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STM8S207RBT6TR

STMicroelectronics

STM8S207RBT6TR by STMicroelectronics

STM8S207RBT6TR by STMicroelectronics is an 8-bit microcontroller with 64 terminals, operating at a max frequency of 24 MHz. It features 16-Ch 10-Bit ADC channels and supports I2C, LIN(2), SPI, UART(2) connectivity. Ideal for industrial applications requiring low-profile, fine-pitch packages with FLASH ROM programmability.

Median Price

$2.392

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 38 parts In-Stock

1+ parts

$2.587

100+ parts

-

1k+ parts

-

10k+ parts

-

38

$2.587

-

-

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Vyrian

USA . 3,458 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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-

3,458

-

-

-

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Anansix

USA . 2,218 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,218

-

-

-

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IBS Electronics

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.197

10k+ parts

-

2,000

-

-

$2.197

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Digiode

USA . 1,339 parts In-Stock

1+ parts

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100+ parts

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1,339

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,654 parts In-Stock

1+ parts

$1.480

100+ parts

$1.443

1k+ parts

$1.436

10k+ parts

-

1,654

$1.480

$1.443

$1.436

-

Ampacity Inc.

Singapore . 1,502 parts In-Stock

1+ parts

$1.480

100+ parts

-

1k+ parts

-

10k+ parts

-

1,502

$1.480

-

-

-

Continental Prestige Electronics

USA . 3,398 parts In-Stock

1+ parts

$2.587

100+ parts

-

1k+ parts

-

10k+ parts

$2.535

3,398

$2.587

-

-

$2.535

Argo Parts USA

USA . 1,895 parts In-Stock

1+ parts

$2.587

100+ parts

-

1k+ parts

-

10k+ parts

-

1,895

$2.587

-

-

-

Vigor

Singapore . 2,000 parts In-Stock

1+ parts

$3.440

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

$3.440

-

-

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Microchip USA

USA . 3,738 parts In-Stock

1+ parts

$16.810

100+ parts

$16.710

1k+ parts

$16.660

10k+ parts

$16.610

3,738

$16.810

$16.710

$16.660

$16.610

AZTECH Wire

Italy . 54 parts In-Stock

1+ parts

$20.010

100+ parts

-

1k+ parts

-

10k+ parts

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54

$20.010

-

-

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Aztec Data Supply Inc.

USA . 1,881 parts In-Stock

1+ parts

$36.480

100+ parts

-

1k+ parts

-

10k+ parts

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1,881

$36.480

-

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Corohmni

South Africa . 3 parts In-Stock

1+ parts

$39.224

100+ parts

-

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3

$39.224

-

-

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IDEA Electronic Components Group

UK . 386 parts In-Stock

1+ parts

$63.969

100+ parts

-

1k+ parts

$57.572

10k+ parts

-

386

$63.969

-

$57.572

-

MKK Technologies

India . 2,074 parts In-Stock

1+ parts

$120.290

100+ parts

-

1k+ parts

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10k+ parts

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2,074

$120.290

-

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DigiPath Technology Company

USA . 2,074 parts In-Stock

1+ parts

$120.290

100+ parts

-

1k+ parts

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2,074

$120.290

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iodParts Technologies Inc.

India . 110,567 parts In-Stock

1+ parts

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110,567

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-

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Authorized Procurement Solutions

USA . 52,835 parts In-Stock

1+ parts

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52,835

-

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Glotronic Ltd.

UK . 8,100 parts In-Stock

1+ parts

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8,100

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Corphita

USA . 4,110 parts In-Stock

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4,110

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Lixinc

USA . 3,231 parts In-Stock

1+ parts

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3,231

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GreenTree Electronics

Israel . 1,000 parts In-Stock

1+ parts

-

100+ parts

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1,000

-

-

-

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Kepictronics

USA . 443 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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443

-

-

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Netroflash

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$2.535

1k+ parts

$2.457

10k+ parts

$2.406

50

-

$2.535

$2.457

$2.406

Parana Technologies

USA . 33 parts In-Stock

1+ parts

-

100+ parts

$76.485

1k+ parts

-

10k+ parts

-

33

-

$76.485

-

-

Overview

Unleash the power of innovation with the STM8S207RBT6TR by STMicroelectronics. Crafted with precision and expertise, this microcontroller offers unparalleled quality and reliability. Ideal for a wide range of applications, this product provides exceptional value and benefits to customers seeking cutting-edge technology. Experience seamless connectivity, high performance, and advanced features with the STM8S207RBT6TR. Elevate your projects to new heights with this top-of-the-line microcontroller from STMicroelectronics.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and helps reduce the overall weight of the microcontroller.

Surface Mount:

YES - Allows for easy installation and integration into various electronic devices.

Maximum Supply Voltage:

5.5 V - Provides flexibility in power supply options for different applications.

Package Shape:

SQUARE - Compact shape that makes it easier to fit into different designs.

Bit Size:

8 - Sufficient for handling basic operations efficiently.

Power Supplies (V):

3.3/5 - Offers compatibility with common power sources.

No. of Terminals:

64 - Provides ample connectivity options for peripherals.

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH - Ensures space-saving design and ease of soldering during assembly.

Minimum Supply Voltage:

3 V - Allows for operation in lower voltage conditions.

Maximum Operating Temperature:

85 °C - Ensures reliable performance even in high-temperature environments.

Minimum Operating Temperature:

40 °C - Suitable for use in a wide range of temperature conditions.

Terminal Finish:

NICKEL PALLADIUM GOLD - Ensures good electrical conductivity and resistance to corrosion.

ADC Channels:

YES - Enables analog-to-digital conversion for accurate measurements and sensor readings.

Terminal Position:

QUAD - Provides stability and ease of soldering during assembly.

ROM Words:

32768 - Offers sufficient memory for storing program instructions and data.

Maximum Seated Height:

1.6 mm - Ideal for applications with space constraints.

Width:

10 mm - Compact size for fitting into small electronic devices.

Data EEPROM Size:

2K - Sufficient storage for non-volatile data.

Peripherals:

BOD, POR, TIMER(9) - Additional features for enhanced functionality and performance.

Maximum Clock Frequency:

24 MHz - Provides fast processing speeds for quick response times.

Maximum Time At Peak Reflow Temperature (s):

30 - Ensures proper soldering during assembly.

Peak Reflow Temperature °C:

260 - Suitable for standard reflow soldering processes.

Length:

10 mm - Compact size for space-saving designs.

Temperature Grade:

INDUSTRIAL - Designed to withstand harsh industrial environments.

Peripheral IC Type:

MICROCONTROLLER - Specifically designed for controlling electronic devices and systems.

RAM Bytes:

6144 - Sufficient memory for storing temporary data and variables.

Technology:

CMOS - Energy-efficient technology for longer battery life.

Terminal Form:

GULL WING - Easy to solder for reliable connections.

Analog To Digital Convertors:

16-Ch 10-Bit - Enables accurate conversion of analog signals for processing by the microcontroller.

Nominal Supply Voltage:

3.3 V - Standard voltage for many electronic components.

PWM Channels:

YES - Allows for precise control of output signals.

Connectivity:

I2C, LIN(2), SPI, UART(2) - Versatile communication options for connecting to other devices.

ROM Programmability:

FLASH - Allows for reprogramming of the ROM for firmware updates and modifications.

Terminal Pitch:

0.5 mm - Ensures compatibility with standard PCB design practices.

Moisture Sensitivity Level (MSL):

3 - Suitable for general-purpose electronics assembly.

Speed:

24 rpm - Provides moderate processing speed for most applications.

On Chip Program ROM Width:

32 - Sufficient width for storing program instructions.

No. of I/O Lines:

52 - Offers plenty of input and output options for interfacing with external devices.

Technical Specifications

Microcontrollers STM8S207RBT6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

52

No. of Terminals:

64

On Chip Program ROM Width:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

6144

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

I2C, LIN(2), SPI, UART(2)

Peripherals:

BOD, POR, TIMER(9)

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

STM8S207RBT6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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