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STM8AL3LE88TAY

STMicroelectronics

STM8AL3LE88TAY by STMicroelectronics

STM8AL3LE88TAY microcontroller from STMicroelectronics features a 16 MHz clock, operates b/w 1.8V and 3.6V, and includes ADC & PWM channels. Its compact 7x7 mm flatpack design makes it ideal for space-constrained applications in embedded systems. With 41 I/O lines, it's perfect for versatile control tasks.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,596 parts In-Stock

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Vyrian

USA . 4,471 parts In-Stock

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Anansix

USA . 1,173 parts In-Stock

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Vigor

Singapore . 1,745 parts In-Stock

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$1.950

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$1.950

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AZTECH Wire

Italy . 890 parts In-Stock

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$19.460

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890

$19.460

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IDEA Electronic Components Group

UK . 482 parts In-Stock

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$54.695

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$49.225

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482

$54.695

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$49.225

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MKK Technologies

India . 295 parts In-Stock

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$102.850

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295

$102.850

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DigiPath Technology Company

USA . 295 parts In-Stock

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$102.850

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295

$102.850

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QUARKTWIN TECHNOLOGY LTD

USA . 18,933 parts In-Stock

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Microchip USA

USA . 3,424 parts In-Stock

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Parana Technologies

USA . 2,344 parts In-Stock

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$65.396

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$65.396

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Corphita

USA . 1,818 parts In-Stock

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Overview

Unlock innovative possibilities with the STM8AL3LE88TAY microcontroller from STMicroelectronics. Renowned for unparalleled quality, STMicroelectronics delivers a reliable solution that enhances performance in diverse applications—from automotive to industrial control. With its compact design and low power consumption, this versatile microcontroller not only streamlines your development process but also ensures efficient operation, empowering you to create cutting-edge products effortlessly.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for compact design and improved performance in space-constrained applications.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with many low-voltage systems while reducing power consumption.

Package Shape: SQUARE

The square package shape can facilitate improved thermal management and is easier to integrate into PCB layouts.

Bit Size: 8

An 8-bit architecture is suitable for basic control tasks and simple applications where processing power requirements are low.

No. of Terminals: 48

A larger number of terminals provides more options for I/O connections, enabling more complex applications.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack low profile design is optimal for applications with height restrictions, while fine pitch allows for high-density interconnections.

Minimum Supply Voltage: 1.8 V

Operating at a minimum supply voltage of 1.8 V makes it versatile for battery-operated or low-power applications.

ADC Channels: YES

ADC channels allow for analog signal processing, making it suitable for sensor integration in various applications.

DMA Channels: YES

The inclusion of DMA channels enables efficient data transfer without CPU intervention, improving overall system performance.

Terminal Position: QUAD

Quad terminal position offers flexible PCB layout options and enhances solderability for reliable connections.

Width: 7 mm

A compact width of 7 mm is ideal for fitting in limited spaces, making it well-suited for portable devices.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz provides sufficient processing speed for many real-time applications.

Length: 7 mm

A length of 7 mm contributes to the compact form factor, facilitating integration into space-constrained designs.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it can handle various control tasks, making it suitable for embedded systems.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, providing reliable operation.

Terminal Form: GULL WING

Gull-wing terminals offer easy soldering, enhancing the manufacturability and reliability of connections.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V balances power efficiency and performance, suitable for battery-powered applications.

PWM Channels: YES

PWM channels enable precise control of motor speeds and light dimming, making it versatile for automation tasks.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high-density designs, maximizing the use of available PCB space.

Speed: 16 rpm

A speed rating of 16 rpm indicates suitability for low-speed control applications, such as in robotics or actuators.

No. of I/O Lines: 41

Having 41 I/O lines allows for extensive interfacing options, making it flexible for diverse applications.

Technical Specifications

Microcontrollers STM8AL3LE88TAY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

16 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

7 mm

No. of I/O Lines:

41

No. of Terminals:

48

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM8AL3LE88TAY Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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