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STM8AL3L88TCY

STMicroelectronics

STM8AL3L88TCY by STMicroelectronics

STM8AL3L88TCY microcontroller from STMicroelectronics features an 8-bit architecture, operates b/w 1.8V and 3.6V, and supports up to 16 MHz clock frequency. With 41 I/O lines and integrated ADC/DMA channels, it's ideal for compact embedded applications. Its low-profile design ensures efficient space utilization in various devices.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,263 parts In-Stock

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6,263

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Digiode

USA . 2,162 parts In-Stock

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2,162

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Anansix

USA . 846 parts In-Stock

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846

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 4,746 parts In-Stock

1+ parts

$2.050

100+ parts

-

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4,746

$2.050

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Microchip USA

USA . 2,450 parts In-Stock

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$17.742

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2,450

$17.742

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AZTECH Wire

Italy . 994 parts In-Stock

1+ parts

$17.770

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994

$17.770

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IDEA Electronic Components Group

UK . 1,715 parts In-Stock

1+ parts

$51.847

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$46.662

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1,715

$51.847

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$46.662

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MKK Technologies

India . 1,757 parts In-Stock

1+ parts

$97.494

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1,757

$97.494

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DigiPath Technology Company

USA . 1,757 parts In-Stock

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$97.494

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1,757

$97.494

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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6,000

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Corphita

USA . 920 parts In-Stock

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920

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Parana Technologies

USA . 91 parts In-Stock

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$61.990

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91

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$61.990

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Overview

Unlock the potential of your next project with the STM8AL3L88TCY microcontroller from STMicroelectronics. Renowned for its exceptional quality and reliability, this versatile component empowers engineers to design innovative solutions across various applications, from consumer electronics to automotive systems. Its compact size and efficient performance ensure seamless integration, while STMicroelectronics’ commitment to excellence guarantees a trusted foundation for your developments. Choose STM8AL3L88TCY and elevate your designs today!

Feature Benefit Bullets

Surface Mount: YES

The surface mount feature allows for efficient use of PCB space and simplifies the assembly process, making it ideal for compact designs.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with low-power circuits while providing enough headroom for stable operation.

Package Shape: SQUARE

The square package shape optimizes layout possibilities on the PCB, facilitating better thermal performance and more accessible routing.

Bit Size: 8

An 8-bit architecture is well-suited for simple applications, making it a cost-effective choice for basic control tasks.

No. of Terminals: 48

With 48 terminals, this microcontroller offers ample connectivity options for various peripherals and I/O operations.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack and low-profile design reduces space requirements and enhances the component's suitability for compact devices.

Minimum Supply Voltage: 1.8 V

A minimum supply voltage of 1.8 V allows for operation in battery-powered applications, extending battery life significantly.

ADC Channels: YES

Inclusion of ADC channels enables the microcontroller to read analog signals, making it versatile for various sensor integration.

DMA Channels: YES

Dedicated DMA channels allow for more efficient data transfer within the MCU, improving performance in data-heavy applications.

Terminal Position: QUAD

The quad terminal position enhances the ease of mounting and improves routing options on the PCB.

Width: 7 mm

A compact width of 7 mm enables the microcontroller to fit comfortably in space-constrained designs.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz ensures adequate processing power for most general-purpose tasks.

Length: 7 mm

A length of 7 mm contributes to a small footprint, making it an ideal option for portable devices.

Peripheral IC Type: MICROCONTROLLER

As a dedicated microcontroller, this IC is optimized for processing tasks, ensuring high reliability in control applications.

Technology: CMOS

CMOS technology offers low power consumption, making this microcontroller suitable for battery-operated devices.

Terminal Form: GULL WING

Gull-wing terminals facilitate easier soldering processes, which can improve manufacturing efficiencies.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V strikes a fine balance between performance and power consumption.

PWM Channels: YES

The presence of PWM channels makes it excellent for controlling motors and other devices that require pulse-width modulation.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for more terminals within the same area, enhancing connectivity options without increasing size.

Speed: 16 rpm

With a speed of 16 rpm, this microcontroller can efficiently handle most low-speed actuators and motors.

No. of I/O Lines: 41

Having 41 I/O lines offers significant flexibility for interfacing with various components and gives room for complex projects.

Technical Specifications

Microcontrollers STM8AL3L88TCY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

16 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

7 mm

No. of I/O Lines:

41

No. of Terminals:

48

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM8AL3L88TCY Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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