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STM8S207R8T3

STMicroelectronics

STM8S207R8T3 by STMicroelectronics

STM8S207R8T3 from STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 5.5V and operates b/w -40 °C to 125°C. It features 64 terminals, 16 ADC channels, and supports I2C/SPI/UART connectivity. Ideal for automotive applications, it offers robust performance in compact designs.

Median Price

$6.080

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 597 parts In-Stock

1+ parts

$6.080

100+ parts

$3.430

1k+ parts

$2.380

10k+ parts

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597

$6.080

$3.430

$2.380

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Distributors (In-Stock)

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Digiode

USA . 757 parts In-Stock

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$4.702

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757

$4.702

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Vyrian

USA . 7,087 parts In-Stock

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7,087

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Anansix

USA . 2,080 parts In-Stock

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2,080

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EMSNET

USA . 946 parts In-Stock

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946

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Bristol Electronics

USA . 155 parts In-Stock

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-

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$1.872

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$1.738

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155

-

$1.872

$1.738

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Dan-Mar Components

USA . 155 parts In-Stock

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155

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Distributors (Availability)

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Vigor

Singapore . 5,900 parts In-Stock

1+ parts

$3.660

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-

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5,900

$3.660

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Corphita

USA . 2,198 parts In-Stock

1+ parts

$4.455

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2,198

$4.455

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Microchip USA

USA . 1,942 parts In-Stock

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$14.812

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$14.812

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IDEA Electronic Components Group

UK . 961 parts In-Stock

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$28.866

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$25.979

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961

$28.866

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$25.979

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MKK Technologies

India . 2,235 parts In-Stock

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$54.280

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2,235

$54.280

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DigiPath Technology Company

USA . 2,235 parts In-Stock

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$54.280

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2,235

$54.280

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A-Z Elektronik GmbH

Germany . 4,857 parts In-Stock

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Infinite Electronics LLP (Excess)

. 4,506 parts In-Stock

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Parana Technologies

USA . 1,311 parts In-Stock

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$34.514

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$34.514

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Kepictronics

USA . 668 parts In-Stock

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668

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iodParts Technologies Inc.

India . 155 parts In-Stock

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155

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Perfect Parts

USA . 123 parts In-Stock

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Overview

Unlock your project's potential with the STM8S207R8T3 microcontroller from STMicroelectronics, a leader in cutting-edge technology. With superior quality and reliability, this versatile 8-bit MCU is perfect for automotive applications, ensuring optimal performance in demanding environments. Enjoy seamless connectivity, impressive power efficiency, and robust features that empower innovation. Elevate your designs with the STM8S207R8T3—where excellence meets affordability!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic epoxy material ensures good protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Being a surface mount device allows for more compact designs and easier integration into modern electronic circuits.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V offers flexibility in power supply options while ensuring safe operations.

Package Shape: SQUARE

The square package shape helps in efficient space utilization on PCBs and simplifies layout design.

Bit Size: 8

Having an 8-bit architecture makes this microcontroller suitable for simpler applications, ensuring cost-effectiveness.

Power Supplies (V): 3.3/5

Support for both 3.3V and 5V power supplies provides versatility to work in various environments and systems.

No. of Terminals: 64

With 64 terminals, this microcontroller offers extensive connectivity options for peripherals, expanding its usability.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack and low-profile style enhances thermal performance and allows for installation in tight spaces.

Minimum Supply Voltage: 3 V

A minimum supply voltage of 3V means the microcontroller can operate effectively even in lower power conditions.

Maximum Operating Temperature: 125 °C

With a maximum temperature rating of 125 °C, this product is ideal for automotive and harsh environments.

Minimum Operating Temperature: -40 °C

This wide temperature range ensures reliable performance in extreme conditions, making it suitable for automotive applications.

ADC Channels: YES

The inclusion of ADC channels enables the microcontroller to interface with analog signals, increasing its functionality.

Terminal Position: QUAD

Quad terminal positioning simplifies PCB layouts and optimizes space, which is crucial for compact device designs.

ROM Words: 16384

A ROM capacity of 16384 words provides ample space for program storage, allowing for more complex applications.

Maximum Seated Height: 1.6 mm

Its low seated height contributes to a sleeker design and is conducive to high-density PCB layouts.

Width: 10 mm

A compact width of 10 mm facilitates easier integration into space-constrained applications.

Data EEPROM Size: 1536

A sizeable EEPROM allows for the storage of important parameters, enhancing the device's capability for data retention.

Peripherals: BOD, POR, TIMER(9)

Multiple built-in peripherals enhance functionality and reduce the need for additional components, saving space and cost.

Maximum Clock Frequency: 24 MHz

With a maximum clock frequency of 24 MHz, this microcontroller can handle a variety of tasks efficiently and responsively.

Length: 10 mm

A compact length of 10 mm supports easy integration into devices where space is at a premium.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, it meets stringent temperature and reliability standards.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it combines processing power with input/output connectivity, making it ideal for embedded systems.

RAM Bytes: 6144

A RAM size of 6144 bytes supports complex calculations and real-time processing, enhancing performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, resulting in greater efficiency and reliability.

Terminal Form: GULL WING

Gull wing terminals simplify soldering and enhance the device's thermal performance on PCBs.

Analog To Digital Converters: 16-Ch 10-Bit

Having 16 channels and 10-bit resolution ADCs ensures high precision for signal measurements in various applications.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3V makes it compatible with many modern digital circuits, ensuring ease of integration.

PWM Channels: YES

Support for PWM channels allows for smooth control of motors and LEDs, enhancing its applicability in control systems.

Connectivity: I2C, LIN(2), SPI, UART(2)

Varied communication interfaces increase flexibility for connecting with other devices and sensors.

ROM Programmability: FLASH

Flash programmability allows for easy updates and adjustments to firmware, enhancing maintenance and adaptability.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for a compact and low-profile design, suitable for high-density applications.

Speed: 24 rpm

With a speed of 24 rpm, this microcontroller is capable of handling applications that require dynamically controlled outputs.

On Chip Program ROM Width: 32

A ROM width of 32 bits allows for efficient instruction handling, improving overall processing capability.

No. of I/O Lines: 52

Having 52 I/O lines provides significant flexibility for interfacing with various sensors and external components.

Technical Specifications

Microcontrollers STM8S207R8T3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

52

No. of Terminals:

64

On Chip Program ROM Width:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

6144

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

1536

Connectivity:

I2C, LIN(2), SPI, UART(2)

Peripherals:

BOD, POR, TIMER(9)

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

STM8S207R8T3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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