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STM8S903K3U3TR

STMicroelectronics

STM8S903K3U3TR by STMicroelectronics

STM8S903K3U3TR from STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 5.5V and operates in extreme temperatures (-40 °C to 125°C). It features 32 terminals, 2048 ROM words, and supports I2C, SPI, and UART for versatile applications in automotive systems. With a compact design (5mm x 5mm) and low power consumption (4.75mA), it's ideal for space-constrained environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Cyclops Electronics Ltd

UK . 30,000 parts In-Stock

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30,000

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Vyrian

USA . 7,703 parts In-Stock

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7,703

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Digiode

USA . 3,841 parts In-Stock

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Anansix

USA . 1,754 parts In-Stock

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1,754

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Distributors (Availability)

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Vigor

Singapore . 9,390 parts In-Stock

1+ parts

$0.940

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-

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9,390

$0.940

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AZTECH Wire

Italy . 125 parts In-Stock

1+ parts

$18.180

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125

$18.180

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Advanced Electronics

New Zealand . 700 parts In-Stock

1+ parts

$64.364

100+ parts

$58.571

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$52.778

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700

$64.364

$58.571

$52.778

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IDEA Electronic Components Group

UK . 864 parts In-Stock

1+ parts

$75.678

100+ parts

-

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$68.110

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864

$75.678

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$68.110

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MKK Technologies

India . 1,231 parts In-Stock

1+ parts

$142.308

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1,231

$142.308

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DigiPath Technology Company

USA . 1,231 parts In-Stock

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$142.308

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1,231

$142.308

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QUARKTWIN TECHNOLOGY LTD

USA . 8,208 parts In-Stock

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Microchip USA

USA . 6,682 parts In-Stock

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6,682

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A-Z Elektronik GmbH

Germany . 6,134 parts In-Stock

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Corphita

USA . 1,343 parts In-Stock

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1,343

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Parana Technologies

USA . 1,014 parts In-Stock

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$90.485

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$90.485

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Kepictronics

USA . 94 parts In-Stock

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Overview

Unlock your project’s potential with the STM8S903K3U3TR microcontroller by STMicroelectronics! Renowned for superior quality and reliability, this compact powerhouse excels in automotive applications and beyond. With robust performance across varied temperatures and flexible power options, it ensures seamless operation. Experience enhanced connectivity and advanced features designed to elevate your designs, delivering tangible benefits that drive innovation. Choose quality; choose STMicroelectronics!

Feature Benefit Bullets

Surface Mount: YES

This product is suitable for applications where space savings is crucial, making it ideal for compact designs.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this microcontroller can work seamlessly with a variety of power sources without risk of damage.

Package Shape: SQUARE

The square package shape enables efficient space management on PCBs, facilitating compact and efficient designs.

Bit Size: 8

The 8-bit architecture makes it suitable for simple control applications and reduces complexity in system design.

Power Supplies (V): 3.3/5

This dual voltage capability allows greater flexibility in system design, accommodating various power supply configurations.

No. of Terminals: 32

With 32 terminals, this microcontroller can interact with multiple peripherals and I/O devices, enhancing its versatility.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The very thin profile ensures better thermal performance and allows for stacking or placement in low-profile applications.

Minimum Supply Voltage: 2.95 V

The low minimum supply voltage makes it ideal for battery-operated devices, promoting energy efficiency.

Maximum Operating Temperature: 125 °C

The high operating temperature capability ensures reliability in harsh environments, making it suitable for automotive applications.

Minimum Operating Temperature: -40 °C

This wide temperature range allows the microcontroller to function effectively in extreme conditions.

ADC Channels: YES

The presence of ADC channels enables analog sensing capabilities, essential for applications requiring data from real-world signals.

Terminal Position: QUAD

Quad terminal positioning optimizes space on the PCB while maintaining effective connectivity.

ROM Words: 2048

The significant ROM space allows for complex application programming, supporting sophisticated functionality.

Maximum Seated Height: 0.6 mm

A low seated height is beneficial for applications where space is at a premium, allowing for a compact design.

Width: 5 mm

A compact width makes this microcontroller suitable for use in space-constrained applications.

Data EEPROM Size: 640

The ample Data EEPROM size provides adequate storage for user settings and calibration data, enhancing functionality.

Peripherals: BOD, POR, TIMER(6)

The inclusion of essential peripherals increases the versatility of the microcontroller, enabling a range of applications.

Maximum Clock Frequency: 16 MHz

A max clock frequency of 16 MHz ensures that the microcontroller can handle real-time operations effectively.

Length: 5 mm

Maintaining a standard length allows for compatibility with various PCB layouts and designs.

Temperature Grade: AUTOMOTIVE

Automotive-grade components ensure reliability and durability under the demanding conditions of vehicle applications.

Peripheral IC Type: MICROCONTROLLER

Designed specifically as a microcontroller, it is optimized for control applications, making it very effective in embedded systems.

RAM Bytes: 1024

The sufficient RAM size allows for efficient data handling and processing, supporting application complexity.

Technology: CMOS

The use of CMOS technology provides low power consumption, which is critical for battery-powered and energy-sensitive applications.

Terminal Form: NO LEAD

Lead-free terminals facilitate compliance with environmental standards, making it a sustainable choice.

Analog To Digital Converters: 7-Ch 10-Bit

The 7-channel 10-bit ADC capability allows for versatile analog signal processing, enhancing the device's utility.

Maximum Supply Current: 4.75 mA

Low maximum supply current enhances power efficiency, making it suitable for low-power applications.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage is well-suited for modern digital circuits, promoting energy efficiency.

PWM Channels: YES

The inclusion of PWM channels is essential for applications like motor control and signal modulation.

Connectivity: I2C, IRDA, LIN, SPI, UART

Comprehensive connectivity options facilitate easy integration with other devices and systems, enhancing its versatility.

ROM Programmability: FLASH

Flash programmability allows for easy updates and reprogramming of the firmware, making it convenient for development.

Terminal Pitch: 0.5 mm

A fine terminal pitch contributes to compact design possibilities and compatibility with high-density PCBs.

Speed: 16 rpm

The specified speed parameters ensure adequate performance for motor control applications.

On Chip Program ROM Width: 32

The 32-bit width of the on-chip program ROM provides a greater instruction set, enhancing execution efficiency.

No. of I/O Lines: 28

With 28 I/O lines available, the microcontroller can connect with numerous devices, expanding the scope of applications.

Technical Specifications

Microcontrollers STM8S903K3U3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

No. of I/O Lines:

28

No. of Terminals:

32

On Chip Program ROM Width:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

2048

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

4.75 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.95 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

640

Connectivity:

I2C, IRDA, LIN, SPI, UART

Peripherals:

BOD, POR, TIMER(6)

Analog To Digital Convertors:

7-Ch 10-Bit

Trade Compliance

STM8S903K3U3TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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