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STM8L151G6U7TR

STMicroelectronics

STM8L151G6U7TR by STMicroelectronics

STM8L151G6U7TR by STMicroelectronics is an 8-bit microcontroller with 3.6V max supply voltage, 1K data EEPROM size, and 16MHz clock frequency. Ideal for industrial applications, it features 18-Ch ADCs, I2C/SPI/USART connectivity, and low power mode for efficient performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 15,000 parts In-Stock

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15,000

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Vyrian

USA . 4,342 parts In-Stock

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4,342

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Digiode

USA . 3,898 parts In-Stock

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3,898

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Anansix

USA . 637 parts In-Stock

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637

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Distributors (Availability)

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Vigor

Singapore . 2,000 parts In-Stock

1+ parts

$1.070

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2,000

$1.070

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Microchip USA

USA . 4,722 parts In-Stock

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$9.028

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4,722

$9.028

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Component Stockers USA

USA . 1,904 parts In-Stock

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$18.720

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1,904

$18.720

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AZTECH Wire

Italy . 115 parts In-Stock

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$21.640

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115

$21.640

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IDEA Electronic Components Group

UK . 221 parts In-Stock

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$47.268

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$42.541

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221

$47.268

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$42.541

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MKK Technologies

India . 365 parts In-Stock

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$88.884

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365

$88.884

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DigiPath Technology Company

USA . 365 parts In-Stock

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$88.884

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365

$88.884

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QUARKTWIN TECHNOLOGY LTD

USA . 2,026 parts In-Stock

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2,026

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Parana Technologies

USA . 1,968 parts In-Stock

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$56.516

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1,968

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$56.516

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Corphita

USA . 1,730 parts In-Stock

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1,730

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Overview

Experience the unmatched quality and reliability of STMicroelectronics with the STM8L151G6U7TR microcontroller. Designed for a wide range of applications, this chip offers exceptional value and benefits to customers looking for high-performance solutions. With features like low power mode, multiple peripherals, and a maximum clock frequency of 16 MHz, this microcontroller provides the flexibility and efficiency needed for your next project. Trust in STMicroelectronics for cutting-edge technology that delivers outstanding results every time.

Feature Benefit Bullets

Surface Mount: YES

Surface mount packaging allows for easy and convenient mounting on a circuit board, saving space and enabling automated assembly processes.

Maximum Supply Voltage: 3.6 V

High maximum supply voltage allows for robust operation and flexibility in power supply design.

On Chip Data RAM Width: 8

Having a wider data RAM width enables efficient data processing and storage on the microcontroller.

Package Shape: SQUARE

Square package shape facilitates easy integration into compact electronic devices and PCB layouts.

Bit Size: 8

8-bit architecture provides a good balance between performance and cost for a wide range of embedded applications.

DAC Channels: YES

DAC channels enable the generation of analog voltage signals for various control and communication tasks.

Power Supplies (V): 1.8/3.3

Support for multiple power supply voltages allows for compatibility with different components and systems.

No. of Terminals: 28

Having a sufficient number of terminals provides flexibility in connecting external components and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Various package styles offer options for thermal management and space-constrained designs.

Minimum Supply Voltage: 1.65 V

Low minimum supply voltage supports operation in energy-efficient and battery-powered applications.

Maximum Operating Temperature: 105 °C

High maximum operating temperature ensures reliability in harsh environmental conditions and industrial settings.

CPU Family: ST8

Belonging to the ST8 CPU family ensures compatibility with other STMicroelectronics products and tools.

No. of External Interrupts: 40

Abundance of external interrupts allows for efficient handling of external events and real-time responsiveness.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures reliable performance in freezing conditions or extreme cold environments.

ADC Channels: YES

ADC channels enable the microcontroller to convert analog signals into digital data, essential for sensing and measurement applications.

DMA Channels: YES

DMA channels facilitate efficient data transfer between memory and peripherals, reducing CPU overhead and enhancing performance.

Terminal Position: QUAD

Quad terminal position simplifies PCB layout and connection to external circuitry, improving overall design flexibility.

ROM Words: 32768

Large ROM size enables storing program code and data, essential for complex applications and firmware.

Maximum Seated Height: 0.6 mm

Low seated height allows for compact device designs and compatibility with slim-profile enclosures.

Digital To Analog Convertors: 1-Ch 12-bit

One-channel 12-bit DAC provides high-resolution analog output for precise control and signal generation.

Width: 4 mm

Compact width dimension enables space-saving integration on PCBs and in small electronic devices.

Data EEPROM Size: 1K

1K EEPROM size allows for non-volatile data storage for user configuration and calibration data.

Peripherals: BOR, COMPARATOR(2), DMA(4), POR, RTC, TIMER(4), WDT

Wide range of integrated peripherals enhances functionality and flexibility for diverse embedded applications.

Maximum Clock Frequency: 16 MHz

High clock frequency supports fast processing and execution of instructions, improving overall system performance.

Length: 4 mm

Compact length dimension enables space-efficient placement on PCBs and in electronic devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh industrial environments and extended temperature ranges.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller with integrated peripherals simplifies system design and reduces the need for external components.

No. of Timers: 4

Having multiple timers allows for precise timing control and event scheduling in embedded applications.

RAM Bytes: 2048

Ample RAM size supports data processing and temporary storage requirements for complex algorithms and multitasking operations.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of applications.

Terminal Form: NO LEAD

No-lead terminal form simplifies PCB assembly processes and enhances reliability through improved solder joint integrity.

Analog To Digital Convertors: 18-Ch 12-Bit

Eighteen-channel 12-bit ADC enables precise analog signal conversion for a wide range of sensor and measurement applications.

Maximum Supply Current: 80 mA

Moderate supply current consumption ensures energy efficiency and extends battery life in portable applications.

Nominal Supply Voltage: 3 V

Standard nominal supply voltage simplifies power supply design and compatibility with existing systems and components.

No. of DMA Channels: 4

Four DMA channels support efficient data transfer and processing, reducing CPU load and improving system performance.

PWM Channels: YES

PWM channels enable precise control of digital signals for tasks such as motor control, lighting, and power management.

Connectivity: I2C, SPI, USART

Support for I2C, SPI, and USART communication protocols allows for seamless integration with a wide range of external devices and peripherals.

ROM Programmability: FLASH

Flash ROM programmability enables easy and fast reprogramming of firmware and software, offering flexibility for product updates and enhancements.

Terminal Pitch: 0.5 mm

Narrow terminal pitch enables high-density PCB layouts and space-saving designs for compact electronic devices.

Format: FIXED POINT

Fixed-point format simplifies arithmetic operations and enhances computational efficiency in embedded applications.

Speed: 16 rpm

Speed specification is not generally associated with microcontrollers. Please check the accuracy of this data.

Low Power Mode: YES

Low power mode allows for energy-efficient operation, prolonging battery life and reducing power consumption in portable devices.

On Chip Program ROM Width: 8

On-chip program ROM width of 8 bits supports storing and executing program code efficiently on the microcontroller.

No. of I/O Lines: 26

Abundance of I/O lines provides ample connectivity options for interfacing with external sensors, actuators, and peripheral devices.

Technical Specifications

Microcontrollers STM8L151G6U7TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

ST8

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-XQCC-N28

Length:

4 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

40

No. of I/O Lines:

26

No. of Terminals:

28

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC28,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

80 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4 mm

Peripheral IC Type:

Data EEPROM Size:

1K

Connectivity:

I2C, SPI, USART

Peripherals:

BOR, COMPARATOR(2), DMA(4), POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

18-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-bit

Trade Compliance

STM8L151G6U7TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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