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STM8S105K4B6

STMicroelectronics

STM8S105K4B6 by STMicroelectronics

STM8S105K4B6 by STMicroelectronics is an 8-bit microcontroller with a max clock frequency of 16 MHz. It has 1024 words of RAM and can operate in low power mode. This microcontroller is commonly used in industrial applications requiring high-speed processing and low power consumption.

Median Price

$1.908

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 160 parts In-Stock

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-

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160

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Distributors (In-Stock)

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Nova Conductors

Japan . 27 parts In-Stock

1+ parts

$1.908

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27

$1.908

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Digiode

USA . 4,386 parts In-Stock

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4,386

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Chip Stock

USA . 3,892 parts In-Stock

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3,892

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Vyrian

USA . 2,230 parts In-Stock

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2,230

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Anansix

USA . 637 parts In-Stock

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637

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bastille Electronics

Australia . 300 parts In-Stock

1+ parts

$1.908

100+ parts

$1.813

1k+ parts

$1.722

10k+ parts

$1.698

300

$1.908

$1.813

$1.722

$1.698

Continental Prestige Electronics

USA . 4,761 parts In-Stock

1+ parts

$1.908

100+ parts

-

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-

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$1.870

4,761

$1.908

-

-

$1.870

Argo Parts USA

USA . 2,205 parts In-Stock

1+ parts

$1.908

100+ parts

-

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2,205

$1.908

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Vigor

Singapore . 927 parts In-Stock

1+ parts

$2.230

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-

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927

$2.230

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AZTECH Wire

Italy . 437 parts In-Stock

1+ parts

$14.075

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-

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437

$14.075

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Microchip USA

USA . 151 parts In-Stock

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$26.958

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151

$26.958

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Ampacity Inc.

Singapore . 160 parts In-Stock

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$34.000

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160

$34.000

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Corohmni

South Africa . 745 parts In-Stock

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$35.186

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745

$35.186

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Aztec Data Supply Inc.

USA . 27,090 parts In-Stock

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$39.860

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27,090

$39.860

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IDEA Electronic Components Group

UK . 1,735 parts In-Stock

1+ parts

$75.974

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$68.376

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1,735

$75.974

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$68.376

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MKK Technologies

India . 1,940 parts In-Stock

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$142.863

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1,940

$142.863

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DigiPath Technology Company

USA . 1,940 parts In-Stock

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$142.863

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1,940

$142.863

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Lixinc

USA . 16,491 parts In-Stock

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16,491

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Perfect Parts

USA . 2,294 parts In-Stock

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2,294

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Corphita

USA . 1,462 parts In-Stock

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1,462

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Parana Technologies

USA . 793 parts In-Stock

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$90.838

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793

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$90.838

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GreenTree Electronics

Israel . 272 parts In-Stock

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272

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Overview

Discover the STM8S105K4B6 by STMicroelectronics, a high-quality microcontroller that brings a world of possibilities to your projects. As a leading manufacturer in the industry, STMicroelectronics guarantees reliability and performance. With its wide range of applications and advanced features, this microcontroller will empower you to create innovative solutions. From industrial automation to consumer electronics, the STM8S105K4B6 delivers outstanding value and numerous benefits. Experience seamless integration, enhanced functionality, and maximum efficiency with this exceptional product. Unleash your creativity and unlock endless opportunities with the STM8S105K4B6 by STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, ideal for compact and portable devices.

Maximum Supply Voltage: 5.5 V

Wide range of supply voltage allows flexibility in powering the device.

On Chip Data RAM Width: 8

Sufficient data RAM width for efficient data processing and storage.

Package Shape: RECTANGULAR

Common and versatile package shape for easy integration into various designs.

Bit Size: 8

Standard bit size for handling data processing tasks effectively.

No. of Terminals: 32

Sufficient number of terminals for connecting external components and peripherals.

Package Style (Meter): IN-LINE, SHRINK PITCH

Compact package style suitable for space-constrained applications.

Minimum Supply Voltage: 2.95 V

Low minimum supply voltage for energy-efficient operation.

Maximum Operating Temperature: 85 °C

Wide operating temperature range suitable for industrial environments.

CPU Family: STM8

Efficient and reliable CPU family for high-performance microcontroller applications.

No. of External Interrupts: 23

Sufficient external interrupts for handling real-time events and critical tasks.

Minimum Operating Temperature: -40 °C

Operates reliably in extreme cold environments.

Terminal Finish: MATTE TIN

Matte tin finish for enhanced solderability and durability.

ADC Channels: YES

Analog-to-digital conversion capability for interfacing with analog sensors and devices.

Terminal Position: DUAL

Dual terminal position for flexible mounting options.

ROM Words: 16348

Sufficient ROM capacity for storing program instructions and data.

Maximum Seated Height: 5.08 mm

Low seated height for slim and compact device designs.

RAM Words: 1024

Adequate RAM capacity for temporary data storage and processing.

Width: 10.16 mm

Compact width for space-efficient PCB layout.

Maximum Clock Frequency: 16 MHz

High clock frequency for fast and responsive operation.

Length: 27.94 mm

Optimal length for accommodating various components on the PCB.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range for reliable operation in harsh environments.

Peripheral IC Type: MICROCONTROLLER

Dedicated microcontroller IC for versatile control and processing capabilities.

No. of Timers: 4

Multiple timers for precise timing and scheduling of tasks.

RAM Bytes: 2048

Adequate RAM capacity in bytes for efficient data manipulation and storage.

Technology: CMOS

CMOS technology for low power consumption and reliable operation.

Terminal Form: THROUGH-HOLE

Through-hole terminal form for easy soldering and secure connections.

Maximum Supply Current: 8 mA

Low supply current for energy-efficient operation.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage for compatibility with common power sources.

PWM Channels: YES

Pulse width modulation (PWM) channels for precise control of output signals.

ROM Programmability: FLASH

Flash ROM programmability for easy firmware updates and modifications.

Terminal Pitch: 1.778 mm

Standard terminal pitch for compatibility with various PCB layouts.

Format: FIXED POINT

Fixed-point format for accurate numerical calculations and data processing.

Speed: 16 rpm

Operates at a speed of 16 revolutions per minute for precise control applications.

Low Power Mode: YES

Low power mode for energy-saving operation and extended battery life.

On Chip Program ROM Width: 8

On-chip program ROM width of 8 for efficient storage of program code.

No. of I/O Lines: 25

Sufficient I/O lines for connecting and controlling external devices and peripherals.

Technical Specifications

Microcontrollers STM8S105K4B6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

STM8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

JESD-30 Code:

R-PDIP-T32

JESD-609 Code:

e3

Length:

27.94 mm

Low Power Mode:

YES

No. of External Interrupts:

23

No. of I/O Lines:

25

No. of Terminals:

32

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP32,.4

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Qualification:

Not Qualified

RAM Bytes:

2048

RAM Words:

1024

ROM Words:

16348

ROM Programmability:

FLASH

Maximum Seated Height:

5.08 mm

Speed:

16 rpm

Maximum Supply Current:

8 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.95 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.778 mm

Terminal Position:

DUAL

Width:

10.16 mm

Peripheral IC Type:

Trade Compliance

STM8S105K4B6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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