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STM8S903F3U3TR

STMicroelectronics

STM8S903F3U3TR by STMicroelectronics

STM8S903F3U3TR by STMicroelectronics is an 8-bit microcontroller with a max clock frequency of 16 MHz. It features 1024 bytes of RAM, 2048 ROM words, and 640 bytes of data EEPROM. Ideal for automotive applications, it offers connectivity options like I2C, IRDA, LIN, SPI, and UART along with PWM channels and 5-channel 10-bit ADCs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,571 parts In-Stock

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8,571

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Digiode

USA . 2,522 parts In-Stock

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2,522

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Anansix

USA . 1,038 parts In-Stock

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1,038

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 3,912 parts In-Stock

1+ parts

$0.780

100+ parts

-

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3,912

$0.780

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Microchip USA

USA . 4,698 parts In-Stock

1+ parts

$7.538

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4,698

$7.538

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AZTECH Wire

Italy . 166 parts In-Stock

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$18.150

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166

$18.150

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IDEA Electronic Components Group

UK . 1,481 parts In-Stock

1+ parts

$48.075

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$43.267

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1,481

$48.075

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$43.267

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MKK Technologies

India . 297 parts In-Stock

1+ parts

$90.401

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297

$90.401

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DigiPath Technology Company

USA . 297 parts In-Stock

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$90.401

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297

$90.401

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Corphita

USA . 3,877 parts In-Stock

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3,877

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Parana Technologies

USA . 2,139 parts In-Stock

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$57.480

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2,139

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$57.480

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Overview

Unlock the potential of your electronic designs with the STM8S903F3U3TR microcontroller from STMicroelectronics. With a reputation for quality and reliability, STMicroelectronics delivers cutting-edge technology in a compact chip carrier package. This versatile microcontroller boasts a range of peripherals including BOD, POR, and TIMER, making it ideal for automotive applications and beyond. The STM8S903F3U3TR offers customers the value of high performance, low power consumption, and seamless connectivity with I2C, IRDA, LIN, SPI, and UART interfaces. Trust STMicroelectronics to provide the tools you need to bring your innovative ideas to life.

Feature Benefit Bullets

Surface Mount: YES

Easy to mount on PCB, saving manual assembly time and costs.

Maximum Supply Voltage: 5.5 V

Provides flexibility in power supply options and compatibility with a wide range of systems.

Package Shape: SQUARE

Compact size allows for efficient use of board space.

Bit Size: 8

Offers sufficient computational capabilities for many applications.

Power Supplies (V): 3.3/5

Supports common power supply voltages, enhancing versatility.

No. of Terminals: 20

Provides ample connectivity options for interfacing with peripherals.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

Low-profile design saves space and facilitates integration into compact devices.

Minimum Supply Voltage: 2.95 V

Allows operation in low-voltage conditions, increasing compatibility.

Maximum Operating Temperature: 125 °C

Suitable for demanding operating environments.

CPU Family: STM8

STM8 processors are known for their reliability and performance.

Minimum Operating Temperature: -40 °C

Can withstand extreme cold conditions, making it suitable for a wide range of applications.

ADC Channels: YES

Enables analog sensor interfacing and signal processing.

Terminal Position: QUAD

Facilitates easy PCB routing and efficient layout design.

ROM Words: 2048

Offers ample memory space for program storage and data manipulation.

Maximum Seated Height: 0.6 mm

Low profile is ideal for applications with height constraints.

Width: 3 mm

Compact size allows for space-efficient PCB layout.

Data EEPROM Size: 640

Sufficient non-volatile memory for storing critical data.

Peripherals: BOD, POR, TIMER(6)

Enhance system reliability and functionality with built-in features.

Maximum Clock Frequency: 16 MHz

Provides high-speed processing capabilities for real-time applications.

Length: 3 mm

Compact size enables space-saving design implementations.

Temperature Grade: AUTOMOTIVE

Meets automotive industry standards for reliability and performance in harsh environments.

Peripheral IC Type: MICROCONTROLLER

Integrates multiple functions in a single chip, reducing component count and system complexity.

RAM Bytes: 1024

Provides sufficient memory for program execution and data storage.

Technology: CMOS

Low power consumption and compatibility with modern electronic systems.

Terminal Form: NO LEAD

Enables efficient soldering and reliable connections.

Analog To Digital Convertors: 5-Ch 10-Bit

Allows for precise analog signal conversion for sensor applications.

Maximum Supply Current: 4.75 mA

Low power consumption for energy-efficient operation.

Nominal Supply Voltage: 3.3 V

Standard power supply voltage for compatibility with various systems.

PWM Channels: YES

Facilitates precise control of output signals for motor control and other applications.

Connectivity: I2C, IRDA, LIN, SPI, UART

Supports various communication protocols for seamless integration with other devices.

ROM Programmability: FLASH

Allows for easy reprogramming of firmware and software updates.

Terminal Pitch: 0.5 mm

Fine pitch enables high-density PCB designs for compact devices.

Speed: 16 rpm

Suitable for applications requiring precise timing and speed control.

On Chip Program ROM Width: 32

Adequate width for storing program instructions and data.

No. of I/O Lines: 16

Sufficient I/O for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers STM8S903F3U3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

STM8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N20

Length:

3 mm

No. of I/O Lines:

16

No. of Terminals:

20

On Chip Program ROM Width:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC20,.13SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

2048

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

4.75 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.95 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3 mm

Peripheral IC Type:

Data EEPROM Size:

640

Connectivity:

I2C, IRDA, LIN, SPI, UART

Peripherals:

BOD, POR, TIMER(6)

Analog To Digital Convertors:

5-Ch 10-Bit

Trade Compliance

STM8S903F3U3TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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