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STM8L101G3U6A

STMicroelectronics

STM8L101G3U6A by STMicroelectronics

STM8L101G3U6A microcontroller from STMicroelectronics operates at 1.65-3.6V, features 28 terminals, and supports I2C/SPI/USART connectivity. With a max clock of 16 MHz and 8192 ROM words, it's ideal for industrial applications requiring low power consumption. Its compact design ensures efficient integration in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 9,278 parts In-Stock

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9,278

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Pegasus Components GmbH

Germany . 2,940 parts In-Stock

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2,940

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Anansix

USA . 2,844 parts In-Stock

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2,844

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Digiode

USA . 2,681 parts In-Stock

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2,681

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ComSIT Distribution GmbH

Germany . 450 parts In-Stock

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450

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Distributors (Availability)

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Vigor

Singapore . 2,136 parts In-Stock

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$0.670

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-

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2,136

$0.670

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Microchip USA

USA . 5,557 parts In-Stock

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$6.404

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5,557

$6.404

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Component Stockers USA

USA . 6,829 parts In-Stock

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$13.750

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6,829

$13.750

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IDEA Electronic Components Group

UK . 1,533 parts In-Stock

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$19.719

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$17.747

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1,533

$19.719

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$17.747

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AZTECH Wire

Italy . 504 parts In-Stock

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$20.190

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504

$20.190

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MKK Technologies

India . 1,528 parts In-Stock

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$37.081

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1,528

$37.081

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DigiPath Technology Company

USA . 1,528 parts In-Stock

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$37.081

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1,528

$37.081

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$61.879

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$56.310

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$50.741

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500

$61.879

$56.310

$50.741

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QUARKTWIN TECHNOLOGY LTD

USA . 23,729 parts In-Stock

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23,729

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A-Z Elektronik GmbH

Germany . 5,640 parts In-Stock

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Corphita

USA . 3,304 parts In-Stock

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Perfect Parts

USA . 625 parts In-Stock

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625

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Parana Technologies

USA . 44 parts In-Stock

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$23.577

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44

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$23.577

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Overview

Unlock the power of innovation with the STM8L101G3U6A microcontroller from STMicroelectronics! Renowned for their commitment to quality and reliability, STMicroelectronics delivers this ultra-efficient 8-bit MCU designed for a range of applications—from smart home devices to industrial controls. Benefit from its low power consumption and compact design, ensuring effortless integration into your projects while maximizing performance and longevity. Experience excellence in electronics today!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for easy integration into compact electronic systems, making it suitable for high-density applications.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this microcontroller is compatible with various low-power applications.

Package Shape: SQUARE

The square package shape promotes efficient space utilization on PCBs, allowing for versatile mounting options.

Bit Size: 8

An 8-bit architecture is well-suited for simple control applications, reducing design complexity and power consumption.

Power Supplies (V): 1.8/3.3

Supports a range of supply voltages, enhancing flexibility in design and allowing it to function in various system configurations.

No. of Terminals: 28

With 28 terminals, it offers ample I/O connectivity for various peripherals and sensors, enhancing functionality.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

The thin profile is advantageous for space-constrained applications, enabling slim and compact designs.

Minimum Supply Voltage: 1.65 V

By supporting a low minimum supply voltage, this microcontroller can operate efficiently in battery-powered devices.

Maximum Operating Temperature: 85 °C

The ability to function at high temperatures makes it suitable for industrial applications where environmental conditions can vary.

CPU Family: STM8

Part of the STM8 family, known for reliability and robustness in a wide range of applications.

Minimum Operating Temperature: -40 °C

Designed to operate in extreme temperatures, ensuring performance across varied industrial environments.

Terminal Finish: MATTE TIN

Matte tin terminal finish ensures good solderability and long-term reliability in various applications.

Terminal Position: QUAD

Quad terminal positioning allows for easier PCB layouts and routing, simplifying design processes.

ROM Words: 8192

A substantial ROM capacity supports complex applications requiring more program memory, enhancing versatility.

Maximum Seated Height: 0.6 mm

The low seated height allows for slimmer designs, making it ideal for portable and wearable technology.

Width: 4 mm

The compact width aids in minimizing PCB area, which is crucial for space-constrained designs.

Peripherals: COMPARATOR(2), POR, TIMER(5)

Multiple integrated peripherals facilitate complex operations without needing additional components, reducing board space and cost.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz allows for moderately fast processing, suitable for various control applications.

Maximum Time At Peak Reflow Temperature (s): 40

The tolerance for peak reflow temperature ensures reliability during soldering processes, prolonging lifespan.

Peak Reflow Temperature: 260 °C

Supports high-temperature soldering processes, making it suitable for automated assembly lines.

Length: 4 mm

The small length contributes to overall compact design, essential for modern electronics.

Temperature Grade: INDUSTRIAL

Industrial temperature grading signifies reliability in harsh environments, suitable for diverse applications.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it provides efficient execution of instructions, enhancing performance while minimizing energy consumption.

No. of Timers: 5

Multiple timers allow for intricate timing and pulse generation applications, expanding its usability.

RAM Bytes: 1536

Ample RAM facilitates data handling in more complex applications, promoting better performance.

Technology: CMOS

The CMOS technology ensures low power consumption, providing longer battery life in portable applications.

Terminal Form: NO LEAD

No-lead terminal form factor enhances soldering quality and reduces the risk of lead-related issues, making it environmentally friendly.

Maximum Supply Current: 3.5 mA

Low supply current consumption maximizes efficiency, especially crucial in battery-powered applications.

Nominal Supply Voltage: 3 V

The nominal supply voltage aligns with many contemporary low-power devices, making it easier to integrate.

PWM Channels: YES

PWM capability allows for effective control of motors and other devices, enhancing functionality in various applications.

Connectivity: I2C, SPI, USART

Multiple communication protocols provide flexibility in connecting to other devices, enhancing interoperability.

ROM Programmability: FLASH

The FLASH ROM programmability allows for easy updates and modifications, which is beneficial for evolving project requirements.

Terminal Pitch: 0.5 mm

A fine terminal pitch allows for greater I/O density on a compact PCB, ideal for modern electronic designs.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates robustness in humid environments, ensuring product longevity.

Speed: 16 rpm

Operating at 16 rpm ensures this microcontroller is capable of handling various operational requirements effectively.

On Chip Program ROM Width: 8

An 8-bit program ROM width offers compatibility with simpler, efficiency-driven applications.

No. of I/O Lines: 26

With 26 I/O lines, it provides significant interfacing options, supporting a wide variety of input/output peripherals.

Technical Specifications

Microcontrollers STM8L101G3U6A attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

8

CPU Family:

STM8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N28

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

26

No. of Terminals:

28

No. of Timers:

5

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC28,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

RAM Bytes:

1536

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

3.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI, USART

Peripherals:

COMPARATOR(2), POR, TIMER(5)

Trade Compliance

STM8L101G3U6A Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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