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STM8L101G2U6TR

STMicroelectronics

STM8L101G2U6TR by STMicroelectronics

STM8L101G2U6TR microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 16 MHz, operating voltage range of 1.65-3.6 V, and 28 terminals. Ideal for industrial applications, it supports I2C, SPI, and USART connectivity. With low power consumption (max 3.5 mA), it's perfect for energy-efficient designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,600 parts In-Stock

1+ parts

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6,600

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Digiode

USA . 4,150 parts In-Stock

1+ parts

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1k+ parts

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4,150

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Anansix

USA . 2,036 parts In-Stock

1+ parts

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2,036

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,161 parts In-Stock

1+ parts

$0.610

100+ parts

-

1k+ parts

-

10k+ parts

-

1,161

$0.610

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Microchip USA

USA . 5,180 parts In-Stock

1+ parts

$5.934

100+ parts

-

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10k+ parts

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5,180

$5.934

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AZTECH Wire

Italy . 1,129 parts In-Stock

1+ parts

$9.910

100+ parts

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1,129

$9.910

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IDEA Electronic Components Group

UK . 1,709 parts In-Stock

1+ parts

$19.774

100+ parts

-

1k+ parts

$17.796

10k+ parts

-

1,709

$19.774

-

$17.796

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MKK Technologies

India . 862 parts In-Stock

1+ parts

$37.183

100+ parts

-

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862

$37.183

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DigiPath Technology Company

USA . 862 parts In-Stock

1+ parts

$37.183

100+ parts

-

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862

$37.183

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Corphita

USA . 1,375 parts In-Stock

1+ parts

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1,375

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Parana Technologies

USA . 1,017 parts In-Stock

1+ parts

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100+ parts

$23.642

1k+ parts

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1,017

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$23.642

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Overview

Unlock endless possibilities with the STM8L101G2U6TR microcontroller from STMicroelectronics, a leader in innovation and quality. Designed for energy efficiency and versatility, this compact powerhouse excels in various applications—from industrial automation to smart home devices. Benefit from its robust performance, low power consumption, and reliable operation in extreme conditions. Elevate your projects with a trusted brand that ensures future-proof solutions tailored to meet your needs!

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into modern electronic circuits.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this microcontroller is versatile for low-power applications.

Package Shape: SQUARE

The square package shape offers an efficient use of PCB space, making it ideal for high-density designs.

Bit Size: 8

An 8-bit architecture provides a good balance between performance and power consumption, suitable for many applications.

Power Supplies (V): 1.8/3.3

Supports a range of power supply voltages, making it flexible for different system requirements.

No. of Terminals: 28

28 terminals offer versatility in I/O connectivity, allowing for more peripherals and functionalities.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

The thin profile of this chip carrier allows for easy integration in applications where space is constrained.

Minimum Supply Voltage: 1.65 V

This low minimum supply voltage allows for operation in battery-powered devices for extended battery life.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications where equipment may be exposed to higher temperatures.

CPU Family: STM8

Belongs to a well-regarded CPU family known for reliability and performance in embedded applications.

Minimum Operating Temperature: -40 °C

The ability to operate at sub-zero temperatures makes this microcontroller ideal for extreme environments.

Terminal Finish: MATTE TIN

Matte tin terminal finish promotes better solderability, resulting in reliable assembly quality.

Terminal Position: QUAD

Quad terminal positioning maximizes PCB layout efficiency, allowing a more effective design.

ROM Words: 4096

A ROM capacity of 4096 words provides ample space for program storage, enhancing the device's functionalities.

Maximum Seated Height: 0.6 mm

Low height allows for compact designs, essential in portable electronic devices.

Width: 4 mm

Compact width is advantageous for space-constrained applications, enabling compact layout on PCBs.

Peripherals: COMPARATOR(2), POR, TIMER(5)

Rich peripheral set enhances the microcontroller’s capability to handle diverse tasks efficiently.

Maximum Clock Frequency: 16 MHz

16 MHz clock frequency provides a good balance of performance for prompt execution of tasks.

Maximum Time At Peak Reflow Temperature (s): 40

Allows compatibility with standard soldering techniques, ensuring reliable manufacturability.

Peak Reflow Temperature °C: 260

High reflow temperature tolerance supports modern assembly processes, improving production efficiency.

Length: 4 mm

Compact length aids in miniaturized design approaches for modern portable electronics.

Temperature Grade: INDUSTRIAL

Designed for industrial grade conditions, ensuring reliability in challenging settings.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture optimizes performance and efficiency, suitable for a variety of applications.

No. of Timers: 5

Multiple timers offer enhanced functionalities for time-sensitive applications like motor control.

RAM Bytes: 1536

Adequate RAM supports complex applications and algorithms, enhancing performance.

Technology: CMOS

CMOS technology ensures low power consumption and high performance, making it suitable for battery-operated devices.

Terminal Form: NO LEAD

No lead terminal form improves environmental compliance and reduces solder joint failures.

Maximum Supply Current: 3.5 mA

Low supply current is crucial for energy-efficient designs, extending battery life in portable applications.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3 V optimizes overall power consumption for improved energy efficiency.

PWM Channels: YES

PWM capability allows for advanced control in applications like motor control and LED dimming.

Connectivity: I2C, SPI, USART

Multiple communication protocols ensure versatile integration with various sensors and peripherals.

ROM Programmability: FLASH

Flash ROM programmability offers easy updates and flexibility in firmware enhancements.

Terminal Pitch: 0.5 mm

A small terminal pitch is crucial for high-density PCBs, enabling compact designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates certain handling requirements, ensuring the device's reliability in humid environments.

Speed: 16 rpm

Suitable for low-speed applications where high torque is required, like in certain robotic systems.

On Chip Program ROM Width: 8

8-bit program width optimizes performance for various control applications.

No. of I/O Lines: 26

26 I/O lines offer substantial interfacing capabilities for various external devices and sensors.

Technical Specifications

Microcontrollers STM8L101G2U6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

8

CPU Family:

STM8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N28

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

26

No. of Terminals:

28

No. of Timers:

5

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC28,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

RAM Bytes:

1536

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

3.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI, USART

Peripherals:

COMPARATOR(2), POR, TIMER(5)

Trade Compliance

STM8L101G2U6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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