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STM8AL3L48TAY

STMicroelectronics

STM8AL3L48TAY by STMicroelectronics

STM8AL3L48TAY microcontroller from STMicroelectronics features a 16 MHz CPU, operates b/w 1.65V and 3.6V, and supports up to 41 I/O lines. Its AEC-Q100 screening makes it ideal for industrial applications. With integrated ADC and PWM channels, it's perfect for automation tasks.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,433 parts In-Stock

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3,433

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Vyrian

USA . 2,131 parts In-Stock

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2,131

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Anansix

USA . 1,685 parts In-Stock

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1,685

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Distributors (Availability)

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Vigor

Singapore . 4,442 parts In-Stock

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$1.500

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4,442

$1.500

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Microchip USA

USA . 3,857 parts In-Stock

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$12.922

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3,857

$12.922

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AZTECH Wire

Italy . 1,054 parts In-Stock

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$14.330

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1,054

$14.330

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IDEA Electronic Components Group

UK . 156 parts In-Stock

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$73.648

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$66.283

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156

$73.648

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$66.283

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MKK Technologies

India . 1,111 parts In-Stock

1+ parts

$138.490

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1,111

$138.490

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DigiPath Technology Company

USA . 1,111 parts In-Stock

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$138.490

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1,111

$138.490

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Corphita

USA . 2,643 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Parana Technologies

USA . 1,678 parts In-Stock

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$88.057

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$88.057

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Overview

Unlock the potential of your projects with the STM8AL3L48TAY microcontroller from STMicroelectronics, a leader in innovation and quality. Designed for robust performance across diverse applications—from automotive to industrial—the STM8AL3L48TAY offers exceptional reliability and flexibility, ensuring your designs thrive in any environment. With its low power consumption and rich set of features, this microcontroller not only enhances efficiency but also significantly reduces development time, providing unmatched value and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for smaller circuit designs and easier automation in the manufacturing process.

Maximum Supply Voltage: 3.6 V

This allows for flexibility in power supply options while maintaining low power consumption.

Screening Level: AEC-Q100

This qualification ensures reliability and performance in automotive applications.

Package Shape: SQUARE

A square package shape optimizes board space and simplifies layout designs.

Bit Size: 8

The 8-bit architecture is ideal for low-power and cost-sensitive applications.

Power Supplies (V): 2/3.3

Supports multiple voltage levels, making it versatile for different system designs.

No. of Terminals: 48

More terminals provide greater flexibility for interfacing with multiple peripherals.

Package Style (Meter): FLATPACK

Flatpack style is advantageous for low-profile applications, aiding in compact design.

Minimum Supply Voltage: 1.65 V

Wide voltage range caters to various battery and power sources, enhancing compatibility.

Maximum Operating Temperature: 85 °C

High operating temperature range makes it suitable for demanding industrial applications.

CPU Family: STM8

The STM8 family is known for robustness and efficiency, making it a reliable choice for many applications.

Minimum Operating Temperature: -40 °C

This low temperature range ensures reliable operation in extreme environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish enhances solderability and ensures long-term reliability.

ADC Channels: YES

Integrated ADC channels provide superior data acquisition capabilities in embedded applications.

DMA Channels: YES

DMA channels allow for efficient data transfer, improving overall system performance.

Terminal Position: QUAD

Quad terminal positioning enhances connection density while maintaining ease of soldering.

ROM Words: 16384

Ample ROM space allows for complex programs and functionalities to be integrated.

Width: 7 mm

Compact width facilitates integration into space-constrained designs.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz provides sufficient performance for most applications.

Peak Reflow Temperature °C: 260

A high peak reflow temperature supports robust soldering processes, ensuring product quality.

Length: 7 mm

The short length enhances versatility in designing compact electronic systems.

Temperature Grade: INDUSTRIAL

Grade rating ensures that the microcontroller can withstand harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER

Designed specifically as a microcontroller, it integrates well with various peripheral devices.

RAM Bytes: 2048

Generous RAM capacity allows for smoother multitasking and data handling.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminals are widely used for their ease of handling and soldering.

Maximum Supply Current: 80 mA

Low maximum supply current helps in energy-efficient designs, prolonging battery life.

Nominal Supply Voltage: 3 V

A nominal voltage of 3V is standard in many applications, ensuring compatibility.

PWM Channels: YES

Integrated PWM channels enable control of motors and other devices efficiently.

ROM Programmability: FLASH

Flash memory allows for easy updating and reprogramming of the device.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for a higher density of connections, optimizing board real estate.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the part can withstand moderate moisture exposure during handling.

Speed: 16 rpm

The operational speed capability supports a variety of applications, from control systems to automation.

No. of I/O Lines: 41

A high number of I/O lines supports complex interfacing with sensors and other peripherals.

Technical Specifications

Microcontrollers STM8AL3L48TAY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

STM8

Maximum Clock Frequency:

16 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

41

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

16384

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

80 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM8AL3L48TAY Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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