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STM8AL3L89TCY

STMicroelectronics

STM8AL3L89TCY by STMicroelectronics

STM8AL3L89TCY microcontroller from STMicroelectronics features a 16 MHz clock, operates b/w 1.8V and 3.6V, and includes ADC and PWM channels. Its compact 10x10 mm flatpack design makes it ideal for space-constrained applications. This versatile MCU is perfect for embedded systems requiring efficient processing and control.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,446 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,446

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-

-

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Anansix

USA . 2,496 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,496

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-

-

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Digiode

USA . 1,509 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

1,509

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,642 parts In-Stock

1+ parts

$2.120

100+ parts

-

1k+ parts

-

10k+ parts

-

1,642

$2.120

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-

-

AZTECH Wire

Italy . 64 parts In-Stock

1+ parts

$8.240

100+ parts

-

1k+ parts

-

10k+ parts

-

64

$8.240

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-

-

Microchip USA

USA . 2,215 parts In-Stock

1+ parts

$19.829

100+ parts

-

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2,215

$19.829

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-

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IDEA Electronic Components Group

UK . 961 parts In-Stock

1+ parts

$43.645

100+ parts

-

1k+ parts

$39.280

10k+ parts

-

961

$43.645

-

$39.280

-

MKK Technologies

India . 538 parts In-Stock

1+ parts

$82.071

100+ parts

-

1k+ parts

-

10k+ parts

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538

$82.071

-

-

-

DigiPath Technology Company

USA . 538 parts In-Stock

1+ parts

$82.071

100+ parts

-

1k+ parts

-

10k+ parts

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538

$82.071

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Corphita

USA . 3,413 parts In-Stock

1+ parts

-

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3,413

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Parana Technologies

USA . 1,432 parts In-Stock

1+ parts

-

100+ parts

$52.184

1k+ parts

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1,432

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$52.184

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Overview

Unlock the power of innovation with the STM8AL3L89TCY microcontroller from STMicroelectronics, a leader in high-quality semiconductor solutions. This compact and efficient device is designed for a wide range of applications, from consumer electronics to industrial automation, offering exceptional performance and reliability. With advanced features like multiple ADC and PWM channels, it empowers developers to create smarter, more responsive products, delivering unmatched value and enhancing your projects' potential.

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for compact arrangements, making it ideal for modern, space-constrained applications.

Maximum Supply Voltage: 3.6 V

The ability to operate at a maximum of 3.6 V ensures compatibility with a wide range of power supplies.

Package Shape: SQUARE

A square package shape simplifies layout in PCB design and helps optimize space usage.

Bit Size: 8

An 8-bit architecture suits simple controls and applications, allowing for effective operation in cost-sensitive projects.

No. of Terminals: 64

With 64 terminals, the microcontroller can connect a wide variety of peripherals, expanding design possibilities.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low profile and fine pitch design offers efficient space utilization in compact electronic designs.

Minimum Supply Voltage: 1.8 V

Operating down to 1.8 V allows for low-power applications, which is essential for battery-operated devices.

ADC Channels: YES

The inclusion of ADC channels enables the microcontroller to interface with analog sensors easily.

DMA Channels: YES

DMA capability allows for efficient data transfer and processing, reducing CPU load and enhancing performance.

Terminal Position: QUAD

The quad terminal position provides easy access for PCB traces, simplifying the layout and design.

Width: 10 mm

A 10 mm width ensures compatibility with standard PCB designs while maximizing available space.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz allows for faster processing and execution of instructions.

Length: 10 mm

The compact 10 mm length makes it particularly suitable for tight space applications.

Peripheral IC Type: MICROCONTROLLER

As a dedicated microcontroller, it is optimized for control applications and reduces overall system complexity.

Technology: CMOS

CMOS technology provides high speed and low power consumption, enhancing the efficiency of the device.

Terminal Form: GULL WING

The gull wing terminal form allows for easy soldering and is widely accepted in PCB manufacturing.

Nominal Supply Voltage: 3 V

A nominal voltage of 3 V aligns with common power supply voltages, making integration easier.

PWM Channels: YES

PWM channels facilitate advanced control methods in applications such as motor control and LED dimming.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for a high density of connections, ideal for complex designs.

Speed: 16 rpm

The 16 rpm speed rating indicates suitability for specific applications requiring controlled movement or cycling.

No. of I/O Lines: 54

With 54 I/O lines, the microcontroller can handle multiple inputs and outputs simultaneously, enhancing its versatility.

Technical Specifications

Microcontrollers STM8AL3L89TCY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

16 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

10 mm

No. of I/O Lines:

54

No. of Terminals:

64

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

STM8AL3L89TCY Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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