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STM8S105K4U6ATR

STMicroelectronics

STM8S105K4U6ATR by STMicroelectronics

STM8S105K4U6ATR by STMicroelectronics is an 8-bit microcontroller with 16MHz clock frequency, 2048 RAM bytes, and 16348 ROM words. Ideal for industrial applications requiring low power mode, it features 23 external interrupts and 4 timers for versatile peripheral control.

Median Price

$0.834

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 186,600 parts In-Stock

1+ parts

$0.736

100+ parts

-

1k+ parts

-

10k+ parts

-

186,600

$0.736

-

-

-

Arrow

USA . 178,704 parts In-Stock

1+ parts

$0.931

100+ parts

-

1k+ parts

-

10k+ parts

-

178,704

$0.931

-

-

-

Verical

USA . 178,704 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

178,704

-

-

-

-

EBV Elektronik

Germany . 57,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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57,000

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,498 parts In-Stock

1+ parts

$0.415

100+ parts

-

1k+ parts

-

10k+ parts

-

1,498

$0.415

-

-

-

Vyrian

USA . 3,201 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,201

-

-

-

-

Anansix

USA . 2,098 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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2,098

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,696 parts In-Stock

1+ parts

$0.393

100+ parts

-

1k+ parts

-

10k+ parts

-

2,696

$0.393

-

-

-

Vigor

Singapore . 4,146 parts In-Stock

1+ parts

$0.960

100+ parts

-

1k+ parts

-

10k+ parts

-

4,146

$0.960

-

-

-

Microchip USA

USA . 5,272 parts In-Stock

1+ parts

$8.212

100+ parts

-

1k+ parts

-

10k+ parts

-

5,272

$8.212

-

-

-

AZTECH Wire

Italy . 366 parts In-Stock

1+ parts

$13.010

100+ parts

-

1k+ parts

-

10k+ parts

-

366

$13.010

-

-

-

IDEA Electronic Components Group

UK . 601 parts In-Stock

1+ parts

$50.913

100+ parts

-

1k+ parts

$45.822

10k+ parts

-

601

$50.913

-

$45.822

-

MKK Technologies

India . 776 parts In-Stock

1+ parts

$95.738

100+ parts

-

1k+ parts

-

10k+ parts

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776

$95.738

-

-

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DigiPath Technology Company

USA . 776 parts In-Stock

1+ parts

$95.738

100+ parts

-

1k+ parts

-

10k+ parts

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776

$95.738

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-

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Eastek

USA . 66,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.580

10k+ parts

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66,000

-

-

$1.580

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Perfect Parts

USA . 43,680 parts In-Stock

1+ parts

-

100+ parts

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43,680

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QUARKTWIN TECHNOLOGY LTD

USA . 24,792 parts In-Stock

1+ parts

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100+ parts

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24,792

-

-

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Kepictronics

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

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9,000

-

-

-

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GreenTree Electronics

Israel . 3,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,000

-

-

-

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Parana Technologies

USA . 848 parts In-Stock

1+ parts

-

100+ parts

$60.874

1k+ parts

-

10k+ parts

-

848

-

$60.874

-

-

Overview

Discover the STM8S105K4U6ATR microcontroller by STMicroelectronics, setting new standards in quality and performance. Designed with cutting-edge technology, this versatile chip offers a wide range of applications in industrial settings. Benefit from its low power consumption, high-speed operation, and reliable performance. With a maximum supply voltage of 5.5V and a peak clock frequency of 16MHz, this microcontroller is the perfect choice for your next project. Unlock the potential of your designs with the STM8S105K4U6ATR.

Feature Benefit Bullets

Surface Mount: YES

Surface mount packaging allows for easy and efficient PCB assembly, saving time and space in the final product.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages, making it versatile for various applications.

On Chip Data RAM Width: 8

Having a wide data RAM width allows for quicker data processing and storage.

Package Shape: SQUARE

Square package shape helps in uniform heat dissipation and easier placement on the PCB.

Bit Size: 8

8-bit architecture provides a good balance between performance and cost for many applications.

No. of Terminals: 32

Having a sufficient number of terminals allows for easy connectivity and interfacing with external components.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style options offer flexibility in designing and mounting the microcontroller in different environments.

Minimum Supply Voltage: 2.95 V

The low minimum supply voltage enables operation in low-power applications or battery-operated devices.

Maximum Operating Temperature: 85 °C

With a high operating temperature range, the microcontroller can be used in a wide variety of environments.

CPU Family: STM8

Part of the STM8 CPU family, known for its performance and reliability in embedded systems.

No. of External Interrupts: 23

Having a high number of external interrupts allows the microcontroller to respond quickly to external events.

Minimum Operating Temperature: -40 °C

Can operate in extreme low-temperature conditions, suitable for outdoor or industrial applications.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance for reliable connections.

ADC Channels: YES

Integrated ADC channels enable analog signal processing and sensing capabilities in the microcontroller.

Terminal Position: QUAD

Quad terminal position offers efficient routing of connections and saves space on the PCB.

ROM Words: 16348

Large ROM capacity allows for storing complex programs and data in the microcontroller.

Maximum Seated Height: 0.6 mm

Low seated height makes it suitable for compact designs with limited vertical clearance.

RAM Words: 1024

Having sufficient RAM words allows for efficient data processing and storage during runtime.

Width: 5 mm

Compact width size enables easy placement on the PCB and saves space in the overall product design.

Maximum Clock Frequency: 16 MHz

High clock frequency supports fast execution of instructions, suitable for real-time applications.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during assembly process without affecting performance.

Length: 5 mm

Compact length size allows for efficient placement on the PCB and saves space in the overall product design.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh environmental conditions.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it integrates various peripherals and interfaces for complete system control.

No. of Timers: 4

Multiple timers provide versatile timing and control functions for different applications.

RAM Bytes: 2048

Having ample RAM storage capacity allows for efficient data processing and temporary storage during operation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for battery-operated devices.

Terminal Form: NO LEAD

No-lead terminal form simplifies the manufacturing process and provides better reliability in solder connections.

Maximum Supply Current: 8 mA

Low maximum supply current consumption helps in saving power and extending battery life in portable devices.

Nominal Supply Voltage: 5 V

5V nominal supply voltage is a common standard in many electronic systems, ensuring compatibility.

PWM Channels: YES

PWM channels enable precise control of analog signals such as motor speed or LED brightness.

ROM Programmability: FLASH

Flash ROM allows for flexible and easy reprogramming of the microcontroller without requiring external programming tools.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting on the PCB, saving space and allowing for compact designs.

Format: FIXED POINT

Fixed-point format simplifies arithmetic operations and improves computational efficiency in the microcontroller.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 ensures safe handling and storage of the microcontroller during manufacturing processes.

Speed: 16 rpm

High speed capabilities allow for fast data processing and response times in time-critical applications.

Low Power Mode: YES

Low power mode functionality enhances energy efficiency and extends battery life in power-constrained applications.

On Chip Program ROM Width: 8

Wide on-chip program ROM width allows for storing and executing program instructions efficiently within the microcontroller.

No. of I/O Lines: 25

Having multiple I/O lines enables versatile interfacing and connectivity with external devices and peripherals.

Technical Specifications

Microcontrollers STM8S105K4U6ATR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

STM8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

23

No. of I/O Lines:

25

No. of Terminals:

32

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

RAM Words:

1024

ROM Words:

16348

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

16 rpm

Maximum Supply Current:

8 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.95 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Peripheral IC Type:

Trade Compliance

STM8S105K4U6ATR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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