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STM8S207SBT3C

STMicroelectronics

STM8S207SBT3C by STMicroelectronics

STM8S207SBT3C microcontroller from STMicroelectronics features a 24 MHz CPU, 6144 bytes of RAM, and operates b/w -40 °C to 125 °C. With 31 external interrupts and low power modes, it's ideal for automotive applications. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,724 parts In-Stock

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2,724

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Vyrian

USA . 1,914 parts In-Stock

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1,914

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Anansix

USA . 1,496 parts In-Stock

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1,496

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,391 parts In-Stock

1+ parts

$2.080

100+ parts

-

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1,391

$2.080

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Microchip USA

USA . 2,625 parts In-Stock

1+ parts

$17.946

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2,625

$17.946

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AZTECH Wire

Italy . 128 parts In-Stock

1+ parts

$20.480

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128

$20.480

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IDEA Electronic Components Group

UK . 1,409 parts In-Stock

1+ parts

$71.482

100+ parts

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$64.334

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1,409

$71.482

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$64.334

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MKK Technologies

India . 1,058 parts In-Stock

1+ parts

$134.418

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1,058

$134.418

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DigiPath Technology Company

USA . 1,058 parts In-Stock

1+ parts

$134.418

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1,058

$134.418

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Corphita

USA . 4,886 parts In-Stock

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4,886

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Parana Technologies

USA . 316 parts In-Stock

1+ parts

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$85.468

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316

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$85.468

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Overview

Elevate your projects with the STM8S207SBT3C microcontroller from STMicroelectronics, a leader in semiconductor innovation. This robust 8-bit powerhouse offers exceptional performance and reliability across diverse applications, from automotive to industrial automation. With its low power consumption and extensive features, it empowers developers to create efficient solutions that stand the test of time, ensuring quality and peace of mind in every design.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight, plastic/epoxy ensures reliability in various applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient manufacturing.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage accommodates a wide range of applications without electrical stress.

On Chip Data RAM Width: 8

8-bit data width is suitable for basic applications while maintaining simplicity in data handling.

Package Shape: SQUARE

Square package shape provides a standard footprint which simplifies PCB design and layout.

Bit Size: 8

Being an 8-bit microcontroller, it is cost-effective for smaller, less complex tasks.

No. of Terminals: 44

With 44 terminals, the microcontroller offers extensive connectivity for peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE

Low profile design helps in applications where height restrictions are critical.

Minimum Supply Voltage: 2.95 V

The low minimum supply voltage allows operation in battery-powered applications.

Maximum Operating Temperature: 125 °C

High operating temperature tolerance makes it suitable for automotive and industrial environments.

CPU Family: STM8

The STM8 family is known for its robustness and is widely used in various control applications.

No. of External Interrupts: 31

31 external interrupts provide flexibility for real-time processing and event-driven control.

Minimum Operating Temperature: -40 °C

Low operating temperature ensures functionality in extreme conditions.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and prevents oxidation on terminals.

ADC Channels: YES

Integrated ADC channels allow for direct measurement of analog signals, simplifying design.

Terminal Position: QUAD

Quad terminal positioning improves layout options and optimizes space on the PCB.

ROM Words: 131072

A substantial ROM size provides ample space for complex programs and functionalities.

Maximum Seated Height: 1.6 mm

Compact seated height fits into low-profile applications without sacrificing performance.

RAM Words: 6144

Significant RAM capacity supports more complex data manipulation and storage.

Width: 10 mm

The 10 mm width is ideal for space-constrained applications.

Maximum Clock Frequency: 24 MHz

A clock frequency of 24 MHz ensures fast processing capabilities for various applications.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for robust soldering processes during assembly, ensuring reliability.

Peak Reflow Temperature °C: 260

Handles higher temperatures during solder reflow, crucial for ensuring component integrity.

Length: 10 mm

The length complements its width for a compact design, ideal for small applications.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature specifications ensure reliability in vehicle applications.

Peripheral IC Type: MICROCONTROLLER

Designed specifically for control tasks, optimized for performance and versatility.

No. of Timers: 4

Multiple timers enable complex time-based operations, enhancing functionality.

RAM Bytes: 6144

Ample RAM supports multiple variables and data-processing tasks for more complex programs.

Technology: CMOS

CMOS technology enhances energy efficiency, making it suitable for low-power applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and assembly.

Maximum Supply Current: 18 mA

Low supply current enhances battery life in portable applications.

Nominal Supply Voltage: 5 V

A standard 5 V supply simplifies design and integration into existing systems.

PWM Channels: YES

Integrated PWM channels support motor control and other applications requiring varying output.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications of firmware.

Terminal Pitch: 0.8 mm

Fine terminal pitch allows for high-density PCB layouts, essential for modern electronics.

Format: FIXED POINT

Fixed-point format makes it efficient for simpler mathematical operations, important in control tasks.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate moisture sensitivity, ensuring suitability for many environments.

Speed: 24 rpm

24 rpm speed indicates effective processing capabilities for real-time control tasks.

Low Power Mode: YES

Low power mode supports power conservation in battery-driven or energy-sensitive applications.

On Chip Program ROM Width: 8

8-bit ROM width allows for simpler code structures and efficient program execution.

No. of I/O Lines: 34

34 I/O lines provide extensive interfacing options for various peripheral devices.

Technical Specifications

Microcontrollers STM8S207SBT3C attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

WHEN TEMPERATURE IS GREATER THAN 105 DEGREE CELCIUS, MICROCONTROLLER SPEED WILL BE REDUCED TO 16 MHZ

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

STM8

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

31

No. of I/O Lines:

34

No. of Terminals:

44

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

6144

RAM Words:

6144

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Maximum Supply Current:

18 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.95 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

STM8S207SBT3C Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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