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STM8L151C6U3

STMicroelectronics

STM8L151C6U3 by STMicroelectronics

STM8L151C6U3 from STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 3.6V and operates in extreme temperatures (-40 °C to 125°C). It features 25 ADC channels, 1 DAC channel, and supports I2C/SPI/USART connectivity. Ideal for automotive applications, it combines low power consumption with robust performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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EBV Elektronik

Germany . 6,240 parts In-Stock

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Avnet

USA . 3,120 parts In-Stock

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Digiode

USA . 4,376 parts In-Stock

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4,376

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Vyrian

USA . 3,064 parts In-Stock

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Anansix

USA . 923 parts In-Stock

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923

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Vigor

Singapore . 5,603 parts In-Stock

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$1.490

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5,603

$1.490

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Microchip USA

USA . 3,582 parts In-Stock

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$12.899

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3,582

$12.899

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AZTECH Wire

Italy . 522 parts In-Stock

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$21.100

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522

$21.100

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Component Stockers USA

USA . 4,253 parts In-Stock

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$27.020

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$27.020

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IDEA Electronic Components Group

UK . 172 parts In-Stock

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$71.766

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$64.590

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172

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MKK Technologies

India . 67 parts In-Stock

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$134.952

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DigiPath Technology Company

USA . 67 parts In-Stock

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$134.952

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Eastek

USA . 3,120 parts In-Stock

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$3.460

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Corphita

USA . 2,807 parts In-Stock

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Parana Technologies

USA . 1,720 parts In-Stock

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$85.808

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Perfect Parts

USA . 1,456 parts In-Stock

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Overview

Unlock endless possibilities with the STM8L151C6U3 microcontroller from STMicroelectronics, a trusted leader in semiconductor innovation. Designed for efficiency and versatility, this 8-bit marvel excels in automotive applications, enhancing performance while keeping power consumption low. Enjoy seamless integration with multiple connectivity options and robust peripherals, empowering your projects with precision and reliability. Elevate your designs and drive success with STMicroelectronics!

Feature Benefit Bullets

Surface Mount: YES

The surface mount capability allows for compact circuit designs, enabling use in devices where space is at a premium.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with a wide range of low-power applications.

Package Shape: SQUARE

The square package shape provides versatility in PCB layout and soldering process, making integration easier.

Bit Size: 8

An 8-bit architecture is suitable for many basic control and automation tasks, offering simplicity and effectiveness.

DAC Channels: YES

Incorporating DAC channels allows for smooth signal output, making it ideal for applications requiring analog signal conversion.

Power Supplies (V): 1.8/3.3

The option for 1.8V or 3.3V power supplies provides design flexibility while ensuring energy efficiency.

No. of Terminals: 48

With 48 terminals, this microcontroller can accommodate numerous peripherals and interfaces, enhancing its functionality.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style promotes efficient heat dissipation and is well-suited for high-performance applications.

Minimum Supply Voltage: 1.65 V

A low minimum supply voltage makes it adaptable for battery-powered and energy-sensitive applications.

Maximum Operating Temperature: 125 °C

This high maximum operating temperature allows the microcontroller to function reliably in harsh environments.

CPU Family: ST8

Being part of the ST8 family ensures a robust architecture, optimized for performance in various automation tasks.

Minimum Operating Temperature: -40 °C

The capability to operate at temperatures as low as -40 °C makes it suitable for extreme outdoor and industrial applications.

ADC Channels: YES

With built-in ADC channels, it can easily interface with analog sensors, enhancing data acquisition and control capabilities.

DMA Channels: YES

DMA support allows for efficient data transfer, freeing up CPU resources and improving overall system performance.

Terminal Position: QUAD

Quad terminal position allows for compact layout and ease of access to multiple I/O lines, simplifying connections.

ROM Words: 32768

A sufficient ROM size provides enough space for program storage, suitable for moderately complex applications.

Maximum Seated Height: 1 mm

The low seated height enables dense integration in multi-layer PCBs, facilitating miniaturization.

Digital To Analog Converters: 1-Ch 12-Bit

A 12-bit digital-to-analog converter ensures high-resolution outputs for analog applications, enhancing performance.

Width: 7 mm

A compact width of 7 mm allows for efficient usage in designs with limited space.

Data EEPROM Size: 1K

With 1K of EEPROM, it allows for data storage and retention without needing constant power, ideal for storing settings.

Peripherals: BOD, COMPARATOR(2), DMA(4), POR, RTC, TIMER(7)

This rich set of peripherals increases the versatility of the microcontroller, making it suitable for various applications.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz offers decent processing speed for many real-time applications.

Length: 7 mm

The compact length facilitates efficient placement on tight PCB layouts, aiding in space-saving designs.

Temperature Grade: AUTOMOTIVE

An automotive temperature grade ensures reliability and safety in demanding automotive environments.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture offers high performance with low power consumption, ideal for embedded solutions.

RAM Bytes: 2048

2048 bytes of RAM provide sufficient memory for various applications, supporting effective task execution.

Technology: CMOS

CMOS technology ensures low power consumption, making it suitable for battery-operated devices.

Terminal Form: NO LEAD

No-lead terminals enhance soldering reliability and reduce the risk of mechanical failure in harsh conditions.

Analog To Digital Converters: 25-Ch 12-Bit

The inclusion of 25-channel 12-bit ADCs allows for versatile data gathering from multiple analog sources.

Maximum Supply Current: 80 mA

A maximum supply current of 80 mA ensures compatibility with various power budgets across applications.

Nominal Supply Voltage: 3 V

Operating at a nominal supply voltage of 3 V balances performance and energy efficiency, suitable for a variety of use cases.

PWM Channels: YES

PWM support allows for precise control of motors and other actuators, expanding the range of applications.

Connectivity: I2C, IRDA, SPI, USART

With versatile connectivity options, this microcontroller can integrate easily with a wide range of devices and networks.

ROM Programmability: FLASH

Flash programmability enables easy updates and reprogramming of the microcontroller, enhancing its adaptability.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for more compact design layouts, facilitating modern manufacturing techniques.

Speed: 16 rpm

The 16 rpm speed denotes effective performance for applications requiring moderate-speed operations.

On Chip Program ROM Width: 8

An 8-bit program ROM width provides efficient execution of smaller code, optimizing performance for basic control tasks.

No. of I/O Lines: 41

Having 41 I/O lines allows for extensive interfacing with external components, enhancing the device's functionality.

Technical Specifications

Microcontrollers STM8L151C6U3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST8

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

No. of I/O Lines:

41

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

80 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

1K

Connectivity:

I2C, IRDA, SPI, USART

Peripherals:

BOD, COMPARATOR(2), DMA(4), POR, RTC, TIMER(7)

Analog To Digital Convertors:

25-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

STM8L151C6U3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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