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STM8L101F2P3

STMicroelectronics

STM8L101F2P3 by STMicroelectronics

STM8L101F2P3 microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 16 MHz, operating voltage range of 1.65-3.6 V, and up to 18 I/O lines. It's ideal for automotive applications due to its -40 °C to 125°C temp grade. With integrated peripherals like timers and communication interfaces, it supports versatile designs.

Median Price

$2.620

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 239 parts In-Stock

1+ parts

$2.620

100+ parts

$1.250

1k+ parts

$0.821

10k+ parts

$0.789

239

$2.620

$1.250

$0.821

$0.789

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,046 parts In-Stock

1+ parts

$1.634

100+ parts

-

1k+ parts

-

10k+ parts

-

2,046

$1.634

-

-

-

Vyrian

USA . 2,190 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,190

-

-

-

-

Anansix

USA . 1,626 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,626

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 5,267 parts In-Stock

1+ parts

$0.690

100+ parts

-

1k+ parts

-

10k+ parts

-

5,267

$0.690

-

-

-

Corphita

USA . 907 parts In-Stock

1+ parts

$1.548

100+ parts

-

1k+ parts

-

10k+ parts

-

907

$1.548

-

-

-

Microchip USA

USA . 2,494 parts In-Stock

1+ parts

$5.981

100+ parts

-

1k+ parts

-

10k+ parts

-

2,494

$5.981

-

-

-

IDEA Electronic Components Group

UK . 754 parts In-Stock

1+ parts

$49.409

100+ parts

-

1k+ parts

$44.468

10k+ parts

-

754

$49.409

-

$44.468

-

MKK Technologies

India . 540 parts In-Stock

1+ parts

$92.910

100+ parts

-

1k+ parts

-

10k+ parts

-

540

$92.910

-

-

-

DigiPath Technology Company

USA . 540 parts In-Stock

1+ parts

$92.910

100+ parts

-

1k+ parts

-

10k+ parts

-

540

$92.910

-

-

-

Parana Technologies

USA . 2,174 parts In-Stock

1+ parts

-

100+ parts

$59.076

1k+ parts

-

10k+ parts

-

2,174

-

$59.076

-

-

Overview

Elevate your designs with the STM8L101F2P3 microcontroller from STMicroelectronics, a trusted leader in innovation and quality. This compact yet powerful 8-bit solution excels in automotive applications, offering robust performance in extreme conditions. With its energy-efficient design and versatile connectivity options, it empowers developers to create smarter, reliable products while reducing time-to-market. Experience unmatched value and reliability that only STMicroelectronics can deliver!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy packaging provides durability and protection from environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a compact design and efficient use of PCB space, making the product ideal for modern electronics.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with a wide range of low-voltage applications, enhancing its usability.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easy integration into various circuit layouts, adding to design flexibility.

Bit Size: 8

An 8-bit architecture is ideal for simple control tasks and offers efficient resource utilization for many embedded applications.

No. of Terminals: 20

With 20 terminals, this microcontroller provides ample I/O options for interfacing with various peripherals and sensors.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The slim profile and small outline enable high-density PCB designs, making it suitable for space-constrained applications.

Minimum Supply Voltage: 1.65 V

A low minimum supply voltage allows for operation in battery-powered devices, extending battery life.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature makes this microcontroller suitable for automotive and industrial applications.

CPU Family: ST8

The ST8 CPU family is known for its performance and efficiency, making it a reliable choice for control and automation tasks.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C makes it suitable for extreme environmental conditions, particularly in automotive applications.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish ensures excellent conductivity and corrosion resistance, enhancing signal integrity and reliability.

Terminal Position: DUAL

Dual terminal position improves access for soldering and connectivity, simplifying assembly and maintenance processes.

ROM Words: 4096

4KB of ROM provides sufficient memory for storing application code, increasing the functionality of the microcontroller.

Maximum Seated Height: 1.2 mm

A low seated height allows for compact designs and can help in achieving slimmer product profiles.

Width: 4.4 mm

The narrow width contributes to board-level space-saving, essential for dense PCB layouts.

Peripherals: COMPARATOR(2), POR, TIMER(6)

Multiple integrated peripherals enhance functionality, reducing the need for external components and saving costs.

Maximum Clock Frequency: 16 MHz

A clock frequency of 16 MHz provides good processing power for various control applications without excessive power consumption.

Length: 6.5 mm

Short length aids in the design of compact devices while improving layout/layout flexibility on PCBs.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, it meets stringent reliability and temperature requirements essential for vehicle environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient instruction execution, making the microcontroller suitable for high-performance embedded applications.

No. of Timers: 6

Having multiple timers enables advanced timing control and scheduling in applications requiring precision and efficiency.

RAM Bytes: 1536

1.5KB of RAM is sufficient for handling intermediate data processing, enabling smoother operation of applications.

Technology: CMOS

CMOS technology allows for low power consumption, which is critical for battery-operated devices, extending device lifespan.

Terminal Form: GULL WING

Gull-wing terminals provide a strong mechanical connection and are easy to solder, improving manufacturing reliability.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V matches standard logic levels, simplifying power supply design for engineers.

PWM Channels: YES

Having PWM channels enables the control of motors and other analog devices, enhancing the microcontroller's versatility.

Connectivity: I2C, SPI, USART

Multiple connectivity options allow seamless interfacing with various peripherals, enhancing the system's expandability.

ROM Programmability: FLASH

Flash programmability allows for easy and fast updates of the microcontroller firmware, reducing development time.

Terminal Pitch: 0.65 mm

0.65 mm terminal pitch supports fine-pitch designs, accommodating high-density connections in compact spaces.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating allows for limited exposure to moisture without degradation, essential for long-term reliability.

Speed: 16 rpm

The operating speed of 16 rpm is suitable for applications where moderate responsiveness is required, such as motor control.

On Chip Program ROM Width: 8

An 8-bit program ROM width is efficient for many embedded applications, enhancing data processing capabilities.

No. of I/O Lines: 18

With 18 I/O lines, it offers ample flexibility for interfacing numerous peripherals, which is valuable in complex applications.

Technical Specifications

Microcontrollers STM8L101F2P3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

18

No. of Terminals:

20

No. of Timers:

6

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

RAM Bytes:

1536

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI, USART

Peripherals:

COMPARATOR(2), POR, TIMER(6)

Trade Compliance

STM8L101F2P3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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