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STM8S207K6T3CTR

STMicroelectronics

STM8S207K6T3CTR by STMicroelectronics

STM8S207K6T3CTR from STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 5.5V and operates at up to 24 MHz. It features 32 terminals, 23 external interrupts, and is ideal for automotive applications due to its -40 °C to 125°C temp range. Its low power mode enhances efficiency in embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

HZD GmbH

Germany . 200,000 parts In-Stock

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200,000

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Cyclops Electronics Ltd

UK . 12,600 parts In-Stock

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12,600

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Vyrian

USA . 8,871 parts In-Stock

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8,871

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Digiode

USA . 2,592 parts In-Stock

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2,592

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Anansix

USA . 2,489 parts In-Stock

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2,489

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,127 parts In-Stock

1+ parts

$1.590

100+ parts

-

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1,127

$1.590

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Microchip USA

USA . 3,493 parts In-Stock

1+ parts

$13.383

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-

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3,493

$13.383

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AZTECH Wire

Italy . 149 parts In-Stock

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$13.770

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149

$13.770

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Component Stockers USA

USA . 1,500 parts In-Stock

1+ parts

$26.790

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1,500

$26.790

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IDEA Electronic Components Group

UK . 1,166 parts In-Stock

1+ parts

$35.440

100+ parts

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$31.896

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1,166

$35.440

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$31.896

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MKK Technologies

India . 1,864 parts In-Stock

1+ parts

$66.643

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1,864

$66.643

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DigiPath Technology Company

USA . 1,864 parts In-Stock

1+ parts

$66.643

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1,864

$66.643

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Lixinc

USA . 17,339 parts In-Stock

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17,339

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Corphita

USA . 4,024 parts In-Stock

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4,024

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Parana Technologies

USA . 1,930 parts In-Stock

1+ parts

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$42.374

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1,930

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$42.374

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Overview

Unlock innovation with the STM8S207K6T3CTR microcontroller from STMicroelectronics, a trusted leader in semiconductor technology. This versatile device excels in automotive and industrial applications, combining robust performance with energy efficiency. Its compact design and low power consumption make it ideal for space-constrained projects, while 32 terminals offer flexible connectivity. Elevate your designs with unparalleled quality and reliability—experience the ST advantage today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures long-term reliability in various environments, making it suitable for automotive applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easier integration into modern circuits, saving board space.

Maximum Supply Voltage: 5.5 V

This specification offers flexibility for designs that require higher supply voltages, enabling compatibility with various systems.

On Chip Data RAM Width: 8

Having 8-bit wide RAM optimizes data handling for applications that use 8-bit microcontroller architecture, enhancing efficiency.

Package Shape: SQUARE

A square package shape aids in uniform PCB layouts and is common in compact applications, facilitating easier assembly.

Bit Size: 8

The 8-bit architecture is standard for many embedded applications, providing ease of programming and resource management.

No. of Terminals: 32

With 32 terminals, this microcontroller offers ample I/O options for a variety of interfacing needs.

Package Style (Meter): FLATPACK, LOW PROFILE

A low-profile package style is advantageous in space-constrained applications, contributing to a sleek design.

Minimum Supply Voltage: 2.95 V

This low minimum supply voltage enables lower power consumption, making it ideal for battery-powered applications.

Maximum Operating Temperature: 125 °C

A high operating temperature range ensures reliable performance in extreme conditions, which is crucial for automotive settings.

CPU Family: STM8

Being part of the STM8 family means access to a well-documented ecosystem and community support for development.

No. of External Interrupts: 23

With 23 external interrupts, this microcontroller can efficiently respond to multiple events, increasing its real-time processing capability.

Minimum Operating Temperature: -40 °C

The extensive temperature range makes this product suitable for use in harsh conditions and outdoor applications.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

This high-quality terminal finish enhances corrosion resistance, ensuring reliable connections in varying environments.

ADC Channels: YES

Integration of ADC channels allows for direct interfacing with analog signals, broadening its application scope.

Terminal Position: QUAD

Quad terminal position offers easier routing on PCBs, facilitating efficient layout design.

ROM Words: 32768

The substantial ROM capacity supports complex applications and firmware, enabling more sophisticated software solutions.

Maximum Seated Height: 1.6 mm

A maximum seated height of 1.6 mm allows for low-profile designs, making it suitable for compact devices.

RAM Words: 6144

With 6144 RAM words, the microcontroller can handle multiple tasks simultaneously, improving performance in multitasking scenarios.

Width: 7 mm

Its compact width is advantageous for space-saving designs in various applications.

Maximum Clock Frequency: 24 MHz

A maximum clock frequency of 24 MHz allows for efficient processing speeds, making it suitable for time-critical applications.

Maximum Time At Peak Reflow Temperature (s): 30

This specification ensures compatibility with standard solder processes, facilitating manufacturability.

Peak Reflow Temperature °C: 260

The high peak reflow temperature indicates robustness during soldering processes, ensuring product reliability.

Length: 7 mm

A compact length enhances integration into small electronic devices, promoting design flexibility.

Temperature Grade: AUTOMOTIVE

Designed specifically for automotive applications, this microcontroller is built to withstand harsh operating conditions.

Peripheral IC Type: MICROCONTROLLER

This microcontroller designation confirms its suitability for a wide range of embedded applications, enhancing versatility.

No. of Timers: 4

The inclusion of four timers allows precise scheduling of tasks, benefiting time-sensitive applications.

RAM Bytes: 6144

The ample RAM size supports complex programs and multiple simultaneous operations, enhancing overall performance.

Technology: CMOS

CMOS technology ensures low power consumption and high efficiency, making it fitting for battery-operated devices.

Terminal Form: GULL WING

Gull-wing terminals promote better solder joint reliability, enhancing the overall robustness of the assembly.

Maximum Supply Current: 18 mA

A low maximum supply current helps in efficient energy usage, extending the battery life of portable devices.

Nominal Supply Voltage: 5 V

The standard nominal voltage simplifies design and integration into existing systems, reducing design complexity.

PWM Channels: YES

Having PWM channels allows for efficient control of motors and other devices, making it versatile for various applications.

ROM Programmability: FLASH

FLASH ROM programmability allows for easy updates and reprogramming, enhancing application flexibility.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch is suitable for high-density designs, allowing for efficient use of board space.

Format: FIXED POINT

Fixed point format is ideal for many control applications, simplifying calculations and improving processing times.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates reasonable handling precautions, ensuring reliability throughout manufacturing and assembly processes.

Speed: 24 rpm

While not directly related to microcontroller performance, this metric might refer to specific application capabilities, demonstrating adaptability.

Low Power Mode: YES

The low power mode functionality ensures energy efficiency in applications requiring prolonged operation, such as battery-powered devices.

On Chip Program ROM Width: 8

An 8-bit program ROM width optimizes the processing efficiency for embedded systems utilizing an 8-bit microcontroller.

No. of I/O Lines: 25

A rich set of 25 I/O lines enables extensive interfacing options for various peripherals and sensors, increasing application potential.

Technical Specifications

Microcontrollers STM8S207K6T3CTR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

WHEN TEMPERATURE IS GREATER THAN 105 DEGREE CELCIUS, MICROCONTROLLER SPEED WILL BE REDUCED TO 16 MHZ

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

STM8

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

23

No. of I/O Lines:

25

No. of Terminals:

32

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

6144

RAM Words:

6144

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Maximum Supply Current:

18 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.95 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM8S207K6T3CTR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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