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STM8AL3LE89TAY

STMicroelectronics

STM8AL3LE89TAY by STMicroelectronics

STM8AL3LE89TAY microcontroller from STMicroelectronics features a 16 MHz clock, operates b/w 1.8V and 3.6V, and includes ADC & PWM channels. Its compact 10x10 mm flatpack design makes it ideal for space-constrained applications in embedded systems. With 64 terminals and 54 I/O lines, it's versatile for various projects.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,471 parts In-Stock

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4,471

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Anansix

USA . 2,416 parts In-Stock

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2,416

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Digiode

USA . 1,550 parts In-Stock

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-

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1,550

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,622 parts In-Stock

1+ parts

$2.070

100+ parts

-

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-

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2,622

$2.070

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Ampacity Inc.

Singapore . 1,420 parts In-Stock

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$12.000

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-

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1,420

$12.000

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AZTECH Wire

Italy . 998 parts In-Stock

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$15.040

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998

$15.040

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Microchip USA

USA . 3,166 parts In-Stock

1+ parts

$19.751

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3,166

$19.751

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IDEA Electronic Components Group

UK . 1,399 parts In-Stock

1+ parts

$36.281

100+ parts

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$32.653

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1,399

$36.281

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$32.653

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Component Stockers USA

USA . 1,616 parts In-Stock

1+ parts

$46.010

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1,616

$46.010

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MKK Technologies

India . 1,568 parts In-Stock

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$68.224

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1,568

$68.224

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DigiPath Technology Company

USA . 1,568 parts In-Stock

1+ parts

$68.224

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1,568

$68.224

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Parana Technologies

USA . 2,312 parts In-Stock

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$43.380

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2,312

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$43.380

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Corphita

USA . 2,016 parts In-Stock

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2,016

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Overview

Unlock limitless innovation with the STM8AL3LE89TAY microcontroller from STMicroelectronics, a leader in high-quality electronic components. Designed for versatility and efficiency, this compact powerhouse enhances your applications with exceptional performance in automation, consumer electronics, and IoT devices. Experience the advantages of reliable operation and advanced features that streamline development, reduce costs, and accelerate time-to-market—empowering your projects to thrive!

Feature Benefit Bullets

Surface Mount: YES

The surface mount capability allows for compact designs, making it ideal for space-constrained applications.

Maximum Supply Voltage: 3.6 V

This voltage range enables compatibility with a wide array of power supply systems.

Package Shape: SQUARE

A square package shape typically allows for easier layout design on PCBs, improving manufacturability.

Bit Size: 8

An 8-bit architecture is suitable for simple control tasks, enhancing efficiency for lightweight applications.

No. of Terminals: 64

Having 64 terminals enables extensive connectivity options for peripherals and I/O devices.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low profile design reduces height in compact applications, while fine pitch enhances pin density for more connections.

Minimum Supply Voltage: 1.8 V

Supporting a low minimum voltage allows this microcontroller to operate in battery-powered applications, extending battery life.

ADC Channels: YES

Included ADC channels enable real-time data acquisition from analog sensors, enhancing versatility in applications.

DMA Channels: YES

DMA channels facilitate efficient data transfer operations, reducing CPU load and improving processing speed.

Terminal Position: QUAD

Quad terminal position provides significant flexibility for PCB layout, allowing for better routing and design optimization.

Width: 10 mm

The 10 mm width allows for compact placements on PCBs while still facilitating easy soldering and mounting.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz offers sufficient processing power for many embedded applications without excessive power consumption.

Length: 10 mm

The compact length is perfect for applications where space is at a premium, such as portable and wearable devices.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it's versatile for a multitude of applications, enabling control and automation tasks.

Technology: CMOS

The CMOS technology ensures low power consumption and high noise immunity, making it suitable for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals provide reliable soldering connections and are widely compatible with many assembly processes.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V is ideal for many modern sensors and devices, promoting synergistic usage in designs.

PWM Channels: YES

With PWM channels, it's capable of controlling motors and other devices with precision, ideal for automation and robotic applications.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for a dense layout, facilitating more compact designs while maintaining reliability.

Speed: 16 rpm

The operational speed of 16 rpm enables effective control for low-speed applications, such as fans and small motors.

No. of I/O Lines: 54

Offering 54 I/O lines provides extensive interfacing possibilities, making it flexible for various complex applications.

Technical Specifications

Microcontrollers STM8AL3LE89TAY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

16 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

10 mm

No. of I/O Lines:

54

No. of Terminals:

64

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

STM8AL3LE89TAY Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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