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STM8S208CBT3TR

STMicroelectronics

STM8S208CBT3TR by STMicroelectronics

STM8S208CBT3TR microcontroller from STMicroelectronics features a 24 MHz CPU, 6144 bytes of RAM, and operates within -40 °C to 125 °C. With 35 external interrupts and low power modes, it's ideal for automotive applications. Its compact design ensures efficient integration in various systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,663 parts In-Stock

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4,663

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Vyrian

USA . 3,353 parts In-Stock

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3,353

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Anansix

USA . 2,698 parts In-Stock

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2,698

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Distributors (Availability)

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AZTECH Wire

Italy . 794 parts In-Stock

1+ parts

$9.510

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794

$9.510

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Microchip USA

USA . 5,175 parts In-Stock

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$20.318

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5,175

$20.318

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IDEA Electronic Components Group

UK . 495 parts In-Stock

1+ parts

$42.187

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$37.968

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495

$42.187

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$37.968

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MKK Technologies

India . 2,213 parts In-Stock

1+ parts

$79.329

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2,213

$79.329

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DigiPath Technology Company

USA . 2,213 parts In-Stock

1+ parts

$79.329

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2,213

$79.329

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Parana Technologies

USA . 1,556 parts In-Stock

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$50.440

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1,556

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$50.440

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Corphita

USA . 716 parts In-Stock

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716

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Overview

Unlock the potential of your projects with the STM8S208CBT3TR microcontroller from STMicroelectronics, a leading name in innovation and quality. Engineered for reliability and versatility, this robust 8-bit MCU excels in automotive and industrial applications, offering impressive performance at low power consumption. Experience seamless integration, extensive connectivity options, and enhanced design flexibility that empower you to bring your ideas to life efficiently and effectively. Elevate your designs with STMicroelectronics—where excellence meets innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for smaller PCB designs and higher circuit density, which is beneficial in compact electronic devices.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with standard digital logic systems while allowing for some headroom in power supply variations.

On Chip Data RAM Width: 8

The 8-bit RAM width facilitates efficient data handling and processing within the microcontroller.

Package Shape: SQUARE

The square package shape optimizes layout and routing on PCBs, often resulting in better thermal performance.

Bit Size: 8

An 8-bit architecture offers good processing capability for a range of applications, striking a balance between performance and cost.

No. of Terminals: 48

A terminal count of 48 provides ample connectivity options for interfacing with various peripherals and sensors.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile design with fine pitch terminals allows for easier placement on PCBs and is suitable for high-density applications.

Minimum Supply Voltage: 2.95 V

With a minimum operating voltage of 2.95 V, this microcontroller can function even in low-power environments, enhancing its versatility.

Maximum Operating Temperature: 125 °C

A maximum operating temperature of 125 °C makes it suitable for harsh environments, particularly in automotive applications.

CPU Family: STM8

The STM8 CPU family is well-known for its performance and support, giving users access to a robust ecosystem and development tools.

No. of External Interrupts: 35

With 35 external interrupts, this microcontroller can handle multiple events concurrently, making it ideal for responsive applications.

Minimum Operating Temperature: -40 °C

The ability to operate down to -40 °C expands the range of applications, especially in extreme environmental conditions.

ADC Channels: YES

Integrated ADC channels enable the microcontroller to read analog signals, enhancing its capability for various sensor integration.

Terminal Position: QUAD

Quad terminal position facilitates better soldering and assembly processes, improving manufacturing efficiency.

ROM Words: 131072

A ROM size of 131072 words allows for extensive program storage, making it suitable for complex applications.

Maximum Seated Height: 1.6 mm

A maximum seated height of 1.6 mm promotes a low-profile design, integrating easily into compact devices.

RAM Words: 6144

With 6144 RAM words, this microcontroller can efficiently handle data for real-time processing and applications.

Width: 7 mm

The compact width of 7 mm allows for space-efficient designs in printed circuit boards.

Maximum Clock Frequency: 24 MHz

A maximum clock frequency of 24 MHz provides sufficient processing speed for most applications, ensuring efficient execution of tasks.

Length: 7 mm

A length of 7 mm makes this microcontroller suitable for space-constrained applications.

Temperature Grade: AUTOMOTIVE

Designed with an automotive temperature grade, this microcontroller can withstand the rigorous demands of vehicle environments.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it integrates processing capabilities with peripheral functions, reducing the need for additional components in designs.

No. of Timers: 4

The inclusion of 4 timers enhances the microcontroller's functionality for time-critical tasks and precise event scheduling.

RAM Bytes: 6144

Having a total of 6144 bytes of RAM supports complex operations, enabling developers to run advanced algorithms.

Technology: CMOS

CMOS technology offers low power consumption and high density, making this microcontroller energy-efficient.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering characteristics for reliable connections in electronic assemblies.

Maximum Supply Current: 18 mA

A maximum supply current of 18 mA ensures that the microcontroller can operate effectively under various load conditions.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V is standard for many digital circuits, making integration straightforward.

PWM Channels: YES

Having PWM channels enables precise control over motors and other actuators, making it suitable for robotics and automation.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and customization of firmware in the field.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm enables high-density packing on PCBs, essential for modern, compact electronic designs.

Format: FIXED POINT

The fixed-point format allows for efficient data processing and calculations, particularly in control applications.

Speed: 24 rpm

Operating at a speed of 24 rpm makes it suitable for various applications where controlled and consistent performance is required.

Low Power Mode: YES

The availability of a low power mode extends battery life in portable applications, making it eco-friendly and efficient.

On Chip Program ROM Width: 8

An 8-bit program ROM width ensures compatibility with standard programming and data architectures for various applications.

No. of I/O Lines: 38

With 38 I/O lines, the microcontroller can interface with a wide range of devices, providing flexibility in design.

Technical Specifications

Microcontrollers STM8S208CBT3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

WHEN TEMPERATURE IS GREATER THAN 105 DEGREE CELCIUS, MICROCONTROLLER SPEED WILL BE REDUCED TO 16 MHZ

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

STM8

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

Low Power Mode:

YES

No. of External Interrupts:

35

No. of I/O Lines:

38

No. of Terminals:

48

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

RAM Bytes:

6144

RAM Words:

6144

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Maximum Supply Current:

18 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.95 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM8S208CBT3TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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