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STM8AL3LE8ATAX

STMicroelectronics

STM8AL3LE8ATAX by STMicroelectronics

STM8AL3LE8ATAX microcontroller from STMicroelectronics features an 8-bit architecture, operates b/w 1.8V and 3.6V, and supports up to 16 MHz clock frequency. With 80 terminals and integrated ADC/DMA channels, it's ideal for compact embedded applications. Its low-profile design ensures efficient space utilization in various devices.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,506 parts In-Stock

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Digiode

USA . 3,288 parts In-Stock

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3,288

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Anansix

USA . 706 parts In-Stock

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706

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Distributors (Availability)

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AZTECH Wire

Italy . 295 parts In-Stock

1+ parts

$9.160

100+ parts

-

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-

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-

295

$9.160

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$18.753

100+ parts

$17.065

1k+ parts

$15.377

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-

3,000

$18.753

$17.065

$15.377

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Microchip USA

USA . 3,513 parts In-Stock

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$22.921

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3,513

$22.921

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Component Stockers USA

USA . 1,501 parts In-Stock

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$54.220

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$54.220

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IDEA Electronic Components Group

UK . 1,166 parts In-Stock

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$55.592

100+ parts

-

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$50.033

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1,166

$55.592

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$50.033

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MKK Technologies

India . 285 parts In-Stock

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$104.537

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285

$104.537

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DigiPath Technology Company

USA . 285 parts In-Stock

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$104.537

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285

$104.537

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Corphita

USA . 3,239 parts In-Stock

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Vigor

Singapore . 1,710 parts In-Stock

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1,710

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Parana Technologies

USA . 31 parts In-Stock

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$66.469

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31

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$66.469

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Overview

Unlock the power of innovation with the STM8AL3LE8ATAX microcontroller from STMicroelectronics, a trusted leader in cutting-edge technology. This high-performance, low-power solution excels in diverse applications, from smart home devices to industrial automation, providing unmatched reliability and efficiency. With exceptional connectivity and versatility, it empowers your projects to thrive while ensuring quality that stands the test of time. Elevate your designs today and experience the difference!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for compact and efficient use of PCB space, making it ideal for modern electronic applications.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with a wide range of power sources, enhancing versatility in applications.

Package Shape: SQUARE

The square package shape aids in efficient layout on the PCB, allowing for optimized space usage and performance.

Bit Size: 8

An 8-bit architecture is suitable for simple applications requiring low power consumption and reduced complexity.

No. of Terminals: 80

With 80 terminals, this microcontroller offers ample connectivity options for peripherals and other components in your design.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

A low-profile flatpack design reduces overall height, making it suitable for space-constrained applications.

Minimum Supply Voltage: 1.8 V

The ability to operate at a minimum supply voltage of 1.8 V enhances flexibility in battery-operated devices.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides reliable solderability and good performance in assembly processes.

ADC Channels: YES

The presence of ADC channels allows for analog signal processing, making this microcontroller suitable for sensor applications.

DMA Channels: YES

DMA channels facilitate direct memory access for efficient data handling, improving performance in data-intensive applications.

Terminal Position: QUAD

Quad terminal positioning offers increased stability and ease of soldering on the PCB.

Width: 12 mm

A 12 mm width strikes a balance between compactness and ease of handling during assembly.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz ensures adequate processing power for a variety of tasks and applications.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C indicates compatibility with standard soldering processes, ensuring robust assembly.

Length: 12 mm

With a uniform length of 12 mm, the design is suitable for densified PCB layouts.

Peripheral IC Type: MICROCONTROLLER

Identifying its type as a microcontroller highlights its primary role in embedded systems and control applications.

Technology: CMOS

CMOS technology ensures low power consumption while providing high-speed performance, making it efficient for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and assembly, reducing production time.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3 V is convenient for a variety of battery and power supply options.

PWM Channels: YES

PWM channels enable precise control of motors and LED brightness, making this microcontroller versatile for various applications.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for higher density layouts on PCBs, optimizing space without compromising performance.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates reasonable handling for moisture-sensitive environments, promoting longevity and reliability in various conditions.

Speed: 16 rpm

A speed rating of 16 rpm is suitable for applications requiring moderate motion control, such as robotics or automation.

No. of I/O Lines: 68

With 68 I/O lines, this microcontroller supports extensive interfacing options for sensors, actuators, and communication modules.

Technical Specifications

Microcontrollers STM8AL3LE8ATAX attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

16 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-609 Code:

e3

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

68

No. of Terminals:

80

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Peripheral IC Type:

Trade Compliance

STM8AL3LE8ATAX Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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