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STM8L151K2U6

STMicroelectronics

STM8L151K2U6 by STMicroelectronics

STM8L151K2U6 by STMicroelectronics is an 8-bit microcontroller with 3.6V max supply voltage, 16MHz clock frequency, and 1024 bytes of RAM. Ideal for industrial applications, it features 23-Ch ADCs, I2C/SPI/USART connectivity, and FLASH ROM programmability for efficient data processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,698 parts In-Stock

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5,698

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Digiode

USA . 4,273 parts In-Stock

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4,273

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Anansix

USA . 567 parts In-Stock

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567

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Distributors (Availability)

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Vigor

Singapore . 3,890 parts In-Stock

1+ parts

$0.880

100+ parts

-

1k+ parts

-

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3,890

$0.880

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Microchip USA

USA . 5,394 parts In-Stock

1+ parts

$7.614

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5,394

$7.614

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AZTECH Wire

Italy . 1,011 parts In-Stock

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$11.970

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1,011

$11.970

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Component Stockers USA

USA . 9,441 parts In-Stock

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$14.530

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9,441

$14.530

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IDEA Electronic Components Group

UK . 2,116 parts In-Stock

1+ parts

$69.140

100+ parts

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$62.226

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2,116

$69.140

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$62.226

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MKK Technologies

India . 1,079 parts In-Stock

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$130.013

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1,079

$130.013

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DigiPath Technology Company

USA . 1,079 parts In-Stock

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$130.013

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1,079

$130.013

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Corphita

USA . 3,616 parts In-Stock

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3,616

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Parana Technologies

USA . 2,267 parts In-Stock

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$82.667

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2,267

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$82.667

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Overview

Unleash the power of innovation with the STM8L151K2U6 microcontroller from STMicroelectronics. As a leader in the industry, STMicroelectronics guarantees top-notch quality and reliability. This versatile microcontroller is perfect for a wide range of applications, offering customers unparalleled value and benefits. With features like ADC channels, DMA channels, and PWM channels, along with connectivity options like I2C, SPI, and USART, the STM8L151K2U6 is designed to take your projects to the next level. Experience the advantages of cutting-edge technology with this exceptional product.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient mounting on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, providing flexibility in different applications.

Package Shape: SQUARE

Square package shape is compact and facilitates easier PCB layout and design.

Bit Size: 8

Suitable for handling basic tasks efficiently without excessive resource consumption.

Power Supplies (V): 2/3.3

Compatible with common power supply voltages, making it versatile for various projects.

No. of Terminals: 32

Offers a sufficient number of connection points for interfacing with other components.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Provides options for different packaging styles based on specific project requirements.

Minimum Supply Voltage: 1.8 V

Allows for operation at low power supply voltages, ideal for battery-powered devices.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, making it suitable for harsh environments.

CPU Family: STM8

Part of the STM8 family known for performance and reliability in microcontroller applications.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions, expanding its usability range.

Terminal Finish: MATTE TIN

Provides a reliable and corrosion-resistant finish for the terminals, ensuring long-term performance.

ADC Channels: YES

Includes Analog-to-Digital Converter channels for interfacing with analog sensors and signals.

DMA Channels: YES

Supports Direct Memory Access channels for efficient data transfers and processing.

Terminal Position: QUAD

Quad terminal layout allows for easier PCB routing and minimizes signal interference.

ROM Words: 4096

Offers a large ROM size for storing program code and data, suitable for complex applications.

Maximum Seated Height: 0.6 mm

Low profile design allows for compact and slim form factor in space-constrained designs.

Width: 5 mm

Compact width dimension makes it suitable for small form factor devices and applications.

Data EEPROM Size: 256

Includes EEPROM memory for non-volatile data storage, enhancing data retention.

Peripherals: BOD, COMPARATOR(2), DMA(5), POR, RTC, TIMER(6)

Rich set of peripherals offers versatility and added functionality for diverse applications.

Maximum Clock Frequency: 16 MHz

High clock frequency enables fast and responsive operation for real-time applications.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during manufacturing processes for robust assembly.

Length: 5 mm

Compact length dimension allows for space-saving integration in small devices.

Temperature Grade: INDUSTRIAL

Meets industrial-grade standards for reliability and durability in demanding environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Based on RISC architecture, offering high performance and efficiency in processing tasks.

RAM Bytes: 1024

Generous RAM size for temporary data storage and processing, enhancing multitasking capabilities.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity for reliable operation.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and RoHS standards.

Analog To Digital Converters: 23-Ch 12-Bit

Multiple ADC channels with high resolution enable accurate analog signal conversion.

Maximum Supply Current: 4.88 mA

Low supply current consumption for energy-efficient operation and battery-powered applications.

Nominal Supply Voltage: 3 V

Standard nominal supply voltage for compatibility with a wide range of power sources.

PWM Channels: YES

Pulse Width Modulation channels for precise control of outputs like motors and LEDs.

Connectivity: I2C, SPI, USART

Supports multiple communication interfaces for seamless connectivity with external devices.

ROM Programmability: FLASH

Flash programmable ROM for easy and quick firmware updates and modifications.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting and compact PCB designs.

Moisture Sensitivity Level (MSL): 3

Suitable for standard moisture sensitivity levels during storage and assembly processes.

Speed: 16 rpm

Capable of handling tasks at a speed of 16 rounds per minute, suitable for various applications.

On Chip Program ROM Width: 8

Wide on-chip ROM width facilitates efficient program storage and execution.

No. of I/O Lines: 30

Adequate number of Input/Output lines for interfacing with external peripherals and systems.

Technical Specifications

Microcontrollers STM8L151K2U6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

STM8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

30

No. of Terminals:

32

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

4.88 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

256

Connectivity:

I2C, SPI, USART

Peripherals:

BOD, COMPARATOR(2), DMA(5), POR, RTC, TIMER(6)

Analog To Digital Convertors:

23-Ch 12-Bit

Trade Compliance

STM8L151K2U6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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