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STM8S207K6T6CTR

STMicroelectronics

STM8S207K6T6CTR by STMicroelectronics

STM8S207K6T6CTR microcontroller from STMicroelectronics features a 24 MHz CPU, 32 terminals, and operates b/w -40 °C to 85°C. With 6144 bytes of RAM and 32768 words of FLASH ROM, it's ideal for industrial applications requiring low power and multiple I/O lines. Its compact design ensures efficient surface mounting in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 51,500 parts In-Stock

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51,500

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Vyrian

USA . 2,847 parts In-Stock

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2,847

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Digiode

USA . 2,454 parts In-Stock

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2,454

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Anansix

USA . 153 parts In-Stock

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153

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Distributors (Availability)

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Vigor

Singapore . 2,500 parts In-Stock

1+ parts

$2.800

100+ parts

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2,500

$2.800

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Microchip USA

USA . 5,222 parts In-Stock

1+ parts

$11.640

100+ parts

$11.570

1k+ parts

$11.530

10k+ parts

$11.490

5,222

$11.640

$11.570

$11.530

$11.490

AZTECH Wire

Italy . 824 parts In-Stock

1+ parts

$18.750

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824

$18.750

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Ampacity Inc.

Singapore . 109,984 parts In-Stock

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$20.000

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109,984

$20.000

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Component Stockers USA

USA . 4,632 parts In-Stock

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$26.290

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4,632

$26.290

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IDEA Electronic Components Group

UK . 850 parts In-Stock

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$55.819

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-

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$50.237

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850

$55.819

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$50.237

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MKK Technologies

India . 1,533 parts In-Stock

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$104.964

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1,533

$104.964

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DigiPath Technology Company

USA . 1,533 parts In-Stock

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$104.964

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1,533

$104.964

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Perfect Parts

USA . 400,512 parts In-Stock

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400,512

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GreenTree Electronics

Israel . 117,600 parts In-Stock

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Eastek

USA . 110,400 parts In-Stock

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$2.300

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Lixinc

USA . 17,104 parts In-Stock

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Futuretech Components

Singapore . 12,000 parts In-Stock

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12,000

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Parana Technologies

USA . 2,130 parts In-Stock

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$66.740

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2,130

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$66.740

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Authorized Procurement Solutions

USA . 1,600 parts In-Stock

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1,600

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Corphita

USA . 179 parts In-Stock

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Overview

Elevate your designs with the STM8S207K6T6CTR microcontroller from STMicroelectronics, a leader in innovative semiconductor solutions. With its robust performance and versatile capabilities, this low-power, 8-bit MCU is ideal for industrial automation, consumer electronics, and IoT applications. Experience superior reliability and efficiency, backed by ST's commitment to quality, ensuring that your projects achieve exceptional performance and longevity. Unleash your creativity and streamline your development with this powerhouse!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures long-lasting performance and protection against environmental factors.

Surface Mount: YES

Surface mount capability allows for compact design and easy integration into modern PCB layouts.

Maximum Supply Voltage: 5.5 V

A flexible voltage range offers compatibility with a variety of power supply systems.

On Chip Data RAM Width: 8

8-bit RAM width is suitable for applications requiring efficient data handling without excessive complexity.

Package Shape: SQUARE

Square packages optimize space utilization on circuit boards, making them a great choice for compact devices.

Bit Size: 8

An 8-bit architecture is ideal for many embedded applications, providing a balance between performance and resource usage.

No. of Terminals: 32

A higher number of terminals provides flexible connectivity options for interfacing with various peripherals and I/O devices.

Package Style: FLATPACK, LOW PROFILE

The low profile design minimizes space constraints and is suited for applications with limited height availability.

Minimum Supply Voltage: 2.95 V

This low voltage operation makes it energy-efficient and extends battery life in portable applications.

Maximum Operating Temperature: 85 °C

High temperature tolerance ensures reliability in challenging industrial environments.

CPU Family: STM8

Part of the STM8 family, guaranteeing proven performance and robust development support.

No. of External Interrupts: 23

A large number of interrupts enhances responsiveness and allows for handling diverse input scenarios effectively.

Minimum Operating Temperature: -40 °C

This extreme range makes it suitable for harsh environments, ensuring operation in various climates.

Terminal Finish: MATTE TIN

Matte tin finish improves solderability and adds protection against corrosion, ensuring reliable connections.

ADC Channels: YES

Built-in ADC channels facilitate analog signal processing, enabling diverse sensor applications.

Terminal Position: QUAD

Quad terminal positioning enhances board layout flexibility, optimizing routing and signal integrity.

ROM Words: 32768

Adequate ROM capacity allows for substantial program storage, supporting complex applications.

Maximum Seated Height: 1.6 mm

A low seated height allows for compact placements in space-constrained designs.

RAM Words: 6144

Ample RAM capacity enables efficient data processing and supports multitasking in applications.

Width: 7 mm

A compact width is conducive for space-saving designs in intricate electronic systems.

Maximum Clock Frequency: 24 MHz

A 24 MHz clock frequency ensures reliable performance for a wide range of applications.

Maximum Time At Peak Reflow Temperature: 30 s

Consistency during manufacturing processes is critical; this specification ensures adequate processing time for soldering.

Peak Reflow Temperature: 260 °C

High reflow temperature compatibility allows for the use of lead-free solder, essential for modern manufacturing.

Length: 7 mm

The small length makes this microcontroller ideal for embedded systems where space is a premium.

Temperature Grade: INDUSTRIAL

Industrial-grade classification indicates robustness for operation in demanding environments.

Peripheral IC Type: MICROCONTROLLER

Being a dedicated microcontroller ensures optimized performance for control applications.

No. of Timers: 4

Multiple timers offer precise timing control, essential for time-sensitive applications.

RAM Bytes: 6144

Substantial RAM allows for temporary data storage, enhancing functionality in complex applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, suitable for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals enable easy handling and efficient soldering, making wave soldering processes smoother.

Maximum Supply Current: 18 mA

Low supply current optimizes power usage, prolonging device life in battery-powered applications.

Nominal Supply Voltage: 5 V

Nominal 5 V supply voltage is common and ensures compatibility with numerous power supplies.

PWM Channels: YES

Pulse Width Modulation channels allow precise control of motors and lights, enhancing product versatility.

ROM Programmability: FLASH

Flash memory programmability enables easy updates and modifications for application changes (field-programmable).

Terminal Pitch: 0.8 mm

A 0.8 mm pitch allows for high density mounting, accommodating compact circuit designs.

Format: FIXED POINT

Support for fixed-point arithmetic simplifies calculations for embedded applications, reducing computational overhead.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates that it can withstand typical moisture levels, making it suitable for a range of environments.

Speed: 24 rpm

Optimal for applications requiring moderate speed processing, balancing performance and energy use.

Low Power Mode: YES

Low power operation modes enhance energy efficiency, making it suitable for battery-dependent applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width facilitates compatibility with various programming and computational schemes.

No. of I/O Lines: 25

A generous number of I/O lines maximizes interconnectivity, enabling complex interaction with external devices.

Technical Specifications

Microcontrollers STM8S207K6T6CTR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

WHEN TEMPERATURE IS GREATER THAN 105 DEGREE CELCIUS, MICROCONTROLLER SPEED WILL BE REDUCED TO 16 MHZ

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

STM8

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

23

No. of I/O Lines:

25

No. of Terminals:

32

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

6144

RAM Words:

6144

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Maximum Supply Current:

18 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.95 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM8S207K6T6CTR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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