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STM8AL3LE89TCY

STMicroelectronics

STM8AL3LE89TCY by STMicroelectronics

STM8AL3LE89TCY microcontroller from STMicroelectronics features a 16 MHz clock, operates b/w 1.8V and 3.6V, and includes ADC & PWM channels. Its compact 10x10 mm flatpack design with 64 terminals makes it ideal for space-constrained applications. Perfect for embedded systems requiring efficient processing and control.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,646 parts In-Stock

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5,646

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Anansix

USA . 2,594 parts In-Stock

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2,594

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Digiode

USA . 72 parts In-Stock

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72

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Distributors (Availability)

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Vigor

Singapore . 1,989 parts In-Stock

1+ parts

$2.230

100+ parts

-

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-

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1,989

$2.230

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AZTECH Wire

Italy . 950 parts In-Stock

1+ parts

$17.900

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950

$17.900

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Microchip USA

USA . 2,914 parts In-Stock

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$21.134

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2,914

$21.134

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IDEA Electronic Components Group

UK . 1,884 parts In-Stock

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$40.565

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$36.508

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1,884

$40.565

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$36.508

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Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$44.591

100+ parts

$40.578

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$36.565

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-

200

$44.591

$40.578

$36.565

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MKK Technologies

India . 1,694 parts In-Stock

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$76.279

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1,694

$76.279

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DigiPath Technology Company

USA . 1,694 parts In-Stock

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$76.279

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1,694

$76.279

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Parana Technologies

USA . 1,076 parts In-Stock

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$48.501

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1,076

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$48.501

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Corphita

USA . 674 parts In-Stock

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674

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Overview

Unlock innovation with the STM8AL3LE89TCY microcontroller from STMicroelectronics, a leader in cutting-edge technology. Designed for versatility and efficiency, this low-power 8-bit powerhouse excels in applications ranging from home automation to industrial control. Its robust performance, combined with ST's renowned quality assurance, ensures you achieve reliable results while optimizing energy consumption. Experience seamless integration, superior functionality, and the peace of mind that comes with choosing a trusted manufacturer. Elevate your projects today!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for compact and efficient PCB layouts, making the product ideal for space-constrained applications.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6V provides flexibility for various power supply designs, ensuring compatibility with a wide range of systems.

Package Shape: SQUARE

The square package shape is geomatrically efficient, optimizing layout and minimizing board space usage.

Bit Size: 8

An 8-bit architecture is sufficient for many embedded applications, offering a balance between complexity and performance.

No. of Terminals: 64

With 64 terminals, this microcontroller offers plenty of connectivity options, suitable for numerous input/output configurations.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low-profile fine-pitch design enables high-density packaging, essential for modern compact electronics.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage allows for energy-efficient designs, extending battery life in portable applications.

ADC Channels: YES

Analog-to-Digital Converter (ADC) channels facilitate the microcontroller's ability to process real-world analog signals, enhancing its versatility.

DMA Channels: YES

Direct Memory Access (DMA) channels improve data transfer efficiency, freeing up CPU resources for other tasks and improving overall performance.

Terminal Position: QUAD

Quad terminal positioning enhances soldering reliability and electrical performance in PCB assembly.

Width: 10 mm

A width of 10 mm is standard for many applications, making this microcontroller easy to integrate into existing designs.

Maximum Clock Frequency: 16 MHz

With a maximum clock frequency of 16 MHz, this microcontroller can handle reasonably complex tasks while maintaining low power consumption.

Length: 10 mm

A 10 mm length contributes to the compact size of the module, making it suitable for small form factor applications.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it combines processing power with peripheral functions, reducing the need for multiple chips in a design.

Technology: CMOS

CMOS technology allows for low power consumption and high noise immunity, making it reliable for a variety of applications.

Terminal Form: GULL WING

Gull wing terminals enable easier soldering and are commonly used in surface mount technology, enhancing manufacturability.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3V allows for compatibility with standard logic levels found in most digital systems.

PWM Channels: YES

Pulse Width Modulation (PWM) channels enable the product to control various analog devices like motors and LEDs, expanding its application.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for a compact layout and efficient usage of PCB real estate.

Speed: 16 rpm

With a speed capability of 16 rpm, this microcontroller can be suited for control applications requiring gradual motion or precise positioning.

No. of I/O Lines: 54

54 I/O lines provide extensive interfacing capabilities, allowing for integration with numerous sensors and actuators in various applications.

Technical Specifications

Microcontrollers STM8AL3LE89TCY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

16 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

10 mm

No. of I/O Lines:

54

No. of Terminals:

64

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

STM8AL3LE89TCY Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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