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STM8AL3LE8ATAY

STMicroelectronics

STM8AL3LE8ATAY by STMicroelectronics

STM8AL3LE8ATAY from STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 3.6V and operates at up to 16 MHz. It features ADC and DMA channels, making it ideal for embedded applications requiring efficient data processing. Its compact FLATPACK design suits space-constrained environments.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,865 parts In-Stock

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8,865

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Anansix

USA . 2,313 parts In-Stock

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2,313

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Digiode

USA . 1,523 parts In-Stock

1+ parts

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1,523

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 706 parts In-Stock

1+ parts

$8.100

100+ parts

-

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706

$8.100

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IDEA Electronic Components Group

UK . 714 parts In-Stock

1+ parts

$25.832

100+ parts

-

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$23.249

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714

$25.832

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$23.249

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Microchip USA

USA . 1,448 parts In-Stock

1+ parts

$27.178

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1,448

$27.178

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MKK Technologies

India . 1,412 parts In-Stock

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$48.575

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1,412

$48.575

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DigiPath Technology Company

USA . 1,412 parts In-Stock

1+ parts

$48.575

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1,412

$48.575

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Vigor

Singapore . 2,000 parts In-Stock

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2,000

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Parana Technologies

USA . 1,963 parts In-Stock

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$30.886

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1,963

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$30.886

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Corphita

USA . 393 parts In-Stock

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393

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Overview

Elevate your projects with the STM8AL3LE8ATAY microcontroller from STMicroelectronics. Renowned for its superior quality and reliability, this versatile 8-bit gem thrives in diverse applications, from industrial automation to consumer electronics. Designed for efficiency with low power consumption, it empowers developers to create innovative solutions that stand out in today's competitive market. Experience the unmatched performance and support from a leading manufacturer dedicated to driving your success!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for easy integration into compact circuit boards, making this microcontroller ideal for space-constrained applications.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with a wide range of electronic components and systems, enhancing its versatility.

Package Shape: SQUARE

The square package shape facilitates efficient layout and design on PCBs, optimizing space usage.

Bit Size: 8

The 8-bit architecture is suitable for simple control applications, offering a good balance of performance and power for many embedded systems.

No. of Terminals: 80

With 80 terminals, this microcontroller provides ample connectivity options for interfacing with various peripherals and components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low-profile design minimizes the height of the assembly, making it appropriate for portable and embedded applications.

Minimum Supply Voltage: 1.8 V

A minimum supply voltage of 1.8 V allows for low-power operation, contributing to energy efficiency in battery-powered designs.

ADC Channels: YES

Integrated ADC channels provide the capability to perform analog-to-digital conversions, making it suitable for applications that require sensor interfacing.

DMA Channels: YES

DMA channels enable efficient data transfer without CPU intervention, enhancing performance in data-heavy applications.

Terminal Position: QUAD

The quad terminal positioning allows for easy soldering and reliable connections, enhancing manufacturing rate and reliability.

Width: 12 mm

A compact width of 12 mm contributes to saving real estate on PCBs, making this microcontroller suitable for various designs.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz enables responsive performance for real-time processing needs in applications.

Length: 12 mm

With a length of 12 mm, the microcontroller maintains a compact footprint, supported by the square package shape.

Peripheral IC Type: MICROCONTROLLER

As a dedicated microcontroller, it is designed for control and automation tasks, providing essential features required for embedded systems.

Technology: CMOS

CMOS technology allows for lower power consumption and heat generation, making it ideal for battery-operated devices.

Terminal Form: GULL WING

The gull wing terminal form enables efficient soldering processes, improving assembly speed and reliability.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V strikes a balance between performance and power consumption, ideal for various applications.

PWM Channels: YES

Having PWM channels allows precise control of motors and lights, enhancing the functionality for various applications such as robotics.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch provides a fine connection density, permitting more functionality in a compact design.

Speed: 16 rpm

Although primarily focused on microcontroller functions, the specified speed indicates potential use in low-speed motor applications.

No. of I/O Lines: 68

With 68 I/O lines, this microcontroller supports extensive interfacing capabilities for various peripherals, boosting its application range.

Technical Specifications

Microcontrollers STM8AL3LE8ATAY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

16 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

12 mm

No. of I/O Lines:

68

No. of Terminals:

80

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Peripheral IC Type:

Trade Compliance

STM8AL3LE8ATAY Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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