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STM8L151K6U3

STMicroelectronics

STM8L151K6U3 by STMicroelectronics

STM8L151K6U3 by STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 3.6V. It features DAC and ADC channels, as well as connectivity options like I2C, IRDA, SPI, and USART. This microcontroller is commonly used in automotive applications due to its temperature grade and low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,722 parts In-Stock

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6,722

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Digiode

USA . 2,370 parts In-Stock

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2,370

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Anansix

USA . 302 parts In-Stock

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302

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,616 parts In-Stock

1+ parts

$1.360

100+ parts

-

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1,616

$1.360

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Microchip USA

USA . 5,000 parts In-Stock

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$11.745

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5,000

$11.745

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AZTECH Wire

Italy . 495 parts In-Stock

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$14.046

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495

$14.046

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Ampacity Inc.

Singapore . 916 parts In-Stock

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$19.000

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916

$19.000

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Advanced Electronics

New Zealand . 57 parts In-Stock

1+ parts

$42.963

100+ parts

$39.096

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$35.230

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57

$42.963

$39.096

$35.230

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IDEA Electronic Components Group

UK . 1,909 parts In-Stock

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$68.040

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$61.236

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1,909

$68.040

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$61.236

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MKK Technologies

India . 2,116 parts In-Stock

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$127.946

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2,116

$127.946

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DigiPath Technology Company

USA . 2,116 parts In-Stock

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$127.946

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2,116

$127.946

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Lixinc

USA . 2,583 parts In-Stock

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2,583

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Parana Technologies

USA . 1,088 parts In-Stock

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$81.353

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1,088

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$81.353

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Corphita

USA . 193 parts In-Stock

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193

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Overview

Experience the power of the STM8L151K6U3 microcontroller by STMicroelectronics. As a leader in the industry, STMicroelectronics delivers exceptional quality and reliability in every product. The STM8L151K6U3 offers countless applications in various industries, providing customers with unmatched value and benefits. With its advanced features and robust performance, this microcontroller is perfect for automotive and IoT devices, offering seamless connectivity through I2C, IRDA, SPI, and USART. Unlock your creativity and take your projects to new heights with the STM8L151K6U3.

Feature Benefit Bullets

Surface Mount: YES

Easy to solder onto PCBs, saving time and effort in assembly.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of input voltage, increasing compatibility with different power sources.

Package Shape: SQUARE

Compact design for space-saving in applications with limited board space.

Bit Size: 8

Suitable for simple to moderate complexity applications, balancing performance and cost effectively.

DAC Channels: YES

Enables analog output capabilities for a wider range of applications.

Power Supplies (V): 1.8/3.3

Supports multiple power supply options, offering flexibility in design and compatibility.

No. of Terminals: 32

Sufficient number of terminals for interfacing with peripherals and external components.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Provides various package styles for different application requirements and mounting options.

Minimum Supply Voltage: 1.65 V

Operational at low voltage levels, suitable for energy-efficient designs.

Maximum Operating Temperature: 125 °C

Capable of operating in high-temperature environments, ideal for industrial or automotive applications.

CPU Family: ST8

Belongs to a known CPU family with established performance and reliability characteristics.

Minimum Operating Temperature: -40 °C

Operational in extremely cold conditions, suitable for outdoor or harsh environments.

ADC Channels: YES

Supports analog input capabilities, essential for sensor interfacing and data acquisition.

DMA Channels: YES

Allows for efficient data transfer without CPU intervention, enhancing overall system performance.

Terminal Position: QUAD

Quad terminal layout for organized and efficient PCB routing and layout.

ROM Words: 32768

Sufficient ROM capacity for program storage, supporting larger applications.

Maximum Seated Height: 0.8 mm

Low profile design for compact and slim device applications.

Digital To Analog Convertors: 1-Ch 12-Bit

High-resolution DAC for accurate analog output, suitable for precision control applications.

Width: 5 mm

Compact width for space-efficient PCB layout.

Data EEPROM Size: 1K

Adequate EEPROM storage for data retention and non-volatile memory applications.

Peripherals: BOD, COMPARATOR(2), DMA(4), POR, RTC, TIMER(7)

A wide range of built-in peripherals for enhanced functionality and flexibility in application development.

Maximum Clock Frequency: 16 MHz

High clock frequency for fast execution of instructions and real-time processing.

Length: 5 mm

Compact length for space-efficient PCB layout.

Temperature Grade: AUTOMOTIVE

Designed and rated for automotive applications, ensuring reliability in harsh vehicular environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes RISC architecture for efficient execution of instructions and control tasks.

RAM Bytes: 2048

Adequate RAM capacity for data storage and manipulation, supporting moderate complexity applications.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: NO LEAD

Lead-free terminal form for compliance with environmental regulations and RoHS standards.

Analog To Digital Convertors: 22-Ch 12-Bit

Multiple high-resolution ADC channels for accurate analog input conversion, suitable for sensor interfaces.

Maximum Supply Current: 80 mA

Low supply current requirement for energy-efficient operation.

Nominal Supply Voltage: 3 V

Stable and common nominal supply voltage for easy integration and compatibility.

PWM Channels: YES

Supports Pulse Width Modulation for precise control of digital signals and power output.

Connectivity: I2C, IRDA, SPI, USART

Multiple connectivity options for interfacing with external devices and communication protocols.

ROM Programmability: FLASH

Flash ROM for easy and flexible programming and reprogramming of firmware.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density and precise PCB layout.

Speed: 16 rpm

High speed for real-time processing and control applications.

On Chip Program ROM Width: 8

Program ROM width of 8 bits for efficient storage and execution of instructions.

No. of I/O Lines: 30

Adequate number of I/O lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers STM8L151K6U3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST8

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

No. of I/O Lines:

30

No. of Terminals:

32

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

.8 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

80 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

1K

Connectivity:

I2C, IRDA, SPI, USART

Peripherals:

BOD, COMPARATOR(2), DMA(4), POR, RTC, TIMER(7)

Analog To Digital Convertors:

22-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

STM8L151K6U3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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