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STM8S207S6T3C

STMicroelectronics

STM8S207S6T3C by STMicroelectronics

STM8S207S6T3C microcontroller from STMicroelectronics features a 24 MHz CPU, 32 KB Flash ROM, and operates b/w -40 °C to 125 °C. With 31 external interrupts and low power modes, it's ideal for automotive applications. Its compact design ensures efficient performance in space-constrained environments.

Median Price

$1.782

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 300 parts In-Stock

1+ parts

$1.513

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-

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300

$1.513

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Chip1Stop

Japan . 320 parts In-Stock

1+ parts

$2.050

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320

$2.050

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Avnet

USA . 800 parts In-Stock

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800

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Verical

USA . 300 parts In-Stock

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300

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Distributors (In-Stock)

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Ozdisan Elektronik

Türkiye . 158 parts In-Stock

1+ parts

$1.936

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-

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158

$1.936

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Digiode

USA . 420 parts In-Stock

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$1.948

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420

$1.948

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Vyrian

USA . 4,722 parts In-Stock

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4,722

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Anansix

USA . 1,958 parts In-Stock

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1,958

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Distributors (Availability)

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Corphita

USA . 2,394 parts In-Stock

1+ parts

$1.845

100+ parts

-

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2,394

$1.845

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Vigor

Singapore . 1,320 parts In-Stock

1+ parts

$3.190

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-

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1,320

$3.190

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AZTECH Wire

Italy . 412 parts In-Stock

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$11.190

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412

$11.190

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Microchip USA

USA . 2,019 parts In-Stock

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$30.355

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2,019

$30.355

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IDEA Electronic Components Group

UK . 168 parts In-Stock

1+ parts

$44.493

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$40.044

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168

$44.493

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$40.044

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MKK Technologies

India . 1,387 parts In-Stock

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$83.666

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1,387

$83.666

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DigiPath Technology Company

USA . 1,387 parts In-Stock

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$83.666

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1,387

$83.666

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Perfect Parts

USA . 4,225 parts In-Stock

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4,225

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Parana Technologies

USA . 2,264 parts In-Stock

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$53.198

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2,264

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$53.198

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Eastek

USA . 800 parts In-Stock

1+ parts

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$3.400

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800

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$3.400

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GreenTree Electronics

Israel . 800 parts In-Stock

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800

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iodParts Technologies Inc.

India . 100 parts In-Stock

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100

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Overview

Unlock the potential of your projects with the STM8S207S6T3C microcontroller from STMicroelectronics, a leader in quality and innovation. Designed for versatility, it excels in automotive applications, smart devices, and industrial control. Enjoy the benefits of low power consumption without sacrificing performance, thanks to its robust design and advanced features. Elevate your designs with reliability and efficiency—choose STM8S207S6T3C for unparalleled value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight, ensuring reliability and ease of integration in various applications.

Surface Mount: YES

Allows for compact design and high-density board layouts, perfect for space-constrained applications.

Maximum Supply Voltage: 5.5 V

Versatile range allows compatibility with various power supply systems.

On Chip Data RAM Width: 8

Efficient memory structure for handling typical data workloads in embedded systems.

Package Shape: SQUARE

Optimizes space on PCB while providing symmetrical placement options for easier routing.

Bit Size: 8

Ideal for applications requiring simple data handling and efficient processing.

No. of Terminals: 44

Provides ample connectivity to interface with various peripherals and I/O devices.

Package Style (Meter): FLATPACK, LOW PROFILE

Enables low-profile designs that contribute to slim and compact electronic devices.

Minimum Supply Voltage: 2.95 V

Flexibility in operating voltage enhances compatibility with lower power supply levels.

Maximum Operating Temperature: 125 °C

Robust thermal performance suitable for automotive and industrial applications.

CPU Family: STM8

Proven architecture with a large ecosystem and support, ensuring long-term availability.

No. of External Interrupts: 31

High interrupt count allows efficient handling of multiple real-time events.

Minimum Operating Temperature: -40 °C

Wide temperature range suitable for harsh environments typical in automotive applications.

Terminal Finish: MATTE TIN

Provides excellent solderability and corrosion resistance for reliable electrical connections.

ADC Channels: YES

Integrated ADC channels facilitate analog sensor interfacing for versatile application options.

Terminal Position: QUAD

Facilitates efficient connections in compact spaces, simplifying PCB design.

ROM Words: 32768

Generous ROM capacity for firmware storage, supporting complex applications.

Maximum Seated Height: 1.6 mm

Low profile design minimizes space and provides a sleek finish to the device.

RAM Words: 6144

Sufficient RAM for data storage and management, enhancing multitasking capabilities.

Width: 10 mm

Compact form factor suitable for miniaturized electronics.

Maximum Clock Frequency: 24 MHz

Competitive performance for a wide range of applications requiring moderate processing speed.

Maximum Time At Peak Reflow Temperature (s): 30

Optimized for industry standards in soldering processes, ensuring component reliability.

Peak Reflow Temperature °C: 260

Compatible with lead-free soldering processes, supporting environmental sustainability.

Length: 10 mm

Compact dimensions facilitate integration into small electronic designs.

Temperature Grade: AUTOMOTIVE

Designed to withstand the rigors of automotive applications, ensuring long-term reliability.

Peripheral IC Type: MICROCONTROLLER

Versatile solution for controlling other devices, suitable for numerous embedded applications.

No. of Timers: 4

Provides advanced scheduling capabilities for tasks and events in real-time applications.

RAM Bytes: 6144

Ample memory for efficient variable handling in dynamic applications.

Technology: CMOS

Offers low power consumption, enhancing energy efficiency in battery-operated devices.

Terminal Form: GULL WING

Facilitates straightforward mounting on PCBs, enhancing manufacturability.

Maximum Supply Current: 18 mA

Low current requirements contribute to power efficiency, making it suitable for mobile devices.

Nominal Supply Voltage: 5 V

Common operating voltage ensuring broad compatibility with existing designs.

PWM Channels: YES

Offers precise control capabilities for applications such as motor control and dimming.

ROM Programmability: FLASH

Allows for easy firmware updates and customization, enhancing product longevity.

Terminal Pitch: 0.8 mm

Denser terminal spacing suitable for modern electronics, maximizing available PCB area.

Format: FIXED POINT

Optimized for applications where integer math is sufficient and beneficial for performance.

Moisture Sensitivity Level (MSL): 3

Standard handling requirements that ensure product integrity prior to assembly.

Speed: 24 rpm

Sufficient operational speed for many applications requiring precise control.

Low Power Mode: YES

Extends battery life by enabling power-saving modes, critical for portable applications.

On Chip Program ROM Width: 8

Supports efficient data handling suitable for various embedded applications.

No. of I/O Lines: 34

Provides extensive interface options, allowing designers to connect multiple peripherals.

Technical Specifications

Microcontrollers STM8S207S6T3C attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

WHEN TEMPERATURE IS GREATER THAN 105 DEGREE CELCIUS, MICROCONTROLLER SPEED WILL BE REDUCED TO 16 MHZ

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

STM8

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

31

No. of I/O Lines:

34

No. of Terminals:

44

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

6144

RAM Words:

6144

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Maximum Supply Current:

18 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.95 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

STM8S207S6T3C Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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