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STM8L152C4U6

STMicroelectronics

STM8L152C4U6 by STMicroelectronics

STM8L152C4U6 microcontroller from STMicroelectronics features a 16 MHz CPU, operates b/w 1.65-3.6 V, and includes 25 ADC channels for versatile applications. Its compact design with 48 terminals makes it ideal for industrial use in embedded systems. With integrated DAC and multiple connectivity options, it's perfect for IoT devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,899 parts In-Stock

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3,899

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Digiode

USA . 3,569 parts In-Stock

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3,569

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Anansix

USA . 1,223 parts In-Stock

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1,223

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Distributors (Availability)

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Vigor

Singapore . 2,331 parts In-Stock

1+ parts

$1.210

100+ parts

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2,331

$1.210

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Microchip USA

USA . 3,725 parts In-Stock

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$10.903

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3,725

$10.903

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AZTECH Wire

Italy . 336 parts In-Stock

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$20.490

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336

$20.490

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Component Stockers USA

USA . 2,992 parts In-Stock

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$28.310

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2,992

$28.310

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IDEA Electronic Components Group

UK . 1,365 parts In-Stock

1+ parts

$38.759

100+ parts

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$34.883

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1,365

$38.759

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$34.883

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MKK Technologies

India . 1,753 parts In-Stock

1+ parts

$72.883

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1,753

$72.883

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DigiPath Technology Company

USA . 1,753 parts In-Stock

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$72.883

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1,753

$72.883

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Corphita

USA . 2,620 parts In-Stock

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2,620

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Parana Technologies

USA . 2,208 parts In-Stock

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$46.342

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$46.342

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Perfect Parts

USA . 17 parts In-Stock

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17

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Overview

Unlock the potential of your projects with the STM8L152C4U6 microcontroller from STMicroelectronics. Engineered for excellence, this compact powerhouse combines efficiency and reliability, making it perfect for industrial applications, smart devices, and consumer electronics. With advanced features like multiple ADC channels and low power consumption, it ensures optimal performance without compromising on quality. Trust in STMicroelectronics' legacy of innovation to elevate your designs today!

Feature Benefit Bullets

Surface Mount: YES

The surface mount feature allows for compact and efficient PCB designs, making this microcontroller suitable for space-constrained applications.

Maximum Supply Voltage: 3.6 V

The max supply voltage ensures compatibility with common battery-operated devices, enhancing its usability across a wide range of applications.

Package Shape: SQUARE

The square package shape provides a uniform footprint that aids in easier routing and layout on printed circuit boards.

Bit Size: 8

An 8-bit size is ideal for low-power microcontroller applications, offering a good balance of performance and energy consumption.

DAC Channels: YES

Having Digital-to-Analog Converter channels expands the microcontroller's capability for signal processing and interfacing with analog devices.

Power Supplies (V): 1.8/3.3

The wide range of operational power supplies makes this microcontroller versatile for a variety of design requirements.

No. of Terminals: 48

A higher number of terminals provides greater flexibility in I/O options, catering to complex application requirements.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style contributes to efficient heat dissipation, promoting reliable operation in demanding environments.

Minimum Supply Voltage: 1.65 V

Supports low-voltage applications, enhancing battery life and efficiency in portable devices.

Maximum Operating Temperature: 85 °C

Suitable for applications in environments with elevated temperatures, making it reliable for industrial applications.

CPU Family: ST8

The ST8 family is known for its efficiency and adaptability, making it a solid choice for various application domains.

Minimum Operating Temperature: -40 °C

This wide temperature range allows the microcontroller to operate in extreme and harsh conditions, ideal for industrial automation.

Terminal Finish: MATTE TIN

Matte tin terminal finish enhances solderability and reliability of connections during assembly.

ADC Channels: YES

Analog-to-Digital Conversion capability allows for integration with various sensors, making it versatile for sensor applications.

DMA Channels: YES

Direct Memory Access channels improve data transfer efficiency, freeing up CPU resources for other tasks.

Terminal Position: QUAD

Quad terminal positioning facilitates easier PCB layout and improves performance in high-frequency applications.

ROM Words: 16384

A sizable ROM allows for more complex applications and functions to be implemented directly on the microcontroller.

Maximum Seated Height: 1 mm

The low seated height enables compact designs that are crucial for space-saving applications.

Digital To Analog Convertors: 1-Ch 12-Bit

Having a 12-bit DAC enhances precision in analog signals, ideal for high-quality audio and control applications.

Width: 7 mm

A compact width helps reduce the overall size of electronic designs, which is important for mobile and portable devices.

Data EEPROM Size: 1K

This size of Data EEPROM provides sufficient space for storing configuration settings and calibration data.

Peripherals: BOD, COMPARATOR(2), DMA(4), LCD, POR, RTC, TIMER(7)

The range of built-in peripherals enhances functionality, reducing the need for additional components and streamlining design.

Maximum Clock Frequency: 16 MHz

A clock frequency of 16 MHz provides adequate processing power for many applications while maintaining low power consumption.

Length: 7 mm

Similar to the width, this compact length makes it ideal for small form factor applications.

Temperature Grade: INDUSTRIAL

Industrial grade temperature rating ensures reliability in challenging conditions, perfect for long-term usage in critical systems.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture allows for efficient processing and reduced instruction cycles, boosting performance.

RAM Bytes: 2048

Having 2KB of RAM supports more complex computations and data-handling for applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, leading to longer battery life.

Terminal Form: NO LEAD

No-lead design simplifies the manufacturing process and improves environmental friendliness.

Analog To Digital Convertors: 25-Ch 12-Bit

The presence of 25-channels ADC offers extensive options for sensor integration, making it perfect for data acquisition tasks.

Maximum Supply Current: 80 mA

A maximum supply current of 80 mA is low enough to extend battery life in portable applications while providing adequate performance.

Nominal Supply Voltage: 3 V

This standard voltage rating is widely used in the industry, providing compatibility with many components.

PWM Channels: YES

PWM capabilities enhance control over motors and other devices, making it suitable for automation and robotics.

Connectivity: I2C, IRDA, SPI, USART

Diverse connectivity options facilitate easy interfacing with other devices and components, enhancing overall system functionality.

ROM Programmability: FLASH

Flash programmability enables easy updates and customization of firmware, extending the life cycle of products.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for higher density layouts, accommodating modern compact electronics.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates reasonable handling precautions; it is suitable for automated and manual assembly processes.

Speed: 16 rpm

The specified speed ensures this microcontroller can effectively manage time-sensitive tasks in various applications.

On Chip Program ROM Width: 8

The 8-bit program ROM width facilitates straightforward programming and maintains compatibility with various software ecosystems.

No. of I/O Lines: 41

Having 41 I/O lines secures ample interfacing options for user interaction and device control.

Technical Specifications

Microcontrollers STM8L152C4U6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST8

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

41

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

80 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

1K

Connectivity:

I2C, IRDA, SPI, USART

Peripherals:

BOD, COMPARATOR(2), DMA(4), LCD, POR, RTC, TIMER(7)

Analog To Digital Convertors:

25-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

STM8L152C4U6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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