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STM8S207RBT3

STMicroelectronics

STM8S207RBT3 by STMicroelectronics

STM8S207RBT3 microcontroller from STMicroelectronics features a 24 MHz clock, operates b/w 3-5.5 V, and includes 16 ADC channels. With a robust automotive temperature grade and 64 terminals, it's ideal for automotive applications requiring reliable performance. Its low-profile design ensures efficient space utilization in compact systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

EBV Elektronik

Germany . 800 parts In-Stock

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800

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Digiode

USA . 3,230 parts In-Stock

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3,230

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Vyrian

USA . 2,239 parts In-Stock

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2,239

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Chip Stock

USA . 610 parts In-Stock

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610

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Anansix

USA . 287 parts In-Stock

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287

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Distributors (Availability)

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Vigor

Singapore . 1,119 parts In-Stock

1+ parts

$2.170

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1,119

$2.170

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AZTECH Wire

Italy . 364 parts In-Stock

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$10.400

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364

$10.400

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IDEA Electronic Components Group

UK . 436 parts In-Stock

1+ parts

$37.037

100+ parts

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$33.334

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436

$37.037

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$33.334

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$50.570

100+ parts

$46.019

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$41.467

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3,000

$50.570

$46.019

$41.467

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MKK Technologies

India . 1,701 parts In-Stock

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$69.646

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$69.646

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DigiPath Technology Company

USA . 1,701 parts In-Stock

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$69.646

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$69.646

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Infinite Electronics LLP (Excess)

. 8,505 parts In-Stock

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8,505

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A-Z Elektronik GmbH

Germany . 5,328 parts In-Stock

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5,328

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Corphita

USA . 2,965 parts In-Stock

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2,965

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Parana Technologies

USA . 1,809 parts In-Stock

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$44.284

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1,809

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$44.284

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Eastek

USA . 800 parts In-Stock

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$6.070

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800

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$6.070

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Overview

Elevate your projects with the STM8S207RBT3 microcontroller from STMicroelectronics, a trusted leader in innovation. Boasting robust performance and versatility, this high-quality chip is perfect for automotive applications and beyond. With its low power consumption and wide operational temperature range, it ensures reliability in challenging environments. Experience seamless integration and extensive connectivity options that empower your designs to thrive. Choose STM8S207RBT3 for unparalleled quality and peace of mind!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and light weight, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easier integration into modern electronic systems.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5V provides flexibility in power supply options without risking damage.

Package Shape: SQUARE

The square shape optimizes space on the PCB, increasing layout efficiency.

Bit Size: 8

An 8-bit architecture offers a good balance of performance and simplicity for many applications.

Power Supplies (V): 3.3/5

Supports both 3.3V and 5V supplies, making it compatible with a wide range of devices.

No. of Terminals: 64

With 64 terminals, this microcontroller provides ample connectivity options for peripherals and components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack style reduces height and allows for dense component placements on the PCB.

Minimum Supply Voltage: 3 V

A minimum supply voltage of 3V allows for lower power applications, improving energy efficiency.

Maximum Operating Temperature: 125 °C

High temperature tolerance of up to 125 °C makes it suitable for automotive and harsh environment applications.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold conditions, expanding its application to outdoor and frigid environments.

ADC Channels: YES

Inbuilt ADC channels facilitate analog signal processing, crucial for sensor integrations.

Terminal Position: QUAD

Quad terminal positioning provides better space utilization and simplifies mounting.

ROM Words: 32768

A 32K ROM size enables substantial program storage for complex applications.

Maximum Seated Height: 1.6 mm

Low seated height minimizes the profile of the overall assembly, allowing for compact designs.

Width: 10 mm

A compact width of 10mm aids in easy handling and integration into tight spaces.

Data EEPROM Size: 2K

2K EEPROM provides sufficient space for storing configuration settings and calibration data.

Peripherals: BOD, POR, TIMER(9)

Incorporated peripherals enhance the functionality and responsiveness of the microcontroller.

Maximum Clock Frequency: 24 MHz

A clock frequency of 24 MHz allows for efficient processing and execution of tasks.

Length: 10 mm

The small length of 10 mm aids in minimizing the footprint on PCB layouts.

Temperature Grade: AUTOMOTIVE

Designed for automotive use, ensuring reliability under fluctuating temperatures and rugged conditions.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it integrates processing, memory, and peripherals into a single unit, saving space and cost.

RAM Bytes: 6144

6K RAM allocation is ample for handling significant data processing tasks.

Technology: CMOS

CMOS technology ensures low power consumption while delivering high performance.

Terminal Form: GULL WING

Gull wing terminals enhance solder joint reliability, improving the longevity of the connection.

Analog To Digital Converters: 16-Ch 10-Bit

The inclusion of 16-channel 10-bit ADCs enables versatile signal acquisition from multiple sources.

Nominal Supply Voltage: 3.3 V

Operates efficiently at 3.3V, aligning with modern low-power device standards.

PWM Channels: YES

PWM capabilities allow for effective motor control and signal modulation.

Connectivity: I2C, LIN(2), SPI, UART(2)

Multiple connectivity options ensure seamless integration with various devices and communication standards.

ROM Programmability: FLASH

Flash ROM accounts for easy updates and modifications to the program memory.

Terminal Pitch: 0.5 mm

Fine terminal pitch supports high-density connections, ideal for miniaturized designs.

Speed: 24 rpm

The operational speed capability enhances responsiveness and performance in applications.

On Chip Program ROM Width: 32

A ROM width of 32 bits allows for advanced instruction sets and processing capabilities.

No. of I/O Lines: 52

With 52 I/O lines, this microcontroller can support a wide range of inputs and outputs for greater flexibility.

Technical Specifications

Microcontrollers STM8S207RBT3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

52

No. of Terminals:

64

On Chip Program ROM Width:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

6144

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

I2C, LIN(2), SPI, UART(2)

Peripherals:

BOD, POR, TIMER(9)

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

STM8S207RBT3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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