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STM8S105K6B6

STMicroelectronics

STM8S105K6B6 by STMicroelectronics

STM8S105K6B6 microcontroller from STMicroelectronics operates at a max voltage of 5.5V and features 32 terminals with 25 I/O lines. It supports industrial applications with a temp range of -40 °C to 85 °C, offering 16 MHz speed and integrated ADC channels. Ideal for low-power designs, it includes flash ROM and multiple timers for versatile control tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,201 parts In-Stock

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7,201

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Anansix

USA . 2,355 parts In-Stock

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2,355

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Digiode

USA . 2,012 parts In-Stock

1+ parts

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2,012

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Pegasus Components GmbH

Germany . 960 parts In-Stock

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960

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 121 parts In-Stock

1+ parts

$9.699

100+ parts

-

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121

$9.699

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AZTECH Wire

Italy . 684 parts In-Stock

1+ parts

$18.910

100+ parts

-

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684

$18.910

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Ampacity Inc.

Singapore . 1,324 parts In-Stock

1+ parts

$29.000

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-

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1,324

$29.000

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IDEA Electronic Components Group

UK . 546 parts In-Stock

1+ parts

$36.374

100+ parts

-

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$32.737

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546

$36.374

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$32.737

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MKK Technologies

India . 191 parts In-Stock

1+ parts

$68.399

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191

$68.399

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DigiPath Technology Company

USA . 191 parts In-Stock

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$68.399

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191

$68.399

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Component Stockers USA

USA . 392 parts In-Stock

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$99.990

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392

$99.990

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A-Z Elektronik GmbH

Germany . 5,717 parts In-Stock

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5,717

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Corphita

USA . 4,827 parts In-Stock

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Perfect Parts

USA . 1,075 parts In-Stock

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1,075

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GreenTree Electronics

Israel . 960 parts In-Stock

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960

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Kepictronics

USA . 739 parts In-Stock

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739

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Parana Technologies

USA . 524 parts In-Stock

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$43.491

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524

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$43.491

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Overview

Unlock the potential of your projects with the STM8S105K6B6 microcontroller from STMicroelectronics, a leader in innovative semiconductor solutions. Renowned for their quality and reliability, STMicroelectronics delivers exceptional performance tailored for a variety of applications—from automotive systems to industrial automation. With its low power consumption, versatile I/O options, and robust design, the STM8S105K6B6 empowers engineers to create efficient, high-performance devices that stand the test of time. Experience seamless integration and unmatched value today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliable performance and protects the microcontroller from environmental factors.

Maximum Supply Voltage: 5.5 V

This voltage tolerance allows versatility in various applications, providing flexibility in design.

On Chip Data RAM Width: 8

An 8-bit data RAM width is suitable for a range of standard applications, striking a balance between complexity and efficiency.

Package Shape: RECTANGULAR

The rectangular shape is a common design that facilitates easy integration on PCBs.

Bit Size: 8

An 8-bit architecture makes this microcontroller ideal for simple control tasks and low-power applications.

No. of Terminals: 32

With 32 pins, this microcontroller can support a variety of input/output configurations, enabling diverse connectivity.

Package Style (Meter): IN-LINE, SHRINK PITCH

This packaging style enhances space efficiency on circuit boards, which is valuable for compact designs.

Minimum Supply Voltage: 2.95 V

Low minimum supply voltage makes the microcontroller suitable for battery-powered applications, extending operational lifespan.

Maximum Operating Temperature: 85 °C

Rated for high temperatures, this microcontroller can operate in demanding environments, ensuring reliability.

CPU Family: STM8

Part of the STM8 family, it benefits from a legacy of performance and community support, making it easier to develop and troubleshoot.

No. of External Interrupts: 23

A high number of external interrupts enhances responsiveness to events, making it suitable for real-time applications.

Minimum Operating Temperature: -40 °C

Designed for extreme conditions, this microcontroller is ideal for industrial applications needing robust performance.

ADC Channels: YES

On-chip ADC functionality allows for direct analog signal processing, streamlining designs for sensor applications.

Terminal Position: DUAL

Dual terminal positions allow for more flexible board layouts and easier integration with other components.

ROM Words: 32768

With substantial ROM, this microcontroller can store larger program codes, enabling more complex applications.

Maximum Seated Height: 5.08 mm

A low profile height helps in space-constrained designs while maintaining excellent thermal management.

RAM Words: 1024

Adequate RAM allows for better data handling capabilities for more demanding applications while keeping costs manageable.

Width: 10.16 mm

Compact width ensures the microcontroller fits well in small devices, aiding in product miniaturization.

Maximum Clock Frequency: 16 MHz

A clock frequency of 16 MHz ensures efficient processing and handling of tasks without significant power consumption.

Length: 27.94 mm

Standard length supports common PCB layout practices, facilitating easier design integration.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliability in harsh operating environments, making it suitable for critical applications.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it combines computational power with peripheral interfaces, ideal for control applications.

No. of Timers: 4

Multiple timers provide versatile timing functions for a variety of applications, enhancing performance in control tasks.

RAM Bytes: 2048

A generous RAM size allows for improved performance in data-heavy applications, providing flexibility in coding.

Technology: CMOS

CMOS technology offers low power consumption and higher efficiency, making it suitable for battery-operated devices.

Terminal Form: THROUGH-HOLE

Through-hole form factor allows for easy soldering and a secure connection with the PCB, enhancing reliability.

Maximum Supply Current: 8 mA

Low supply current minimizes power requirements, ideal for energy-efficient applications.

Nominal Supply Voltage: 5 V

5V nominal supply voltage aligns with common standards, ensuring compatibility with many devices and systems.

PWM Channels: YES

Integrated PWM channels enable easy control of motors and brightness in LEDs, supporting a diverse range of applications.

ROM Programmability: FLASH

Flash programmability allows users to easily update firmware, adding convenience and flexibility during the product lifecycle.

Terminal Pitch: 1.778 mm

Standard terminal pitch supports compatibility with a wide range of PCBs and simplifies assembly.

Format: FIXED POINT

Fixed-point format aligns well with many industrial applications, making it easier to handle numeric calculations.

Speed: 16 rpm

16 rpm speed gives adequate responsiveness for various control applications without overwhelming system resources.

Low Power Mode: YES

Low power mode extends battery life in portable devices, essential for mobile applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width ensures efficient code execution for various applications without unnecessary complexity.

No. of I/O Lines: 25

25 I/O lines provide extensive connectivity options for interfacing with various sensors and devices, enhancing versatility.

Technical Specifications

Microcontrollers STM8S105K6B6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

STM8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

JESD-30 Code:

R-PDIP-T32

Length:

27.94 mm

Low Power Mode:

YES

No. of External Interrupts:

23

No. of I/O Lines:

25

No. of Terminals:

32

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP32,.4

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

RAM Bytes:

2048

RAM Words:

1024

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

5.08 mm

Speed:

16 rpm

Maximum Supply Current:

8 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.95 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.778 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10.16 mm

Peripheral IC Type:

Trade Compliance

STM8S105K6B6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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