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STM8S207M8T3BTR

STMicroelectronics

STM8S207M8T3BTR by STMicroelectronics

STM8S207M8T3BTR from STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 5.5V and operates up to 125 °C. It features 68 I/O lines, 37 external interrupts, and supports automotive applications with low power modes. Ideal for embedded systems requiring reliability and efficiency.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,486 parts In-Stock

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3,486

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Vyrian

USA . 1,985 parts In-Stock

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1,985

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Anansix

USA . 536 parts In-Stock

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536

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,500 parts In-Stock

1+ parts

$2.560

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

$2.560

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AZTECH Wire

Italy . 435 parts In-Stock

1+ parts

$19.130

100+ parts

-

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435

$19.130

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IDEA Electronic Components Group

UK . 748 parts In-Stock

1+ parts

$31.683

100+ parts

-

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$28.515

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748

$31.683

-

$28.515

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MKK Technologies

India . 886 parts In-Stock

1+ parts

$59.578

100+ parts

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886

$59.578

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DigiPath Technology Company

USA . 886 parts In-Stock

1+ parts

$59.578

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886

$59.578

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Parana Technologies

USA . 2,298 parts In-Stock

1+ parts

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$37.882

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2,298

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$37.882

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Microchip USA

USA . 1,965 parts In-Stock

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1,965

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Corphita

USA . 811 parts In-Stock

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811

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Overview

Unlock innovation with the STM8S207M8T3BTR microcontroller from STMicroelectronics, a leader in cutting-edge technology. Designed for precision and efficiency, this versatile powerhouse enhances performance across automotive, industrial, and consumer applications. Enjoy exceptional reliability with low power consumption, all while benefiting from ST's commitment to quality and durability. Elevate your projects with a trusted partner that delivers value and fosters creativity!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures reliability and protection against environmental factors, making the microcontroller suitable for various applications.

Surface Mount: YES

The surface mount capability allows for compact design and efficient PCB space utilization, enhancing versatility in product design.

Maximum Supply Voltage: 5.5 V

This voltage range allows compatibility with common digital systems, ensuring flexibility in diverse applications.

On Chip Data RAM Width: 8

An 8-bit data width is suitable for a wide range of applications, providing adequate RAM performance for efficient data handling.

Package Shape: SQUARE

A square package shape is advantageous for layout design, simplifying integration into circuits which can lead to reduced manufacturing costs.

Bit Size: 8

The 8-bit architecture is perfect for simple applications, allowing ease of programming and reduced complexity in software development.

No. of Terminals: 80

A larger number of terminals provides extensive I/O capabilities, allowing complex interfacing and more features to be implemented.

Package Style (Meter): FLATPACK, LOW PROFILE

A low profile package style is ideal for compact devices, ensuring space-saving on PCBs without compromising performance.

Minimum Supply Voltage: 2.95 V

The low minimum supply voltage allows for power-efficient designs, making it suitable for battery-operated applications.

Maximum Operating Temperature: 125 °C

This high temperature rating ensures the microcontroller can operate in harsh environments, making it suitable for automotive and industrial applications.

CPU Family: STM8

The STM8 family offers a wide range of features and is well-supported, simplifying development and enhancing product reliability.

No. of External Interrupts: 37

High interrupt capability enhances responsiveness to real-time events, which is crucial for applications requiring quick reactions.

Minimum Operating Temperature: -40 °C

With a temperature range extending to -40 °C, this microcontroller is reliable in extreme cold conditions, ideal for automotive and outdoor applications.

Terminal Finish: MATTE TIN

The matte tin finish offers excellent solderability and corrosion resistance, ensuring longevity and reliability of connections.

ADC Channels: YES

On-chip ADC channels allow for direct analog signal processing, making it versatile for sensing applications without additional components.

Terminal Position: QUAD

Quad terminal positioning optimizes PCB layout for better signal integrity and helps in efficient routing on multilayer boards.

ROM Words: 65536

The substantial ROM capacity allows for complex programs and functionalities, enabling the development of sophisticated applications.

Maximum Seated Height: 1.6 mm

A low seated height is beneficial for compact designs, ensuring compatibility with other low-profile component layouts.

RAM Words: 6144

With ample RAM resources, this microcontroller can efficiently handle multiple tasks and store temporary data for applications.

Width: 14 mm

The compact width enhances space-saving designs, making it suitable for miniaturized electronic devices.

Maximum Clock Frequency: 24 MHz

A maximum clock frequency of 24 MHz ensures speedy execution of instructions, improving the overall performance of the microcontroller.

Maximum Time At Peak Reflow Temperature (s): 30

The reflow time specification allows for compatibility with standard soldering processes, ensuring ease in manufacturing.

Peak Reflow Temperature °C: 250

A high peak reflow temperature ensures robust solder joints during assembly, critical for the durability of electronic connections.

Length: 14 mm

This compact length aids in space efficiency, allowing for a tighter layout in space-constrained applications.

Temperature Grade: AUTOMOTIVE

Automotive grade means this microcontroller meets strict automotive standards, ensuring reliability in vehicles and related applications.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates multiple functionalities on a single chip, reducing the need for additional components and simplifying design.

No. of Timers: 4

Having multiple timers allows for efficient time management in applications, enabling complex timing functions without additional circuitry.

RAM Bytes: 6144

The available RAM enhances multitasking capabilities, allowing embedded systems to run complex algorithms more efficiently.

Technology: CMOS

CMOS technology ensures low power consumption and high density, ideal for battery-powered and compact applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and mechanical stability, which are crucial for reliable PCB mounting.

Maximum Supply Current: 18 mA

Maintaining low supply current keeps overall power consumption minimal, enhancing battery life in portable applications.

Nominal Supply Voltage: 5 V

This nominal voltage aligns with standard digital logic levels, ensuring compatibility with a variety of devices and systems.

PWM Channels: YES

Integrated PWM channels are valuable for motor control and other applications requiring variable signal generation.

ROM Programmability: FLASH

Flash programmability allows for easy updates and reprogramming in the field, increasing the flexibility and longevity of the device.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm supports high-density assembly, optimizing PCB space without sacrificing performance.

Format: FIXED POINT

Fixed-point format coding is simpler for certain applications, enabling quick processing and less complex arithmetic handling.

Moisture Sensitivity Level (MSL): 3

An MSL level of 3 indicates that the microcontroller can tolerate handling and environmental conditions without immediate moisture-related issues.

Speed: 24 rpm

This characteristic is essential for applications requiring precise motion control, especially in robotics and automation contexts.

Low Power Mode: YES

Low power modes are crucial for energy-efficient designs, especially in battery-operated devices where longevity is a priority.

On Chip Program ROM Width: 8

Having an 8-bit program ROM width helps in efficient data processing for 8-bit applications, simplifying development and programming.

No. of I/O Lines: 68

The high number of I/O lines allows for numerous peripheral connections and complex interfacing, making the microcontroller highly versatile.

Technical Specifications

Microcontrollers STM8S207M8T3BTR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

WHEN TEMPERATURE IS GREATER THAN 105 DEGREE CELCIUS, MICROCONTROLLER SPEED WILL BE REDUCED TO 16 MHZ

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

STM8

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

37

No. of I/O Lines:

68

No. of Terminals:

80

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

250

Qualification:

Not Qualified

RAM Bytes:

6144

RAM Words:

6144

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Maximum Supply Current:

18 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.95 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

STM8S207M8T3BTR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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