics is an 8-bit microcontroller with a max clock frequency of 16 MHz. It features 4096 bytes of RAM, 2048 bytes of data EEPROM, and 16384 ROM words. Ideal for industrial applications, it offers connectivity through I2C, SPI, and USART interfaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,576 parts In-Stock

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4,576

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Digiode

USA . 3,492 parts In-Stock

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3,492

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Anansix

USA . 1,869 parts In-Stock

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1,869

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AGACORP

USA . 145 parts In-Stock

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145

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Distributors (Availability)

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AZTECH Wire

Italy . 260 parts In-Stock

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$13.510

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260

$13.510

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IDEA Electronic Components Group

UK . 1,432 parts In-Stock

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$16.784

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$15.105

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$16.784

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$15.105

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Microchip USA

USA . 2,541 parts In-Stock

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$17.583

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2,541

$17.583

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MKK Technologies

India . 1,173 parts In-Stock

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$31.560

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1,173

$31.560

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DigiPath Technology Company

USA . 1,173 parts In-Stock

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$31.560

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$31.560

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Corphita

USA . 4,573 parts In-Stock

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4,573

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Parana Technologies

USA . 1,072 parts In-Stock

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$20.067

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Perfect Parts

USA . 505 parts In-Stock

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Overview

Experience the power of innovation with the STM8TL53C4U6 microcontroller by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-quality products that exceed expectations. This versatile microcontroller is perfect for various applications, offering a range of features such as POR, PWM, TIMER, and WDT. With a maximum clock frequency of 16 MHz and connectivity options like I2C, SPI, and USART, the STM8TL53C4U6 provides high performance and flexibility. Trust STMicroelectronics to provide reliable solutions that meet your needs and elevate your projects to new heights.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient mounting on PCBs, saving space and simplifying assembly process.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, making it versatile for different applications.

Package Shape: SQUARE

Square shape allows for efficient use of board space and easier placement on the PCB.

Bit Size: 8

Suitable for applications that require lower computational power, ideal for basic control functions.

Power Supplies (V): 1.8/3.3

Compatible with common power supply standards, enabling easy integration into existing systems.

No. of Terminals: 48

Sufficient number of terminals for connecting to various external components, expanding the functionality of the microcontroller.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Multiple package styles offer flexibility in design and cooling options, catering to different application requirements.

Minimum Supply Voltage: 1.65 V

Low minimum supply voltage allows for operation in battery-powered devices or low-power applications.

Maximum Operating Temperature: 85 °C

Wide operating temperature range makes it suitable for industrial applications where temperature fluctuations are common.

CPU Family: STM8

Belongs to a reputable CPU family known for performance and reliability, ensuring high quality of the microcontroller.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold environments, expanding its potential use cases.

Terminal Position: QUAD

Quad terminal position provides better mechanical stability and easier soldering during PCB assembly.

ROM Words: 16384

Sufficient ROM capacity for storing program instructions and data, enabling complex program execution.

Maximum Seated Height: 1 mm

Low profile design allows for compact and slim electronic devices, suitable for space-constrained applications.

Width: 7 mm

Narrow width saves board space and allows for densely packed PCB designs.

Data EEPROM Size: 2048

Adequate EEPROM size for storing non-volatile data, offering flexibility in data storage capabilities.

Peripherals: POR, PWM(2), TIMER(3), WDT(2)

Comprehensive set of peripherals enhance the microcontroller's functionality, enabling precise timing, power management, and watchdog capabilities.

Maximum Clock Frequency: 16 MHz

High clock frequency allows for fast execution of instructions, suitable for time-critical applications.

Length: 7 mm

Compact length facilitates space-saving designs and allows for flexibility in board layout.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable operation in harsh environments typically found in industrial settings.

Peripheral IC Type: MICROCONTROLLER

Dedicated microcontroller IC type ensures optimized performance for control and processing tasks.

RAM Bytes: 4096

Sufficient RAM capacity for temporary data storage and manipulation, supporting multitasking and data-intensive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Terminal Form: NO LEAD

No-lead terminal form simplifies surface mount assembly process and enhances reliability by reducing solder joint issues.

Maximum Supply Current: 80 mA

Low supply current consumption makes the microcontroller energy-efficient and suitable for battery-operated devices.

Nominal Supply Voltage: 3 V

Standard nominal supply voltage simplifies power supply design and compatibility with off-the-shelf power sources.

PWM Channels: YES

Built-in PWM channels offer precise control of analog signals, essential for motor control, dimming, and other applications requiring variable output.

Connectivity: I2C, SPI, USART

Support for commonly used communication protocols enhances interoperability and ease of integration with other devices or sensors.

ROM Programmability: FLASH

Flash ROM programmability enables easy firmware updates and reprogramming of the microcontroller without requiring special programming equipment.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting, enabling compact PCB designs with more features in limited space.

Speed: 16 rpm

High-speed operation at 16 RPM ensures quick response times and efficient performance in time-sensitive applications.

On Chip Program ROM Width: 8

Wide ROM width allows for storing more program instructions, enabling complex logic and advanced functionalities in the microcontroller.

No. of I/O Lines: 23

Abundance of I/O lines provides ample connectivity options for interfacing with external devices, sensors, and peripherals.

Technical Specifications

Microcontrollers STM8TL53C4U6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

8

CPU Family:

STM8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

No. of I/O Lines:

23

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

80 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

2048

Connectivity:

I2C, SPI, USART

Peripherals:

POR, PWM(2), TIMER(3), WDT(2)

Trade Compliance

STM8TL53C4U6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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