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STM8L151M8T6

STMicroelectronics

STM8L151M8T6 by STMicroelectronics

STM8L151M8T6 by STMicroelectronics is an 8-bit microcontroller with 80 terminals, operating at a max frequency of 16 MHz. It features 2 DAC and ADC channels, along with 28-Ch 12-Bit ADC. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$4.282

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 540 parts In-Stock

1+ parts

$5.710

100+ parts

$3.220

1k+ parts

$2.200

10k+ parts

-

540

$5.710

$3.220

$2.200

-

Verical

USA . 201 parts In-Stock

1+ parts

-

100+ parts

$2.854

1k+ parts

$2.073

10k+ parts

-

201

-

$2.854

$2.073

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,225 parts In-Stock

1+ parts

$4.152

100+ parts

-

1k+ parts

-

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2,225

$4.152

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-

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Vyrian

USA . 8,216 parts In-Stock

1+ parts

-

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8,216

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Anansix

USA . 1,637 parts In-Stock

1+ parts

-

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-

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1,637

-

-

-

-

Distributors (Availability)

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Vigor

Singapore . 2,343 parts In-Stock

1+ parts

$2.150

100+ parts

-

1k+ parts

-

10k+ parts

-

2,343

$2.150

-

-

-

Corphita

USA . 1,836 parts In-Stock

1+ parts

$3.933

100+ parts

-

1k+ parts

-

10k+ parts

-

1,836

$3.933

-

-

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Microchip USA

USA . 2,779 parts In-Stock

1+ parts

$19.371

100+ parts

-

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2,779

$19.371

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-

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IDEA Electronic Components Group

UK . 196 parts In-Stock

1+ parts

$51.844

100+ parts

-

1k+ parts

$46.659

10k+ parts

-

196

$51.844

-

$46.659

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MKK Technologies

India . 2,189 parts In-Stock

1+ parts

$97.489

100+ parts

-

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2,189

$97.489

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DigiPath Technology Company

USA . 2,189 parts In-Stock

1+ parts

$97.489

100+ parts

-

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2,189

$97.489

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QUARKTWIN TECHNOLOGY LTD

USA . 23,419 parts In-Stock

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23,419

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Perfect Parts

USA . 949 parts In-Stock

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949

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RC Electronics

USA . 610 parts In-Stock

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610

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Component Stockers USA

USA . 446 parts In-Stock

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446

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Parana Technologies

USA . 442 parts In-Stock

1+ parts

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100+ parts

$61.987

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442

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$61.987

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Metaverse IC Inc.

Canada . 196 parts In-Stock

1+ parts

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196

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A-Z Elektronik GmbH

Germany . 150 parts In-Stock

1+ parts

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150

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GreenTree Electronics

Israel . 50 parts In-Stock

1+ parts

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50

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Overview

Unlock the power of innovation with the STM8L151M8T6 microcontroller by STMicroelectronics. Designed with precision and reliability in mind, this high-quality product offers a wide range of applications in various industries. With its advanced features and cutting-edge technology, customers can experience enhanced performance and efficiency like never before. Trust in STMicroelectronics to deliver superior products that provide value, benefits, and advantages that will take your projects to the next level. Embrace the future of technology with the STM8L151M8T6 microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for packaging, making the product reliable for various applications.

Surface Mount: YES

Easier to mount on PCBs, saving space and making assembly more efficient.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply, accommodating a range of input voltages.

Bit Size: 8

Sufficient bit size for handling various computational tasks and data processing efficiently.

DAC Channels: YES

Enables the microcontroller to generate accurate analog output signals, expanding its functionality.

Power Supplies (V): 2/3.3

Supports multiple power supply options, enhancing compatibility with different systems.

No. of Terminals: 80

Sufficient terminals for connecting to external components and peripherals, enhancing versatility.

Package Style (Meter): FLATPACK, LOW PROFILE

Compact package style with low profile design, suitable for space-constrained applications.

Minimum Supply Voltage: 1.8 V

Operates efficiently at low supply voltages, conserving power and extending battery life.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments with varying temperature conditions.

CPU Family: STM8

Part of the STM8 CPU family known for its reliability and performance in embedded systems.

ADC Channels: YES

Integrated ADC channels for accurate analog-to-digital conversion, enhancing sensor interfacing capabilities.

DMA Channels: YES

DMA support for efficient data transfer between peripherals and memory, improving overall system performance.

ROM Words: 65536

Sufficient ROM capacity for storing program instructions and data, enabling complex applications to run smoothly.

Digital To Analog Convertors: 2-Ch 12-Bit

High-resolution DACs for precise analog output generation, essential for audio and sensor applications.

Width: 14 mm

Compact width size for space-efficient PCB layout and integration into small form factor devices.

Data EEPROM Size: 2K

Adequate EEPROM size for data storage and non-volatile memory needs, offering data retention even when power is off.

Peripherals: BOD, COMPARATOR(2), DMA(4), POR, RTC, TIMER(8)

Wide range of integrated peripherals for enhanced functionality and real-time operation in various applications.

Maximum Clock Frequency: 16 MHz

High clock frequency for fast processing speeds and real-time responsiveness in time-critical applications.

Length: 14 mm

Compact length size for space-saving designs and easy integration into small form factor devices.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature conditions, ensuring durability and performance in harsh environments.

Peripheral IC Type: MICROCONTROLLER

Specialized microcontroller IC type for handling various tasks efficiently in embedded systems.

RAM Bytes: 4096

Adequate RAM size for data storage and fast access during program execution, enhancing multitasking capabilities.

Technology: CMOS

CMOS technology for low power consumption and improved noise immunity, ideal for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminal form for easy soldering and PCB assembly, ensuring reliable electrical connections.

Analog To Digital Convertors: 28-Ch 12-Bit

High-channel count ADCs for flexible analog input handling, suitable for multi-sensor applications.

Maximum Supply Current: 80 mA

Low supply current requirement for power-efficient operation and extended battery life.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage for consistent performance and reliable operation in various conditions.

PWM Channels: YES

PWM support for precise control of motor speed, LED brightness, and other analog output applications.

Connectivity: I2C, IRDA, SPI(2), USART(3)

Multiple connectivity options for seamless integration with various devices and communication protocols.

ROM Programmability: FLASH

Flash ROM programmability for easy and fast firmware updates, reducing time-to-market for new products.

Terminal Pitch: 0.65 mm

Fine terminal pitch for compact PCB layout and high-density interconnections, suitable for miniaturized designs.

Speed: 16 rpm

High-speed processing capabilities for quick response times and efficient task execution in time-sensitive applications.

On Chip Program ROM Width: 8

On-chip program ROM width of 8 bits for efficient program storage and execution, enhancing overall performance.

No. of I/O Lines: 67

Sufficient I/O lines for connecting to external devices and peripherals, enabling versatile input/output configurations.

Technical Specifications

Microcontrollers STM8L151M8T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

STM8

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G80

Length:

14 mm

No. of I/O Lines:

67

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.64SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

80 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

I2C, IRDA, SPI(2), USART(3)

Peripherals:

BOD, COMPARATOR(2), DMA(4), POR, RTC, TIMER(8)

Analog To Digital Convertors:

28-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM8L151M8T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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