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STM8L101K3U6

STMicroelectronics

STM8L101K3U6 by STMicroelectronics

STM8L101K3U6 microcontroller from STMicroelectronics features an 8-bit architecture, operates at a supply voltage of 1.65-3.6V, and supports I2C/SPI/USART connectivity. With 32 terminals and a max clock frequency of 16 MHz, it's ideal for industrial applications requiring low power consumption. Its compact design and robust performance make it suitable for various embedded systems.

Median Price

$1.433

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,921 parts In-Stock

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Digiode

USA . 2,493 parts In-Stock

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Anansix

USA . 2,139 parts In-Stock

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ComSIT Distribution GmbH

Germany . 980 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 530 parts In-Stock

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Bristol Electronics

USA . 530 parts In-Stock

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$1.433

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$0.802

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530

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$1.433

$0.802

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Dan-Mar Components

USA . 530 parts In-Stock

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Zilex Electronics Inc.

Canada . 15 parts In-Stock

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Vigor

Singapore . 2,656 parts In-Stock

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$0.810

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$0.810

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Microchip USA

USA . 4,122 parts In-Stock

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$6.792

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Component Stockers USA

USA . 6,053 parts In-Stock

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$13.470

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IDEA Electronic Components Group

UK . 233 parts In-Stock

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$14.814

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$13.332

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233

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AZTECH Wire

Italy . 680 parts In-Stock

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$19.960

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$21.183

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$19.277

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$17.370

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$21.183

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MKK Technologies

India . 2,011 parts In-Stock

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$27.856

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$27.856

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DigiPath Technology Company

USA . 2,011 parts In-Stock

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$27.856

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A-Z Elektronik GmbH

Germany . 4,904 parts In-Stock

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Epart123

USA . 2,940 parts In-Stock

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$15.500

Corphita

USA . 1,939 parts In-Stock

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Futuretech Components

Singapore . 1,500 parts In-Stock

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Perfect Parts

USA . 661 parts In-Stock

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Parana Technologies

USA . 484 parts In-Stock

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Kepictronics

USA . 312 parts In-Stock

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Overview

Unlock innovation with the STM8L101K3U6 microcontroller from STMicroelectronics, a leader in quality and reliability. This compact powerhouse offers exceptional efficiency and flexibility for diverse applications, from home automation to industrial control. With low power consumption and robust performance across varying temperatures, it ensures your designs are future-ready. Choose STM8L101K3U6 for unparalleled value, enabling smarter solutions without compromise.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for a compact design, making this microcontroller ideal for space-constrained applications.

Maximum Supply Voltage: 3.6 V

Supports a variety of power supply configurations, enhancing flexibility for integration in different systems.

Package Shape: SQUARE

The square package shape facilitates efficient layout design on PCBs, ultimately improving thermal performance.

Bit Size: 8

An 8-bit architecture is suitable for simpler control tasks, providing a balance of performance and power consumption.

Power Supplies (V): 1.8/3.3

Dual voltage support allows for compatibility with a wider range of applications and reduces design complexity.

No. of Terminals: 32

With 32 terminals, this microcontroller provides ample I/O lines for various peripheral connections, enhancing versatility.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile and heat sink feature make it suitable for high-density applications while ensuring effective thermal management.

Minimum Supply Voltage: 1.65 V

Lower minimum supply voltage increases compatibility with low-power applications and extends battery life.

Maximum Operating Temperature: 85 °C

High tolerance for operating temperatures makes it suitable for industrial and demanding environments.

CPU Family: STM8

Part of a well-established family, ensuring reliability and a wealth of resources for development.

Minimum Operating Temperature: -40 °C

Extremely low operating temperature range allows deployment in harsh and cold environments.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and reduces the risk of corrosion, ensuring reliable performance.

Terminal Position: QUAD

Quad terminal positioning aids in easier routing on PCB designs, optimizing layout efficiency.

ROM Words: 8192

8KB of ROM provides sufficient space for program storage in various applications, allowing for complex functionalities.

Maximum Seated Height: 0.6 mm

Compact seated height contributes to overall space savings in electronic devices, ideal for modern designs.

Width: 5 mm

A width of 5mm is conducive to a variety of compact applications, particularly in consumer electronics.

Peripherals: COMPARATOR(2), POR, TIMER(5)

Integrated peripherals enhance functionality without needing additional external components, simplifying designs.

Maximum Clock Frequency: 16 MHz

The 16 MHz clock frequency provides adequate performance for various control and processing tasks.

Maximum Time At Peak Reflow Temperature (s): 30

Compliance with peak reflow temperature standards ensures compatibility with common assembly processes.

Peak Reflow Temperature °C: 260

High peak reflow tolerance ensures robustness during manufacturing while preserving device integrity.

Length: 5 mm

The 5-mm length allows for compact integration into various applications, enhancing design flexibility.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature grade, ensuring durability and reliability in rigorous applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture provides efficient instruction processing, optimizing speed and power usage.

No. of Timers: 5

Multiple timers allow for advanced timing functionalities in applications like control systems and automation.

RAM Bytes: 1536

With 1536 bytes of RAM, there's ample buffer for data handling, improving application performance.

Technology: CMOS

CMOS technology ensures low power consumption and high performance, suitable for battery-operated devices.

Terminal Form: NO LEAD

No-lead construction enhances space efficiency and simplifies assembly, promoting more compact designs.

Maximum Supply Current: 3.5 mA

Low supply current makes it energy-efficient, prolonging battery life in applications where power is limited.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3V is common in many systems, ensuring wide application compatibility.

PWM Channels: YES

Pulse Width Modulation capability enables fine control over motor and lighting applications, enhancing functionality.

Connectivity: I2C, SPI, USART

Diverse connectivity options allow for easy integration with various devices and communication protocols.

ROM Programmability: FLASH

Flash programmability offers flexibility for code updates and changes, minimizing downtime and enhancing versatility.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch aids in compact PCB designs while ensuring reliable electrical connections.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity to moisture, guiding proper handling and storage practices.

Speed: 16 rpm

Speed capability of 16 rpm indicates potential use in control applications such as motor control, contributing to versatility.

On Chip Program ROM Width: 8

An 8-bit program ROM width supports efficient data handling for simpler applications, enhancing processing speed.

No. of I/O Lines: 30

30 I/O lines provide extensive interfacing options for connecting sensors and actuators, enhancing functionality.

Technical Specifications

Microcontrollers STM8L101K3U6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

8

CPU Family:

STM8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

30

No. of Terminals:

32

No. of Timers:

5

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

RAM Bytes:

1536

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

3.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI, USART

Peripherals:

COMPARATOR(2), POR, TIMER(5)

Trade Compliance

STM8L101K3U6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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