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STM8L101F2P3TR

STMicroelectronics

STM8L101F2P3TR by STMicroelectronics

STM8L101F2P3TR from STMicroelectronics is an 8-bit microcontroller ideal for automotive applications, featuring a max supply voltage of 3.6V and operating temp range of -40 °C to 125°C. It offers 4096 words of Flash ROM and supports I2C, SPI, and USART connectivity. With 18 I/O lines and six timers, it’s perfect for efficient control in embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,559 parts In-Stock

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8,559

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Anansix

USA . 2,767 parts In-Stock

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2,767

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Digiode

USA . 2,106 parts In-Stock

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2,106

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 3,000 parts In-Stock

1+ parts

$0.670

100+ parts

-

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3,000

$0.670

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Microchip USA

USA . 4,109 parts In-Stock

1+ parts

$5.625

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4,109

$5.625

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Component Stockers USA

USA . 2,938 parts In-Stock

1+ parts

$12.990

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2,938

$12.990

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AZTECH Wire

Italy . 624 parts In-Stock

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$16.900

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624

$16.900

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IDEA Electronic Components Group

UK . 2,212 parts In-Stock

1+ parts

$49.744

100+ parts

-

1k+ parts

$44.770

10k+ parts

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2,212

$49.744

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$44.770

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MKK Technologies

India . 655 parts In-Stock

1+ parts

$93.541

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655

$93.541

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DigiPath Technology Company

USA . 655 parts In-Stock

1+ parts

$93.541

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655

$93.541

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Corphita

USA . 3,362 parts In-Stock

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3,362

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Parana Technologies

USA . 1,958 parts In-Stock

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$59.477

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1,958

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$59.477

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Overview

Elevate your designs with the STM8L101F2P3TR microcontroller from STMicroelectronics, a leader in innovation and quality. Engineered for efficiency in automotive applications, this compact powerhouse delivers exceptional performance at low power, ensuring reliability in demanding environments. Its versatile connectivity options and integrated peripherals make it ideal for smart devices and IoT solutions. Trust in ST's legacy of excellence to unlock unparalleled value and drive your projects forward.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and resistance to environmental factors, making this microcontroller suitable for various applications.

Surface Mount: YES

Being surface mount allows easier integration into compact PCBs, facilitating miniaturization in electronic designs.

Maximum Supply Voltage: 3.6 V

The 3.6 V maximum supply voltage aligns with low-power design requirements, making it safe for battery-operated devices.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient space utilization on circuit boards, optimizing layout designs.

Bit Size: 8

An 8-bit architecture is suitable for a wide range of applications that do not require extensive processing power.

No. of Terminals: 20

With 20 terminals, this microcontroller offers a good balance of I/O lines for various interfacing needs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This package style is ideal for space-constrained applications, facilitating designs in compact devices.

Minimum Supply Voltage: 1.65 V

A low minimum supply voltage increases compatibility with battery-powered systems and enhances energy efficiency.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature makes it suitable for automotive and industrial applications requiring high reliability.

CPU Family: ST8

The ST8 CPU family is known for its efficiency and suitability in embedded applications.

Minimum Operating Temperature: -40 °C

The ability to operate in extreme temperatures ensures reliability in harsh environments, making it ideal for automotive use.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish enhances solderability and corrosion resistance, resulting in improved long-term reliability.

Terminal Position: DUAL

Dual terminal positioning aids in versatile PCB layout options and better connectivity.

ROM Words: 4096

With 4096 ROM words, it provides sufficient memory for storing application-specific programs.

Maximum Seated Height: 1.2 mm

A low seated height helps with low-profile device designs, supporting compact electronic products.

Width: 4.4 mm

A narrow width allows for effective use of PCB space, making it fit well in tight layouts.

Peripherals: COMPARATOR(2), POR, TIMER(6)

Integrated peripherals like timers and comparators enable advanced functionalities without the need for external components.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz allows for reasonable processing capability, suitable for basic control tasks.

Length: 6.5 mm

The short length contributes to space-efficient designs in compact applications.

Temperature Grade: AUTOMOTIVE

Being rated for automotive use ensures the microcontroller adheres to stringent reliability and performance standards.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances performance with lower power consumption, making it effective for embedded applications.

No. of Timers: 6

Multiple timers provide versatile options for event timing and scheduling in applications, enhancing control capabilities.

RAM Bytes: 1536

The ample RAM allows for efficient data handling and temporary variable storage in software applications.

Technology: CMOS

CMOS technology leads to lower power usage, contributing to longer battery life in portable devices.

Terminal Form: GULL WING

Gull wing terminals enhance soldering efficiency and reliability during assembly.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V supports low-power designs, making it ideal for energy-efficient applications.

PWM Channels: YES

PWM capability enables efficient control of motors and other devices, making it suitable for a variety of applications.

Connectivity: I2C, SPI, USART

Multiple connectivity options facilitate easy interfacing with other components, enhancing design flexibility.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to the firmware, increasing the longevity of the product.

Terminal Pitch: 0.65 mm

The smaller terminal pitch allows for denser layouts, making it suitable for modern electronic designs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates a moderate sensitivity and provides guidance for handling, ensuring long-term reliability.

Speed: 16 rpm

The specified speed is suitable for various low-speed applications, particularly in motor control scenarios.

On Chip Program ROM Width: 8

An 8-bit program ROM width contributes to efficient code execution for simple control applications.

No. of I/O Lines: 18

With 18 I/O lines, it provides flexibility for interfacing with multiple peripherals and sensors.

Technical Specifications

Microcontrollers STM8L101F2P3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

18

No. of Terminals:

20

No. of Timers:

6

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

RAM Bytes:

1536

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI, USART

Peripherals:

COMPARATOR(2), POR, TIMER(6)

Trade Compliance

STM8L101F2P3TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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