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STM8S103F2P3

STMicroelectronics

STM8S103F2P3 by STMicroelectronics

STM8S103F2P3 by STMicroelectronics is an 8-bit microcontroller with 4096 ROM words, 1024 RAM bytes, and 640 data EEPROM size. It operates at a max clock frequency of 16 MHz and features 5-Ch 10-Bit ADC channels. Ideal for automotive applications due to its temperature grade and connectivity options like I2C, IRDA, LIN, SPI, UART.

Median Price

$1.205

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

EBV Elektronik

Germany . 814 parts In-Stock

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814

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Vyrian

USA . 7,910 parts In-Stock

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7,910

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Digiode

USA . 3,782 parts In-Stock

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Anansix

USA . 2,147 parts In-Stock

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Bristol Electronics

USA . 168 parts In-Stock

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-

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$1.205

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$0.723

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168

-

$1.205

$0.723

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Dan-Mar Components

USA . 168 parts In-Stock

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168

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Vigor

Singapore . 2,434 parts In-Stock

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$1.760

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$1.760

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Microchip USA

USA . 1,631 parts In-Stock

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$14.170

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1,631

$14.170

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AZTECH Wire

Italy . 464 parts In-Stock

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$15.160

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464

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Component Stockers USA

USA . 5,173 parts In-Stock

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$16.010

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$16.010

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IDEA Electronic Components Group

UK . 313 parts In-Stock

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$39.131

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$35.218

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MKK Technologies

India . 1,469 parts In-Stock

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$73.584

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1,469

$73.584

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DigiPath Technology Company

USA . 1,469 parts In-Stock

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$73.584

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RC Electronics

USA . 25,000 parts In-Stock

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Kepictronics

USA . 13,000 parts In-Stock

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Corphita

USA . 4,651 parts In-Stock

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Perfect Parts

USA . 3,983 parts In-Stock

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Parana Technologies

USA . 1,242 parts In-Stock

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$46.787

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Eastek

USA . 1,184 parts In-Stock

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iodParts Technologies Inc.

India . 168 parts In-Stock

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Overview

Unlock endless possibilities with the STM8S103F2P3 microcontroller by STMicroelectronics. Known for their superior quality and reliability, STMicroelectronics offers a wide range of applications for this product in various industries. With its compact size, low power consumption, and high performance capabilities, this microcontroller provides exceptional value to customers looking to optimize their designs. Experience seamless connectivity, precise control, and innovative solutions with the STM8S103F2P3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and cost-effective, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for efficient assembly and better space utilization on PCBs.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages, providing flexibility in power requirements.

Bit Size: 8

8-bit processing capability makes it suitable for a variety of applications that do not require high computational power.

Power Supplies (V): 3.3/5

Supports both 3.3V and 5V power supplies, making it compatible with different types of systems.

No. of Terminals: 20

Sufficient number of terminals for connecting peripherals and external components.

Minimum Operating Temperature: -40 °C

Wide operating temperature range enables the product to function in harsh environments.

ADC Channels: YES

Built-in Analog to Digital Converters provide flexibility in interfacing with analog sensors and signals.

ROM Words: 4096

Large ROM capacity for storing program instructions and data.

Width: 4.4 mm

Compact width facilitates easy integration into space-constrained designs.

Maximum Clock Frequency: 16 MHz

High clock frequency allows for fast data processing and execution of instructions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Analog To Digital Convertors: 5-Ch 10-Bit

Multiple ADC channels with 10-bit resolution for accurate analog signal conversion.

Connectivity: I2C, IRDA, LIN, SPI, UART

Multiple communication interfaces provide versatile connectivity options for external devices.

ROM Programmability: FLASH

Flash programmable ROM allows for easy and quick updates to firmware and software.

No. of I/O Lines: 16

Sufficient I/O lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers STM8S103F2P3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

16

No. of Terminals:

20

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

4.75 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.95 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

640

Connectivity:

I2C, IRDA, LIN, SPI, UART

Peripherals:

BOD, POR, TIMER(6)

Analog To Digital Convertors:

5-Ch 10-Bit

Trade Compliance

STM8S103F2P3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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