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STM8S105C6T3TR

STMicroelectronics

STM8S105C6T3TR by STMicroelectronics

STM8S105C6T3TR microcontroller from STMicroelectronics features a 16 MHz CPU, 2 KB RAM, and operates within -40 °C to 125°C. With 35 external interrupts and low power modes, it's ideal for automotive applications. Its compact design ensures efficient integration in various systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,373 parts In-Stock

1+ parts

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6,373

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Digiode

USA . 4,664 parts In-Stock

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4,664

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Anansix

USA . 191 parts In-Stock

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191

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,420 parts In-Stock

1+ parts

$1.430

100+ parts

-

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-

10k+ parts

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2,420

$1.430

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Microchip USA

USA . 3,929 parts In-Stock

1+ parts

$12.020

100+ parts

$11.940

1k+ parts

$11.910

10k+ parts

$11.870

3,929

$12.020

$11.940

$11.910

$11.870

AZTECH Wire

Italy . 984 parts In-Stock

1+ parts

$15.280

100+ parts

-

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984

$15.280

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Component Stockers USA

USA . 2,146 parts In-Stock

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$29.610

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2,146

$29.610

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IDEA Electronic Components Group

UK . 978 parts In-Stock

1+ parts

$37.244

100+ parts

-

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$33.520

10k+ parts

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978

$37.244

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$33.520

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MKK Technologies

India . 2,073 parts In-Stock

1+ parts

$70.036

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2,073

$70.036

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DigiPath Technology Company

USA . 2,073 parts In-Stock

1+ parts

$70.036

100+ parts

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2,073

$70.036

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Lixinc

USA . 16,096 parts In-Stock

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16,096

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Futuretech Components

Singapore . 2,915 parts In-Stock

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2,915

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Corphita

USA . 1,309 parts In-Stock

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1,309

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Parana Technologies

USA . 964 parts In-Stock

1+ parts

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100+ parts

$44.531

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964

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$44.531

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Overview

Unlock endless possibilities with the STM8S105C6T3TR microcontroller by STMicroelectronics! Renowned for reliability and innovation, STMicroelectronics delivers exceptional quality that empowers your projects. This versatile MCU excels in automotive applications, ensuring optimal performance in demanding environments. Enjoy low power consumption, robust features, and seamless integration, making it the smart choice for engineers seeking efficiency and excellence. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials in the packaging ensures durability and protects the microcontroller against environmental factors.

Surface Mount: YES

Surface mount technology allows for compact designs and facilitates automated assembly, making it ideal for modern electronic applications.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V provides flexibility in system design, allowing it to operate reliably within specified limits.

On Chip Data RAM Width: 8

An 8-bit data RAM width enables efficient processing of byte-oriented data, suitable for a variety of applications.

Package Shape: SQUARE

The square package shape helps in efficient space utilization on PCB and simplifies layout designs.

Bit Size: 8

With an 8-bit architecture, this microcontroller is well-suited for simple applications in embedded systems.

No. of Terminals: 48

Having 48 terminals allows for plenty of I/O options, increasing interface capabilities with other components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack and low-profile design make integration into compact devices easier, maintaining a sleek profile.

Minimum Supply Voltage: 2.95 V

With a low minimum supply voltage, this microcontroller is energy-efficient, making it suitable for battery-powered devices.

Maximum Operating Temperature: 125 C

A high operating temperature threshold (125 °C) ensures reliability in demanding automotive environments.

CPU Family: STM8

Part of the STM8 family, known for cost-effectiveness and ease of use, making it ideal for both beginners and professionals.

No. of External Interrupts: 35

Having 35 external interrupts enhances the microcontroller's ability to respond to real-time events effectively.

Minimum Operating Temperature: -40 C

The ability to function in extreme low temperatures makes this microcontroller suitable for automotive and industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent corrosion resistance and ensures reliable electrical connections.

ADC Channels: YES

Integrated ADC channels allow for the conversion of analog signals, expanding usability for various sensing applications.

Terminal Position: QUAD

Quad terminal positioning maximizes connectivity options while ensuring efficient PCB layout.

ROM Words: 32768

A ROM of 32,768 words allows for extensive program storage, enabling complex functionalities.

Maximum Seated Height: 1.6 mm

A low seated height is advantageous for maintaining a slim profile in compact device designs.

RAM Words: 1024

A RAM of 1,024 words ensures ample temporary data storage for effective processing and program execution.

Width: 7 mm

A compact width of 7 mm helps save space on PCBs, suitable for miniaturized or embedded applications.

Maximum Clock Frequency: 16 MHz

With a maximum clock frequency of 16 MHz, it can handle moderately complex tasks efficiently and respond quickly.

Maximum Time At Peak Reflow Temperature: 40 s

The microcontroller's parameters ensure compatibility with standard soldering processes, aiding in manufacturing.

Peak Reflow Temperature: 260 C

A peak reflow temperature of 260 °C verifies the microcontroller's resilience during soldering, ensuring durability.

Length: 7 mm

The 7 mm length allows for flexible placement on the PCB while maintaining an efficient layout.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, ensuring reliability and performance under various temperature stresses.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates multiple functionalities, reducing the need for additional components and simplifying design.

No. of Timers: 4

With four timers, it offers enhanced control for timing applications and can manage multiple tasks simultaneously.

RAM Bytes: 2048

2048 bytes of RAM supports applications demanding significant temporary data storage for improved performance.

Technology: CMOS

CMOS technology ensures low power consumption, making it suitable for battery-operated applications.

Terminal Form: GULL WING

The gull wing terminal design is ideal for surface mounting, providing a secure connection and ease of handling.

Maximum Supply Current: 8 mA

Low maximum supply current enhances energy efficiency, essential for portable devices.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is standard for many digital circuits, ensuring easy integration.

PWM Channels: YES

Integrated PWM channels support motor control and signal modulation applications effectively.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications in software without requiring physical changes to hardware.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch improves connection density and maximizes space on smaller PCBs.

Format: FIXED POINT

Fixed-point format enables efficient mathematical operations, beneficial for applications requiring consistent processing.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, guiding safe handling and storage processes.

Speed: 16 rpm

Supports applications that require precise speed control, making it a versatile option for various tasks.

Low Power Mode: YES

Low power mode functionality extends battery life in embedded systems, especially important for IoT devices.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows for efficient storage and execution of firmware and applications.

No. of I/O Lines: 38

38 I/O lines offer extensive interfacing capabilities, making it capable of handling multiple peripheral devices.

Technical Specifications

Microcontrollers STM8S105C6T3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

STM8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

35

No. of I/O Lines:

38

No. of Terminals:

48

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

2048

RAM Words:

1024

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Current:

8 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.95 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM8S105C6T3TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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