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STM8AL3L46TAY

STMicroelectronics

STM8AL3L46TAY by STMicroelectronics

STM8AL3L46TAY microcontroller from STMicroelectronics features a 16 MHz CPU, operates b/w -40 °C to 85 °C, and supports up to 32 terminals. With AEC-Q100 screening, it's ideal for automotive applications requiring reliability. It offers ADC and PWM channels for versatile control.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,601 parts In-Stock

1+ parts

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6,601

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Digiode

USA . 3,398 parts In-Stock

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3,398

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Anansix

USA . 76 parts In-Stock

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76

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 3,701 parts In-Stock

1+ parts

$1.410

100+ parts

-

1k+ parts

-

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-

3,701

$1.410

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AZTECH Wire

Italy . 423 parts In-Stock

1+ parts

$9.710

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423

$9.710

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Microchip USA

USA . 2,734 parts In-Stock

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$12.617

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2,734

$12.617

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IDEA Electronic Components Group

UK . 1,106 parts In-Stock

1+ parts

$76.551

100+ parts

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$68.896

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1,106

$76.551

-

$68.896

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MKK Technologies

India . 1,279 parts In-Stock

1+ parts

$143.950

100+ parts

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1,279

$143.950

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DigiPath Technology Company

USA . 1,279 parts In-Stock

1+ parts

$143.950

100+ parts

-

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1,279

$143.950

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QUARKTWIN TECHNOLOGY LTD

USA . 8,662 parts In-Stock

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8,662

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Corphita

USA . 3,878 parts In-Stock

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3,878

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Parana Technologies

USA . 1,373 parts In-Stock

1+ parts

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100+ parts

$91.529

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1,373

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$91.529

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Overview

Elevate your projects with the STM8AL3L46TAY microcontroller from STMicroelectronics, renowned for its exceptional quality and reliability. Designed for diverse applications, it excels in automotive and industrial environments, ensuring robust performance under extreme conditions. With an efficient power supply range and integrated peripherals, this versatile MCU streamlines development while delivering remarkable value and benefits, allowing you to focus on innovation without compromise.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and resilience against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient manufacturing processes, making it ideal for modern electronics.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with a wide range of low-power applications while maintaining efficiency.

Screening Level: AEC-Q100

Meeting the AEC-Q100 screening level signifies reliability and robustness, essential for automotive and industrial applications.

Package Shape: SQUARE

The square package shape allows for optimized PCB layout and can accommodate higher I/O connections in a compact space.

Bit Size: 8

An 8-bit architecture is suitable for simple applications, offering adequate processing capabilities while keeping costs low.

Power Supplies (V): 2/3.3

The flexibility in power supply voltages (2V and 3.3V) enhances its adaptability for various circuit designs.

No. of Terminals: 32

Having 32 terminals provides ample connectivity options for interfacing with different peripherals.

Package Style (Meter): FLATPACK

The flatpack style contributes to a low profile design, making it suitable for space-constrained applications.

Minimum Supply Voltage: 1.65 V

A low minimum operating voltage of 1.65 V enables operation in battery-powered applications, extending battery life.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this microcontroller is suitable for a wide range of industrial applications.

CPU Family: STM8

The STM8 CPU family is well-known for its performance and efficiency, providing a robust platform for various applications.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C ensures reliable performance in extreme environmental conditions.

ADC Channels: YES

The inclusion of ADC channels enables the microcontroller to interface with analog signals, allowing for versatile application designs.

DMA Channels: YES

Having DMA channels optimizes data transfer between peripherals, improving overall system performance.

Terminal Position: QUAD

The quad terminal position enhances solderability and thermal performance, ensuring reliable connections in designs.

ROM Words: 16384

With 16384 ROM words, this microcontroller can store a substantial amount of program code, supporting complex applications.

Width: 7 mm

Its compact width of 7 mm is advantageous for fitting within compact electronic assemblies.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz allows the microcontroller to execute instructions at a reasonable speed for various applications.

Length: 7 mm

A length of 7 mm contributes to the microcontroller's small form factor, facilitating use in space-constrained designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures robust performance across a wide temperature range, suitable for demanding environments.

Peripheral IC Type: MICROCONTROLLER

As a peripheral microcontroller, it is versatile and can easily be integrated with other components to create a complete system.

RAM Bytes: 2048

The availability of 2048 bytes of RAM supports complex calculations and temporary data storage during operations.

Technology: CMOS

The use of CMOS technology is known for low power consumption and high noise immunity, making it efficient for various applications.

Terminal Form: GULL WING

The gull-wing terminal form provides reliable mechanical and electrical connections, enhancing the durability of PCB assembly.

Maximum Supply Current: 80 mA

With a maximum supply current of 80 mA, this microcontroller can handle moderate loads while ensuring energy efficiency.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3 V is perfectly tailored for battery-operated systems, supporting longevity and efficiency.

PWM Channels: YES

The availability of PWM channels enables precise control over motors and other actuators, enhancing application versatility.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to firmware, improving flexibility during the development cycle.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm allows for high-density layouts, making it suitable for modern compact electronic designs.

Speed: 16 rpm

With a speed of 16 rpm, this microcontroller can effectively manage time-sensitive applications, such as motor control.

No. of I/O Lines: 29

Having 29 I/O lines provides ample interfacing options for sensors, displays, and other peripherals, promoting design flexibility.

Technical Specifications

Microcontrollers STM8AL3L46TAY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

STM8

Maximum Clock Frequency:

16 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G32

Length:

7 mm

No. of I/O Lines:

29

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

16384

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

80 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM8AL3L46TAY Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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