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STM8L162M8T6TR

STMicroelectronics

STM8L162M8T6TR by STMicroelectronics

STM8L162M8T6TR by STMicroelectronics is an 8-bit microcontroller with 80 terminals, operating at a max frequency of 16 MHz. It features 2-Ch 12-Bit DACs and 28-Ch 12-Bit ADCs, suitable for industrial applications requiring BOD, LCD, RTC, and TIMER(8) peripherals. With a wide temperature range (-40 to +85 °C), it offers I2C, IRDA, SPI(2), and USART(3) connectivity options.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,298 parts In-Stock

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6,298

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Digiode

USA . 1,885 parts In-Stock

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1,885

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Anansix

USA . 1,436 parts In-Stock

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1,436

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,512 parts In-Stock

1+ parts

$1.950

100+ parts

-

1k+ parts

-

10k+ parts

-

1,512

$1.950

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Microchip USA

USA . 3,527 parts In-Stock

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$16.825

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-

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3,527

$16.825

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IDEA Electronic Components Group

UK . 287 parts In-Stock

1+ parts

$19.252

100+ parts

-

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$17.327

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-

287

$19.252

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$17.327

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AZTECH Wire

Italy . 766 parts In-Stock

1+ parts

$20.540

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766

$20.540

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MKK Technologies

India . 289 parts In-Stock

1+ parts

$36.202

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289

$36.202

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DigiPath Technology Company

USA . 289 parts In-Stock

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$36.202

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289

$36.202

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Parana Technologies

USA . 234 parts In-Stock

1+ parts

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$23.019

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234

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$23.019

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Corphita

USA . 76 parts In-Stock

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76

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Overview

Unlock endless possibilities with the STM8L162M8T6TR microcontroller by STMicroelectronics. Built with superior quality and precision, this device offers exceptional value to customers in various applications. Whether you're designing IoT devices, consumer electronics, or industrial systems, this microcontroller delivers reliable performance and efficiency. Trust the industry-leading manufacturer, STMicroelectronics, to provide cutting-edge technology that empowers innovation and drives success. Experience the advantages of the STM8L162M8T6TR and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material ensures durability and protects the internal components, making this product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage of 3.6V provides flexibility in power supply options and compatibility with various systems.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the circuit board, making the product suitable for compact designs.

Bit Size: 8

8-bit architecture provides a good balance between performance and cost, making this microcontroller suitable for a wide range of applications.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages (2V and 3.3V) allows for compatibility with different power sources, enhancing the flexibility of the product.

No. of Terminals: 80

With 80 terminals, this microcontroller offers ample connectivity options for interfacing with external devices and peripherals.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style ensures easy integration into compact designs while maintaining a high level of reliability.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage of 1.8V allows for efficient power consumption and operation in low-power applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85 °C ensures reliable performance in various environmental conditions, including industrial settings.

CPU Family: STM8

Being part of the STM8 CPU family ensures compatibility with a range of development tools and software libraries, making it easy to program and integrate into projects.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40 °C allows for reliable operation even in extreme cold environments, expanding the range of applications where this microcontroller can be used.

ADC Channels: YES

The presence of Analog-to-Digital Converter (ADC) channels allows for the conversion of analog signals to digital data, enabling the microcontroller to interface with sensors and other analog devices.

DMA Channels: YES

Direct Memory Access (DMA) channels enable efficient data transfer between peripherals and memory without CPU intervention, enhancing the performance and responsiveness of the system.

Terminal Position: QUAD

Quad terminal position offers easy connectivity and ensures secure placement on the circuit board, enhancing the reliability of the product.

ROM Words: 65536

With 65536 ROM words, this microcontroller offers ample storage for program code, data, and other firmware, supporting complex applications and features.

Digital To Analog Convertors: 2-Ch 12-Bit

Digital-to-Analog Converters (DAC) with 2 channels and 12-bit resolution enable the microcontroller to generate accurate analog signals, suitable for audio processing and other analog output applications.

Width: 14 mm

Compact width of 14mm allows for space-efficient placement on the circuit board, making it ideal for compact designs and miniaturized electronics.

Data EEPROM Size: 2K

2K of data Electrically Erasable Programmable Read-Only Memory (EEPROM) provides non-volatile storage for critical data, configuration settings, and parameters.

Peripherals: BOD, LCD, RTC, TIMER(8)

Built-in peripherals such as Brown-Out Detector (BOD), LCD interface, Real-Time Clock (RTC), and 8 Timers enhance the functionality and versatility of this microcontroller for various applications.

Maximum Clock Frequency: 16 MHz

High maximum clock frequency of 16MHz allows for speedy execution of instructions and real-time processing, ensuring optimal performance in time-critical applications.

Length: 14 mm

Compact length of 14mm complements the width and square package shape, facilitating space-efficient placement on the circuit board.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments, making this microcontroller suitable for industrial automation and control systems.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, this product is designed for embedded applications, offering a combination of processing power, memory, and peripherals on a single integrated circuit.

RAM Bytes: 4096

4096 bytes of Random Access Memory (RAM) provide temporary storage for data and variables during program execution, enabling efficient data manipulation and processing.

Terminal Form: GULL WING

Gull wing terminal form offers secure and robust solder joints for reliable electrical connections, ensuring stable operation in demanding conditions.

Analog To Digital Convertors: 28-Ch 12-Bit

Analog-to-Digital Converters (ADC) with 28 channels and 12-bit resolution enable precise conversion of multiple analog signals, making this microcontroller suitable for multi-channel sensor interfaces and data acquisition systems.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage of 3.3V ensures stable and reliable operation within the specified voltage range, protecting the microcontroller from overvoltage conditions.

PWM Channels: YES

Pulse Width Modulation (PWM) channels allow for precise control of analog output signals, making this microcontroller suitable for applications such as motor control, LED dimming, and audio processing.

Connectivity: I2C, IRDA, SPI(2), USART(3)

Support for communication protocols such as I2C, Infrared Data Association (IRDA), Serial Peripheral Interface (SPI), and Universal Synchronous/Asynchronous Receiver/Transmitter (USART) enables versatile connectivity options for interfacing with other devices and systems.

ROM Programmability: FLASH

Flash programmability allows for easy and efficient updating of firmware and software, enabling agile development and customization of applications.

Terminal Pitch: 0.65 mm

Fine terminal pitch of 0.65mm allows for high-density mounting on the circuit board, accommodating more functionality in a compact form factor.

Speed: 16 rpm

With a speed of 16 revolutions per minute (rpm), this microcontroller can handle tasks efficiently and swiftly, making it suitable for real-time control applications.

On Chip Program ROM Width: 8

The on-chip program ROM width of 8 bits supports efficient storage and execution of code, ensuring optimal performance and resource utilization.

No. of I/O Lines: 68

With 68 Input/Output (I/O) lines, this microcontroller offers ample interface options for connecting to sensors, actuators, displays, and other external devices.

Technical Specifications

Microcontrollers STM8L162M8T6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

STM8

Maximum Clock Frequency:

16 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G80

Length:

14 mm

No. of I/O Lines:

68

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.64SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

65536

ROM Programmability:

FLASH

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

I2C, IRDA, SPI(2), USART(3)

Peripherals:

BOD, LCD, RTC, TIMER(8)

Analog To Digital Convertors:

28-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM8L162M8T6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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